-
1.发明公开VERFAHREN ZUR HERSTELLUNG EINES ELEKTRONISCHEN BAUELEMENTS, INSBESONDERE EINES MIT AKUSTISCHEN OBERFLÄCHENWELLEN ARBEITENDEN OFW-BAUELEMENTS 有权方法生产电子部件，与表面声波WORKING SAW COMPONENT尤其是
公开(公告)号：EP1055285A1
公开(公告)日：2000-11-29
申请号：EP99913068.5
申请日：1999-02-05
Applicant: EPCOS AG
Inventor： STELZL, Alois , KRÜGER, Hans , DEMMER, Peter
CPC classification number: H01L24/97 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/3025 , H03H3/08 , Y10T29/4913 , Y10T29/49139 , Y10T29/49142 , Y10T29/49146 , Y10T29/49171 , Y10T29/49789 , H01L2224/81
Abstract: In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.
-
2.发明授权VERFAHREN ZUR HERSTELLUNG EINES ELEKTRONISCHEN BAUELEMENTS, INSBESONDERE EINES MIT AKUSTISCHEN OBERFLÄCHENWELLEN ARBEITENDEN OFW-BAUELEMENTS 有权方法生产电子部件，与表面声波WORKING SAW COMPONENT尤其是
公开(公告)号：EP1055285B1
公开(公告)日：2002-10-09
申请号：EP99913068.5
申请日：1999-02-05
Applicant: EPCOS AG
Inventor： STELZL, Alois , KRÜGER, Hans , DEMMER, Peter
CPC classification number: H01L24/97 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/3025 , H03H3/08 , Y10T29/4913 , Y10T29/49139 , Y10T29/49142 , Y10T29/49146 , Y10T29/49171 , Y10T29/49789 , H01L2224/81
Abstract: In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.
-
Search Results
2
records
(took 0.006 seconds)
