摘要:
The invention relates to a light-emitting diode device (1) comprising at least one support (2) and a light-emitting diode (3) which is arranged thereon. Said support (2) comprises a plurality of superimposed polymer layers (4, 5, 6). At least one polymer layer (4, 5, 6) comprises a recess (8) in which an electric component (7, 17, 18, 19) is embedded.
摘要:
The invention relates to an electronic component (100) having a base (1). Said base has a porous material with surface pores (2) on a surface (7) of the base (1), a passivation liquid (3) being arranged in the surface pores (2).
摘要:
The present invention relates to a carrier (2) with a passive cooling function for a semiconductor component (3), having a main body (6) with a top face (7) and a bottom face (8) and at least one electrical component (13, 13a, 13b) which is embedded into the main body (6), wherein the carrier (2) has a first thermal via (14) which extends from the top face (7) of the main body (6) to the at least one electrical component (13, 13a, 13b), wherein the carrier (2) has a second thermal via (15) which extends from the at least one electrical component (13, 13a, 13b) to the bottom face (8) of the main body (6), and wherein the first and the second thermal via (14, 15) make electrical contact with the at least one embedded electrical component (13, 13a, 13b).
摘要:
The invention relates to a piezoelectric multilayer component (1) as an intermediate, which comprises a stack (2) of piezoelectric layers (3) arranged on top of one another. The stack (2) comprises an active region (6) having electrode layers (4) arranged between the piezoelectric layers (3) and at least one inactive region (7), wherein the active region (6) on the end product of the piezoelectric multilayer component (1) is provided for the purpose of deforming when a voltage is applied to the electrode layers (4). The inactive region (7) contains at least one sacrificial layer (8) which comprises an electrically insulating material and a metal, wherein the metal can diffuse at least partially from the sacrificial layer (8) into the piezoelectric layers (3) of the inactive region (7) by heating the multilayer component (1).
摘要:
The invention relates to a piezoelectric component comprising a stack (1) of piezoelectric layers (2, 2', 2'', 2''', 3, 3', 3'', 3''') arranged one on top of the other and first and second electrode layers (4, 5) arranged therebetween, wherein the stack (1) comprises at least one first piezoelectric layer (2) having a first electrical coercive force and directly adjacent thereto at least one second piezoelectric layer (3) having a second electrical coercive force different from the first coercive force.
摘要:
The invention relates to a piezoelectric multi-layer component (1) with a base body (2) that has a stack of alternating piezoceramic layers (3) and electrode layers (4), neighbouring layers (3, 4) of the stack being stressed against one another and the stresses running perpendicularly to the stack direction.