公开(公告)号：EP2200838A1

公开(公告)日：2010-06-30

申请号：EP08842620.0

申请日：2008-10-23

申请人： E. I. du Pont de Nemours and Company

发明人： GAO, Feng ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  KEYS, Dalen, E. ,  MALAJOVICH, Irina ,  SCHIFFINO, Rinaldo, Soria ,  ZUMSTEG, Fredrick, Claus, JR.

IPC分类号： B41M5/382 ,  B41M5/392 ,  H05K9/00

CPC分类号： B41M5/38207 ,  B41M5/38214 ,  B41M5/392 ,  H05K3/046 ,  H05K3/182 ,  H05K3/207 ,  H05K9/0094 ,  H05K2201/0209 ,  H05K2203/0528 ,  H05K2203/107 ,  Y10T428/24802

摘要： Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.

公开(公告)号：EP2200838B1

公开(公告)日：2011-10-19

申请号：EP08842620.0

申请日：2008-10-23

申请人： E. I. du Pont de Nemours and Company

发明人： GAO, Feng ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  KEYS, Dalen, E. ,  MALAJOVICH, Irina ,  SCHIFFINO, Rinaldo, Soria ,  ZUMSTEG, Fredrick, Claus, JR.

IPC分类号： B41M5/382 ,  B41M5/392 ,  H05K3/04 ,  H05K3/18 ,  H05K9/00

CPC分类号： B41M5/38207 ,  B41M5/38214 ,  B41M5/392 ,  H05K3/046 ,  H05K3/182 ,  H05K3/207 ,  H05K9/0094 ,  H05K2201/0209 ,  H05K2203/0528 ,  H05K2203/107 ,  Y10T428/24802

摘要： Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.

公开(公告)号：EP2201827A1

公开(公告)日：2010-06-30

申请号：EP08842070.8

申请日：2008-10-23

申请人： E. I. du Pont de Nemours and Company

发明人： GAO, Feng ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  MALAJOVICH, Irina ,  METH, Jeffrey, Scott ,  SHARP, Kenneth, George ,  ZUMSTEG JR, Fredrick, Claus ,  AGRAWAL, Seema

IPC分类号： H05K3/04 ,  H05K3/18 ,  H05K9/00 ,  B41M5/382 ,  B41M5/392

CPC分类号： B41M5/38207 ,  B41M5/392 ,  H05K3/046 ,  H05K3/182 ,  H05K3/185 ,  H05K2203/0528 ,  H05K2203/107 ,  H05K2203/1105

摘要： Disclosed is a method negative imaging method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.

公开(公告)号：EP2201827B1

公开(公告)日：2014-04-23

申请号：EP08842070.8

申请日：2008-10-23

申请人： E. I. du Pont de Nemours and Company

发明人： GAO, Feng ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  MALAJOVICH, Irina ,  METH, Jeffrey, Scott ,  SHARP, Kenneth, George ,  ZUMSTEG JR, Fredrick, Claus ,  AGRAWAL, Seema

IPC分类号： H05K3/18 ,  B41M5/382 ,  B41M5/392 ,  H05K3/04

CPC分类号： B41M5/38207 ,  B41M5/392 ,  H05K3/046 ,  H05K3/182 ,  H05K3/185 ,  H05K2203/0528 ,  H05K2203/107 ,  H05K2203/1105

公开(公告)号：EP2041814A2

公开(公告)日：2009-04-01

申请号：EP07872556.1

申请日：2007-07-16

申请人： E. I. Du Pont de Nemours and Company

发明人： ANDREWS, Gerald, Donald ,  BAILEY, Richard, Kevin ,  BLANCHET, Graciela, Beatriz ,  CASPAR, Jonathan, V. ,  CATRON, John, W. ,  CHESTERFIELD, Reid, John ,  FELDER, Thomas, C. ,  GAO, Feng ,  GLICKSMAN, Howard, David ,  GOLDFINGER, Marc, B. ,  HARMER, Mark, Andrew ,  JAYCOX, Gary, Delmar ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  KEYS, Dalen, E. ,  MALAJOVICH, Irina ,  MARSHALL, William, J. ,  MCCORD, Elizabeth, Forrester ,  MCEWEN, Charles, Nehemiah ,  METH, Jeffrey, Scott ,  NUNES, Geoffrey ,  SCHIFFINO, Rinaldo, S. ,  SHANNON, Paul, J. ,  SHARP, Kenneth, George ,  TASSI, Nancy, G. ,  VISSCHER, Karyn, B.

IPC分类号： H01L51/00

CPC分类号： H01L51/0013 ,  H01L51/0545 ,  H05K1/097 ,  H05K3/046 ,  H05K2203/0528 ,  H05K2203/107 ,  Y10T428/24901

摘要： The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

公开(公告)号：EP2432839A1

公开(公告)日：2012-03-28

申请号：EP10720700.3

申请日：2010-05-19

申请人： E. I. Du Pont De Nemours And Company

发明人： GAO, Feng

IPC分类号： C09D11/00 ,  C09D11/10

CPC分类号： C09D11/101 ,  C09D11/34 ,  C09D11/52

摘要： The present invention relates a composition which is useful in printing an electrical conductor on the front surface of a substrate, such as a solar cell. A phase change binder is used to allow printing of narrow grid lines which also may have adequate height to provide sufficient electrical conduction. The present invention is also directed to a process to print a pattern of the composition.