摘要:
The present invention provides an aqueous platinum electroplating bath including: a) a source of platinum ions; and b) a source of polyphosphate anions, and wherein the bath has a pH in the range from about 2 to about 9 when it is in use or ready for use. The aqueous platinum electroplating bath may optionally include one or more levellers. The invention also provides the use of the platinum electroplating bath and platinum salts suitable for use in the bath.
摘要:
An aperture plate (10) is formed from a palladium nickel alloy comprising about 89% palladium and about 11% nickel. There is a generally fine substantially equiaxed grain microstructure throughout the thickness of the aperture plate. The average grain width (W) is in the range of from 0.2 µm to 2.0 µm, in some cases from 0.2 µm to 1.0 µm. For optimum results the average grain width is approximately 0.5 µm. Because the grain structure is equiaxed (L/W =1) the grain length (L) is the same as the grain width. The improved aperture plate (10) extends the life of nebulisers, eliminates the risk of premature and unpredictable failure of a nebuliser in service, eliminates the risk of product returns from hospitals and patients, and eliminates the possible risk of fragments of the aperture plate breaking free from the nebulizer.
摘要:
Die Erfindung betrifft ein Verfahren zur Verbesserung der Leistung von Nickelelektroden in der Alkalichloridelektrolyse mittels Zugabe von wasserlöslichen Platinverbindungen zum Katholyt.
摘要:
Alkalisches oder neutrales Bad zur galvanischen Abscheidung von Palladium oder Legierungen des Palladiums, welches 2 bis 25 g/l Palladium als Diammino-dichloro-Palladium-Komplex, 0,01 Mol bis 1 Mol Nitrit (-NO 2 ) pro Mol Palladium, wenigstens ein Leitsalz, vorzugsweise auch eine Puffersubstanz, ein Glanzmittel und ein Netzmittel, sowie Wasser enthält.
摘要:
A process is described for electroplating palladium and palladium alloys. The process involves the use of an alkyl hydroxyamine as complexing agent and is particularly good for palladium alloys such as palladium-nickel and palladium-cobalt.
摘要:
Methods for increasing the ductility and reducing the porosity and cracking tendency of a palladium or palladium-silver electrodeposit which comprises providing an underlayer of a palladium/nickel or palladium/cobalt alloy electrodeposit. Also dual layer composite electroplated deposits and their use in electrical contacts or connectors.