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1.发明授权
公开(公告)号：EP2758968B1
公开(公告)日：2018-07-04
申请号：EP12769557.5
申请日：2012-09-18
CPC分类号： H01G4/008 , C08G2650/56 , C08K3/08 , C08L71/00 , C08L75/04 , H01B1/22 , H03K17/962 , H03K2017/9602 , H05K1/095 , H05K2201/0129 , H05K2201/0245 , H05K2201/10053
摘要： This invention is directed to a polymer thick film conductive composition. More specifically, the polymer thick film conductive composition may be used in applications where thermoforming of the base substrate occurs as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition.
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2.发明公开
公开(公告)号：EP2758968A1
公开(公告)日：2014-07-30
申请号：EP12769557.5
申请日：2012-09-18
CPC分类号： H01G4/008 , C08G2650/56 , C08K3/08 , C08L71/00 , C08L75/04 , H01B1/22 , H03K17/962 , H03K2017/9602 , H05K1/095 , H05K2201/0129 , H05K2201/0245 , H05K2201/10053
摘要： This invention is directed to a polymer thick film conductive composition. More specifically, the polymer thick film conductive composition may be used in applications where thermoforming of the base substrate occurs as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition.
摘要翻译： 本发明涉及聚合物厚膜导电组合物。 更具体地说，聚合物厚膜导电组合物可用于如电容开关中发生基底衬底的热成型的应用中。 聚碳酸酯基材通常用作基材，并且可以使用聚合物厚膜导电组合物而没有任何阻挡层。 可热成型电路从干燥的聚合物厚膜导电组合物上存在密封剂层获益。
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公开(公告)号：EP2754202A1
公开(公告)日：2014-07-16
申请号：EP12751413.1
申请日：2012-08-17
IPC分类号： H01Q1/22 , C08G18/08 , C09J175/00 , H05K3/12 , G06K19/077
CPC分类号： H01Q1/2225 , C08L75/04 , G06K19/02 , G06K19/0723 , H05K1/165 , H05K3/1208 , H05K3/285 , H05K3/386
摘要： This invention is directed to a polymer thick film barrier layer dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive silver antenna above it and the polycarbonate substrate below it in RFID applications.
摘要翻译： 本发明涉及聚合物厚膜阻挡层电介质组合物。 由该组合物制成的电介质可用于各种电子应用中以保护电气元件，特别是在RFID应用中隔离和保护位于其上方的导电银天线和位于其下方的聚碳酸酯衬底。
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