公开(公告)号：EP0938738A1

公开(公告)日：1999-09-01

申请号：EP97950134.0

申请日：1997-11-06

申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： SCHIELE, Ignaz ,  KOZLOWSKI, Frank

IPC分类号： B81B3 ,  B81C1 ,  H01H59

CPC分类号： B81C1/00936 ,  B81B2201/018 ,  H01H59/0009 ,  H01H2059/0018 ,  H01H2059/0072

摘要： The invention relates to a method for manufacturing a micromechanical relay comprising the preparation of a substrate (10) having a fixed conductive electrode (18) in the substrate (10) or on the same. A sacrificial layer (26) and a conductive layer (32) are applied, the conductive layer (32) being structured as a movable counter electrode (39) in relation to the fixed electrode (18) in order to fix a lug structure. A contact segment (40) is applied, wherein the conductive layer (32) extends between an anchoring area (54) and a contact area (40) and is isolated with respect to the contact area. Subsequently, the sacrificial layer (26) is removed by etching to produce a movable segment and a segment fixed to the substrate (10) in the anchoring area (54) in the lug structure, which is fixed in such a way, that the etching access openings in the same are structured in such a way that the surface expansion of the etching access openings (66) to etch the sacrificial layer (26) increases from the area of the lug structure (54) fixed to the substrate (10) to the movable area of the lug structure.

公开(公告)号：EP0938738B1

公开(公告)日：2000-06-14

申请号：EP97950134.3

申请日：1997-11-06

申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： SCHIELE, Ignaz ,  KOZLOWSKI, Frank

IPC分类号： H01H59/00

CPC分类号： B81C1/00936 ,  B81B2201/018 ,  H01H59/0009 ,  H01H2059/0018 ,  H01H2059/0072

摘要： The invention relates to a method for manufacturing a micromechanical relay comprising the preparation of a substrate (10) having a fixed conductive electrode (18) in the substrate (10) or on the same. A sacrificial layer (26) and a conductive layer (32) are applied, the conductive layer (32) being structured as a movable counter electrode (39) in relation to the fixed electrode (18) in order to fix a lug structure. A contact segment (40) is applied, wherein the conductive layer (32) extends between an anchoring area (54) and a contact area (40) and is isolated with respect to the contact area. Subsequently, the sacrificial layer (26) is removed by etching to produce a movable segment and a segment fixed to the substrate (10) in the anchoring area (54) in the lug structure, which is fixed in such a way, that the etching access openings in the same are structured in such a way that the surface expansion of the etching access openings (66) to etch the sacrificial layer (26) increases from the area of the lug structure (54) fixed to the substrate (10) to the movable area of the lug structure.

公开(公告)号：EP0685117B1

公开(公告)日：1996-09-04

申请号：EP94907553.5

申请日：1994-02-11

申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： LANG, Walter ,  KOZLOWSKI, Frank ,  RICHTER, Axel ,  SAUTER, Martin ,  STEINER, Peter

IPC分类号： H01L33/00 ,  H05H1/00

CPC分类号： H01L33/346 ,  H01L2924/0002 ,  H05H1/00 ,  H01L2924/00

摘要： A plasma is generated by applying a voltage on mutually spaced apart spots of a microporous body. This may be done for example by applying a 50 to 100 V voltage through a microporous layer of a silicium wafer.

公开(公告)号：EP0685117A1

公开(公告)日：1995-12-06

申请号：EP94907553.0

申请日：1994-02-11

申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： LANG, Walter ,  KOZLOWSKI, Frank ,  RICHTER, Axel ,  SAUTER, Martin ,  STEINER, Peter

IPC分类号： H01L33 ,  H05H1

CPC分类号： H01L33/346 ,  H01L2924/0002 ,  H05H1/00 ,  H01L2924/00

摘要： A plasma is generated by applying a voltage on mutually spaced apart spots of a microporous body. This may be done for example by applying a 50 to 100 V voltage through a microporous layer of a silicium wafer.