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1.发明授权POLYMER THICK FILM SILVER ELECTRODE COMPOSITION FOR USE AS A PLATING LINK 有权聚合物厚膜银电极组合物中的AS METALLISIERUNGSTINTE
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2.发明公开POLYMER THICK FILM SILVER ELECTRODE COMPOSITION FOR USE AS A PLATING LINK 有权聚合物厚膜银电极组合物中的AS METALLISIERUNGSTINTE
公开(公告)号：EP2481060A1
公开(公告)日：2012-08-01
申请号：EP10757906.2
申请日：2010-09-17
IPC分类号： H01B1/00
摘要： The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium comprising (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.
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3.发明公开POLYMER THICK FILM SILVER ELECTRODE COMPOSITION FOR USE IN THIN-FILM PHOTOVOLTAIC CELLS 无效聚合物厚膜银电极组合物中的在薄膜光伏电池
公开(公告)号：EP2303957A1
公开(公告)日：2011-04-06
申请号：EP09790707.5
申请日：2009-07-22
发明人： DORFMAN, Jay, Robert
IPC分类号： C08K3/08 , H01L31/0224 , C08L71/00
CPC分类号： H01L31/022425 , C08K3/08 , Y02E10/50 , C08L71/00
摘要： The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flake (b) organic medium comprising (1) phenoxy organic polymeric binder and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to method(s) of grid formation on top of Thin-Film photovoltaic cells.
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4.发明授权HIGH CONDUCTIVITY POLYMER THICK FILM SILVER CONDUCTOR COMPOSITION FOR USE IN RFID AND OTHER APPLICATIONS 有权聚合物厚膜银导体组合物，其FOR USE IN RFID和其他应用程序高电导
公开(公告)号：EP2350176B1
公开(公告)日：2012-09-19
申请号：EP09760418.5
申请日：2009-11-23
发明人： DORFMAN, Jay, Robert
CPC分类号： H01Q1/2225 , H05K1/095 , H05K2201/0245
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5.发明授权SOLDERABLE POLYMER THICK FILM CONDUCTIVE ELECTRODE COMPOSITION FOR USE IN THIN-FILM PHOTOVOLTAIC CELLS AND OTHER APPLICATIONS 有权可焊性及导电性聚合物厚膜银电极组合物中的用于薄膜光伏电池和其它应用
公开(公告)号：EP2715741B1
公开(公告)日：2015-07-22
申请号：EP12727970.1
申请日：2012-06-01
发明人： DORFMAN, Jay, Robert
IPC分类号： H01B1/22
CPC分类号： H01L31/022433 , H01B1/22 , H01L31/022425 , Y02E10/50
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6.发明公开SOLDERABLE POLYMER THICK FILM CONDUCTIVE ELECTRODE COMPOSITION FOR USE IN THIN-FILM PHOTOVOLTAIC CELLS AND OTHER APPLICATIONS 有权可焊性及导电性聚合物厚膜银电极组合物中的用于薄膜光伏电池和其它应用
公开(公告)号：EP2715741A1
公开(公告)日：2014-04-09
申请号：EP12727970.1
申请日：2012-06-01
发明人： DORFMAN, Jay, Robert
IPC分类号： H01B1/22
CPC分类号： H01L31/022433 , H01B1/22 , H01L31/022425 , Y02E10/50
摘要： The invention is directed to a polymer thick film conductive composition comprising (a) a conductive silver-coated copper powder; and (b) an organic medium comprising two different resins and organic solvent, wherein the ratio of the weight of the conductive silver-coated copper powder to the total weight of the two different resins is between 5:1 and 45:1. The invention is further directed to a method of electrode grid and/or bus bar formation on thin-film photovoltaic cells using the composition and to cells formed from the method and the composition.
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7.发明公开HIGH CONDUCTIVITY POLYMER THICK FILM SILVER CONDUCTOR COMPOSITION FOR USE IN RFID AND OTHER APPLICATIONS 有权聚合物厚膜银导体组合物，其FOR USE IN RFID和其他应用程序高电导
公开(公告)号：EP2350176A1
公开(公告)日：2011-08-03
申请号：EP09760418.5
申请日：2009-11-23
发明人： DORFMAN, Jay, Robert
CPC分类号： H01Q1/2225 , H05K1/095 , H05K2201/0245
摘要： Disclosed are thick film silver compositions comprised of silver flake and organic medium useful in radio frequency identification devices (RFID). The invention is further directed to method(s) of antenna formation using RFID circuits or other circuits using polymer thick film (PTF).
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9.发明授权
公开(公告)号：EP2758968B1
公开(公告)日：2018-07-04
申请号：EP12769557.5
申请日：2012-09-18
CPC分类号： H01G4/008 , C08G2650/56 , C08K3/08 , C08L71/00 , C08L75/04 , H01B1/22 , H03K17/962 , H03K2017/9602 , H05K1/095 , H05K2201/0129 , H05K2201/0245 , H05K2201/10053
摘要： This invention is directed to a polymer thick film conductive composition. More specifically, the polymer thick film conductive composition may be used in applications where thermoforming of the base substrate occurs as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition.
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公开(公告)号：EP3170188A1
公开(公告)日：2017-05-24
申请号：EP15745018.0
申请日：2015-07-02
发明人： DORFMAN, Jay, Robert
CPC分类号： C09D5/24 , C08K3/08 , C08K2003/0806 , C09D11/52 , C09D127/16 , H01B1/22 , H05K1/095 , H05K2201/0129 , H05K2201/015 , H05K2201/0245 , C08L27/16 , C08K13/02 , C08K5/521
摘要： This invention is directed to a polymer thick film conductor composition that provides a better conductor when dried at 80° C. than when dried at 130° C., in contrast to typical PTF conductors. More specifically, the polymer thick film conductor may be used in applications where low temperature curing is required.
摘要翻译： 本发明涉及一种聚合物厚膜导体组合物，与典型的PTF导体相比，在80℃干燥时比在130℃干燥时提供更好的导体。 更具体地说，聚合物厚膜导体可以用于需要低温固化的应用中。
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