摘要:
A manufacturing process for printing heads (50) which integrates many nozzles into a single monolithic silicon structure. The nozzles (200) are etched through the silicon substrate, allowing two dimensional arrays of nozzles (200) for printing. The manufacturing process can be based on existing CMOS, BiCMOS and bipolar semiconductor manufacturing processes, allowing fabrication in existing semiconductor fabrication facilities. Drive transistors (201), shift registers, and fault tolerance circuitry can be fabricated on the same wafer as the nozzles (200). The manufacturing process uses anisotropic wet etching using EDP on a 〈100〉 wafer to form ink channels and nozzle barrels simultaneously. The size of the nozzle barrels can be controlled by the relative starting times of the etch of the nozzle barrels and the ink channels. The manufacturing process has major advantages in being highly CMOS compatible, with all processes relating to nozzle formation occurring after final level metal in CMOS process flow.
摘要:
A new printing system is disclosed for drop on demand printing. This printing mechanism divides the printing process into two stages; a drop selection means to select drops to be printed which generates a difference in meniscus position between selected drops and unselected drops of fluidized ink; and a drop separation means, attracting the ink of said drops to a substrate, the attraction being insufficient to overcome the surface tension of drops in an unselected meniscus position but being sufficient to overcome the surface tension of drops in a selected meniscus position so as to cause movement of the drops to the substrate. The drop selection means can produce a difference in meniscus position in the absence of the drop separation means. The separation of drop selection means from drop separation means significantly reduces the energy required to select which ink drops are to be printed. Only the drop selection means must be driven by individual signals to each nozzle. The drop separation means can be a field or condition applied simultaneously to all nozzles.
摘要:
A new printing system is disclosed for drop on demand printing. This printing mechanism divides the printing process into two stages; a drop selection means to select drops to be printed which generates a difference in meniscus position between selected drops and unselected drops of fluidized ink; and a drop separation means, attracting the ink of said drops to a substrate, the attraction being insufficient to overcome the surface tension of drops in an unselected meniscus position but being sufficient to overcome the surface tension of drops in a selected meniscus position so as to cause movement of the drops to the substrate. The drop selection means can produce a difference in meniscus position in the absence of the drop separation means. The separation of drop selection means from drop separation means significantly reduces the energy required to select which ink drops are to be printed. Only the drop selection means must be driven by individual signals to each nozzle. The drop separation means can be a field or condition applied simultaneously to all nozzles.
摘要:
Drop selection by surface tension reduction is a drop-on-demand printing mechanism in which ink in a liquid state is retained in a printing nozzle at a pressure greater than atmospheric pressure, but insufficient to overcome the quiescent temperature surface tension of the ink and expel the ink from the nozzle. The surface tension of the ink decreases with increasing temperature, and the nozzle includes an electrically activated means of heating the ink to a temperature less than the boiling point of the ink. The surface tension reduces to a value insufficient to retain the ink in the nozzle, whereby a drop of the ink emerges from the nozzle. Single phase liquid inks with a large reduction in surface tension at the required operating temperature for drop selection can be prepared by adding an amphiphile to the ink which exhibits a significant increase in surface activity with increased temperature. Such an amphiphile may be based upon the well known reduction in hydrophilicity of polyoxyethylene (POE) with increasing temperature. The temperature at which POE becomes hydrophobic may be too high for some practical DOD printing systems. This temperature can be reduced by adding hydrophobic moieties to the POE segment. These hydrophobic moieties are preferably not strongly hydrophobic, otherwise the resultant molecule will be amphiphilic at low temperatures, reducing the amount of surface tension reduction available as the temperature increases. A suitable choice of weakly hydrophobic moiety is polyoxypropylene (POP). A variety of combinations of POE and POP can be used, for example, POE/POP block copolymers, POP/POE/POP block copolymers, POE/POP/POE block copolymers, POE/POP/POE/POP block copolymers, and so on. The polymer length in each segment may vary depending upon the surface tension behavior required.
摘要:
A new printing system is disclosed for drop on demand printing. This printing mechanism divides the printing process into two stages; a drop selection means to select drops to be printed which generates a difference in meniscus position between selected drops and unselected drops of fluidized ink; and a drop separation means, attracting the ink of said drops to a substrate, the attraction being insufficient to overcome the surface tension of drops in an unselected meniscus position but being sufficient to overcome the surface tension of drops in a selected meniscus position so as to cause movement of the drops to the substrate. The drop selection means can produce a difference in meniscus position in the absence of the drop separation means. The separation of drop selection means from drop separation means significantly reduces the energy required to select which ink drops are to be printed. Only the drop selection means must be driven by individual signals to each nozzle. The drop separation means can be a field or condition applied simultaneously to all nozzles.
摘要:
A new printing system is disclosed for drop on demand printing. This printing mechanism divides the printing process into two stages; a drop selection means to select drops to be printed which generates a difference in meniscus position between selected drops and unselected drops of fluidized ink; and a drop separation means, attracting the ink of said drops to a substrate, the attraction being insufficient to overcome the surface tension of drops in an unselected meniscus position but being sufficient to overcome the surface tension of drops in a selected meniscus position so as to cause movement of the drops to the substrate. The drop selection means can produce a difference in meniscus position in the absence of the drop separation means. The separation of drop selection means from drop separation means significantly reduces the energy required to select which ink drops are to be printed. Only the drop selection means must be driven by individual signals to each nozzle. The drop separation means can be a field or condition applied simultaneously to all nozzles.
摘要:
A manufacturing process for printing heads (50) which integrates many nozzles into a single monolithic silicon structure. The nozzles (200) are etched through the silicon substrate, allowing two dimensional arrays of nozzles (200) for printing. The manufacturing process can be based on existing CMOS, BiCMOS and bipolar semiconductor manufacturing processes, allowing fabrication in existing semiconductor fabrication facilities. Drive transistors (201), shift registers, and fault tolerance circuitry can be fabricated on the same wafer as the nozzles (200). The manufacturing process uses anisotropic wet etching using EDP on a 〈100〉 wafer to form ink channels and nozzle barrels simultaneously. The size of the nozzle barrels can be controlled by the relative starting times of the etch of the nozzle barrels and the ink channels. The manufacturing process has major advantages in being highly CMOS compatible, with all processes relating to nozzle formation occurring after final level metal in CMOS process flow.