摘要:
An improved ion beam neutralizer (22) is provided for neutralizing the electrical charge of an ion beam (28) output from an extraction aperture (50). The neutralizer comprises a source of water (52); a vaporizer (54) connected to the source of water; a mass flow controller (56) connected to the vaporizer; and an inlet (60) connected to the mass flow controller. The vaporizer (54) converts water from the source (52) from a liquid state to a vapor state. The mass flow controller (56) receives water vapor from the vaporizer (54) and meters the volume of water vapor output by a mass flow controller outlet (66). The inlet (60) is provided with an injection port (68) located proximate the ion beam extraction aperture (50) and receives the metered volume from the outlet (66). The injection port (68) is positioned near the extraction aperture so that the ion beam and the water vapor interact to neutralize the ion beam. The improved ion beam neutralizer (22) is especially effective in low energy (less than ten kilo-electron volts (10 KeV)) beam applications.
摘要:
A method of capturing and removing contaminant particles (14) moving within an evacuated interior region of an ion beam implanter (10) is disclosed. The steps of the method include: providing a particle collector (74) having a surface to which contaminant particles really adhere; securing the particle collector to the implanter such that particle adhering surface is in fluid communication to the contaminant particles moving within the interior region; and removing the particle collector from the implanter after a predetermined period of time. An ion implanter (10) in combination with a particle collector (74) for trapping and removing contaminant particles moving in an evacuated interior region of the implanter traversed by an ion beam is also disclosed, the particle collector including a surface to which the contaminant particles readily adhere and securement means ((76, 78) for releasably securing the particle collector to the implanter such that the particle adhering surface is in fluid communication with the evacuated interior region of the implanter.
摘要:
A method of capturing and removing contaminant particles (14) moving within an evacuated interior region of an ion beam implanter (10) is disclosed. The steps of the method include: providing a particle collector (74) having a surface to which contaminant particles really adhere; securing the particle collector to the implanter such that particle adhering surface is in fluid communication to the contaminant particles moving within the interior region; and removing the particle collector from the implanter after a predetermined period of time. An ion implanter (10) in combination with a particle collector (74) for trapping and removing contaminant particles moving in an evacuated interior region of the implanter traversed by an ion beam is also disclosed, the particle collector including a surface to which the contaminant particles readily adhere and securement means ((76, 78) for releasably securing the particle collector to the implanter such that the particle adhering surface is in fluid communication with the evacuated interior region of the implanter.
摘要:
Electrical charge neutralization effects are known to be factors that affect the dose or concentrations of beam treatment by high current implanters (11). Raising beam energies to 1 MeV and beyond requires an understanding of the effects of both charge stripping and charge neutralization as well as a numerically efficient model compensating for these effects. Charge stripping generates ions of a higher charge state and may cause the measured electronic current from a Faraday cup to overestimate the true particle current. The invention implements an analysis based on the concept of an effective charge state for an ion beam (19) and results in a more general interpretation that covers both the charge stripping effect as well as ion neutralization. Dose control using the disclosed techniques requires two adjustable parameters: an apparent cross section of interaction between the beam and particles in the beam path and the ratio of the final steady charge state to the initial charge state.
摘要:
An ion implantation device equipped with a high-speed driving device 16 which causes rotation of the a disk 15 that supports semiconductor wafers 25 around it outer periphery. A center position of said disk is the axis of said rotation of the high speed rotation. A low-speed driving device 17 causes relative movement of the disk in a radial direction. The ion implantation device further has a control means which calculates the movement speed of the aforementioned low-speed driving device with reference to different spacings between wafers about the outer periphery and the distance R from the center of the disk to the ion implantation position, and controls said low speed scan speed V so that ions are uniformly implanted into the aforementioned wafers.