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1.发明授权APPARATUS AND METHOD FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES 有权DEVICE AND METHOD FOR微孔空穴的包装电气线路电接点穿孔
公开(公告)号：EP1082883B1
公开(公告)日：2002-10-16
申请号：EP99955387.8
申请日：1999-05-27
CPC分类号： B23K26/066 , B23K26/073 , B23K26/0734 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2203/30 , B23K2203/42 , B23K2203/50 , H05K3/0026
摘要： This invention applies to the use of shaped beams of laser radiation for increasing the maximum speed of tools used to laser drill microvia holes in PCB's, PWB's and other electrical circuit packages. With an annular spatial intensity distribution, the maximum speed can be increased several fold from machines which do not incorporate such laser beam shaping. Different hole diameters on a one device can be programmed using a set of ring beam shaping elements incorporated into a single transmissive mask element whose lateral position when placed in the beam is computer-controlled.
摘要翻译： 本发明应用于使用激光辐射的成形波束的用于增加在印刷电路板用于激光钻孔微通孔的孔的工具的最大速度，PCB的和其它电路组件（8）。 具有环形设计的空间强度分布中，最大速度可以从机器哪个不配合寻求激光光束整形可以成倍增长。 一个在一个设备上的不同的孔直径可以利用一组并入到单个透射式掩模元件，其横向位置当在光束放置是计算机控制的环波束成形单元进行编程。
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2.发明授权
公开(公告)号：EP1090537B1
公开(公告)日：2003-10-08
申请号：EP99953414.2
申请日：1999-05-27
CPC分类号： H05K3/0032 , B23K26/0624 , B23K26/389 , H05K3/0035
摘要： This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.
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公开(公告)号：EP1105248A1
公开(公告)日：2001-06-13
申请号：EP99957032.8
申请日：1999-06-14
申请人： EXCELLON AUTOMATION
CPC分类号： H05K3/0032 , B23K26/18 , B23K26/382 , B23K26/40 , B23K2201/35 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/16 , B23K2203/42 , B23K2203/50 , B23K2203/52 , B41J2/16 , B41J2/1634 , H05K1/095 , H05K3/0029 , H05K3/0035 , H05K2201/0112
摘要： The invention discloses methods and apparatus (1) for laser drilling of one or more holes in one or more materials (9) using a laser radiation source (2) emitting radiation having a wavelength or wavelengths, where at least some of the materials (9) have been treated to change their absorption depths at the wavelength or wavelengths of the radiation. The material or materials (9) may be treated by adding one or more dopants thereto. The material or materials (9) may comprise dielectric materials, and may be used in the construction of electrical interconnection packages such as printed circuit or wiring boards, ball grid arrays or multichip modules. The quality of the holes produced is superior so that produced when drilling undoped material with the same laser radiation source.
摘要翻译： 本发明公开了一种用于使用发射具有波长或波长的辐射的激光辐射源（2）在一种或多种材料（9）中激光钻孔一个或多个孔的方法和装置（1），其中至少一些材料（9） ）已被处理以改变其在辐射的波长或波长处的吸收深度。 可以通过向其中加入一种或多种掺杂剂来处理材料（9）。 材料或材料（9）可以包括介电材料，并且可以用于电互连封装的构造，例如印刷电路或布线板，球栅阵列或多芯片模块。 所生产的孔的质量优越，使得在用相同的激光辐射源钻未掺杂材料时产生。
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4.发明公开APPARATUS AND METHOD FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES 有权DEVICE AND METHOD FOR微孔空穴的包装电气线路电接点穿孔
公开(公告)号：EP1082883A1
公开(公告)日：2001-03-14
申请号：EP99955387.8
申请日：1999-05-27
CPC分类号： B23K26/066 , B23K26/073 , B23K26/0734 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2203/30 , B23K2203/42 , B23K2203/50 , H05K3/0026
摘要： This invention applies to the use of shaped beams of laser radiation for increasing the maximum speed of tools used to laser drill microvia holes in PCB's, PWB's and other electrical circuit packages. With an annular spatial intensity distribution, the maximum speed can be increased several fold from machines which do not incorporate such laser beam shaping. Different hole diameters on a one device can be programmed using a set of ring beam shaping elements incorporated into a single transmissive mask element whose lateral position when placed in the beam is computer-controlled.
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