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    Semiconductor module
    1.
    发明公开
    Semiconductor module 失效
    Halbleitervorrichtung。

    公开(公告)号：EP0527033A2

    公开(公告)日：1993-02-10

    申请号：EP92307117.9

    申请日：1992-08-04

    申请人： FUJI ELECTRIC CO. LTD.

    发明人： Kobayashi, Shinichi, c/o Fuji Electric Co., Ltd. ,  Miyasaka, Tadashi, c/o Fuji Electric Co., Ltd. ,  Shimizu, Toshihisa, c/o Fuji Electric Co., Ltd.

    IPC分类号： H01L23/64 ,  H01L25/07 ,  H01L23/52 ,  H01L23/498 ,  H01L23/495

    CPC分类号： H01L23/52 ,  H01L23/49562 ,  H01L23/49811 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599

    摘要： To prevent a semiconductor device from breaking down due to a surge voltage which is generated by the existence of floating inductance in a terminal conductor drawn out from the connection of two semiconductor elements contained in one semiconductor container and which is applied to one of the elements when they are turned off, the invention provides a semiconductor device in which two pairs of a first and a second pair of electrode conductors each consists of a pair of a first electrode conductor onto which semiconductor elements with main electrodes are fixed on its bottom surface and a second electrode conductor connected to the main electrodes on the upper surface on the semiconductor elements by connecting leads are fixed on the bottom plate of a container via insulating plates, one main terminal conductor connected to the first electrode conductor of the first pair and another main terminal conductor connected to the second electrode conductor of the second pair are both drawn out externally, and one intermediate terminal conductor is connected to both the second electrode conductor of the first pair and the first electrode conductor of the second pair and drawn out externally wherein connecting conductor with a lower floating inductance and a higher resistance than in the part of the intermediate terminal conductor between the second electrode conductor of the first pair and the first electrode conductor of the second pair is connected across both electrode conductors in parallel to the intermediate terminal conductor. When semiconductor elements are connected to the respective semiconductor elements in parallel, the connecting conductors are installed at locations close to each semiconductor element of the electrode conductors.

    摘要翻译： 为了防止半导体器件由于在从包含在一个半导体容器中的两个半导体元件的连接引出的端子导体中存在浮动电感而产生的浪涌电压而分解，并且应用于一个元件中的一个元件， 本发明提供一种半导体器件，其中两对第一和第二对电极导体各自由一对第一电极导体组成，其上具有主电极的半导体元件固定在其底表面上， 通过连接引线连接到半导体元件上表面上的主电极的第二电极导体经由绝缘板固定在容器的底板上，一个主端子导体连接到第一对的第一电极导体和另一个主端子 连接到第二对的第二电极导体的导体都被拉出 并且一个中间端子导体连接到第一对的第二电极导体和第二对的第二电极导体和第二对的第一电极导体之间​​并且从外部引出，其中连接导体具有较低的浮动电感并且具有比在部分 第一对的第二电极导体和第二对的第一电极导体之间​​的中间端子导体在两个电极导体上平行于中间端子导体连接。 当半导体元件并联连接到相应的半导体元件时，连接导体被安装在靠近电极导体的每个半导体元件的位置处。

    Semiconductor module
    2.
    发明公开
    Semiconductor module 失效
    半导体模块

    公开(公告)号：EP0527033A3

    公开(公告)日：1993-12-15

    申请号：EP92307117.9

    申请日：1992-08-04

    申请人： FUJI ELECTRIC CO. LTD.

    发明人： Kobayashi, Shinichi, c/o Fuji Electric Co., Ltd. ,  Miyasaka, Tadashi, c/o Fuji Electric Co., Ltd. ,  Shimizu, Toshihisa, c/o Fuji Electric Co., Ltd.

    IPC分类号： H01L23/64 ,  H01L25/07 ,  H01L23/52 ,  H01L23/498 ,  H01L23/495

    CPC分类号： H01L23/52 ,  H01L23/49562 ,  H01L23/49811 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599

    摘要： To prevent a semiconductor device from breaking down due to a surge voltage which is generated by the existence of floating inductance in a terminal conductor drawn out from the connection of two semiconductor elements contained in one semiconductor container and which is applied to one of the elements when they are turned off, the invention provides a semiconductor device in which two pairs of a first and a second pair of electrode conductors each consists of a pair of a first electrode conductor onto which semiconductor elements with main electrodes are fixed on its bottom surface and a second electrode conductor connected to the main electrodes on the upper surface on the semiconductor elements by connecting leads are fixed on the bottom plate of a container via insulating plates, one main terminal conductor connected to the first electrode conductor of the first pair and another main terminal conductor connected to the second electrode conductor of the second pair are both drawn out externally, and one intermediate terminal conductor is connected to both the second electrode conductor of the first pair and the first electrode conductor of the second pair and drawn out externally wherein connecting conductor with a lower floating inductance and a higher resistance than in the part of the intermediate terminal conductor between the second electrode conductor of the first pair and the first electrode conductor of the second pair is connected across both electrode conductors in parallel to the intermediate terminal conductor. When semiconductor elements are connected to the respective semiconductor elements in parallel, the connecting conductors are installed at locations close to each semiconductor element of the electrode conductors.

    摘要翻译： 为了防止半导体器件由于在从包含在一个半导体容器中的两个半导体元件的连接引出的端子导体中存在浮动电感而产生的浪涌电压击穿， 它们被关断，本发明提供了一种半导体器件，其中两对第一和第二对电极导体分别由一对第一电极导体构成，其上具有主电极的半导体元件固定在其底表面上， 通过连接引线连接到半导体元件上表面上的主电极的第二电极导体通过绝缘板固定在容器的底板上，一个主端子导体连接到第一对的第一电极导体，另一个主端子 连接到第二对的第二电极导体的导体都被拉出 t，并且一个中间端子导体连接到第一对的第二电极导体和第二对的第一电极导体两者并且从外部引出，其中连接导体具有较低的浮动电感和高于 在第一对的第二电极导体和第二对的第一电极导体之间​​的中间终端导体跨过与中间终端导体平行的两个电极导体连接。 当半导体元件并联连接到各个半导体元件时，连接导体安装在靠近电极导体的每个半导体元件的位置处。