公开(公告)号：EP1852525A1

公开(公告)日：2007-11-07

申请号：EP07102550.6

申请日：2007-02-16

申请人： Electroplating Engineers of Japan Limited

发明人： Watanabe, Shingo ,  Ohnishi, Junji ,  Wachi, Hiroshia ,  Sone, Takayuki

IPC分类号： C25D3/50 ,  C25D3/56 ,  H05K3/24

CPC分类号： C25D3/50 ,  C25D3/567 ,  C25D5/12 ,  H05K3/244

摘要： The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l,

摘要翻译： 本发明提供一种能够形成钯电镀膜的电镀液，其能够进一步提高由镀镍膜，镀钯膜和镀金膜构成的组合物的表面处理中的焊料特性， 金属如铜。 在含有可溶性钯盐和含有锗的液体组合物的导电盐的本发明的钯电镀溶液中，可溶性钯盐的量以钯的还原值计算为0.1g / l至50g / l 金属，导电盐的量为10g / l至400g / l，锗的量为0.1mg / l至1000mg / l，

公开(公告)号：EP1852525B1

公开(公告)日：2010-04-07

申请号：EP07102550.6

申请日：2007-02-16

申请人： Electroplating Engineers of Japan Limited

发明人： Watanabe, Shingo ,  Ohnishi, Junji ,  Wachi, Hiroshi ,  Sone, Takayuki

IPC分类号： C25D3/50 ,  C25D3/56 ,  H05K3/24

CPC分类号： C25D3/50 ,  C25D3/567 ,  C25D5/12 ,  H05K3/244