公开(公告)号：EP2939265B1

公开(公告)日：2018-10-31

申请号：EP13822065.2

申请日：2013-12-26

申请人： Flir Systems, Inc.

发明人： SCHWEIKERT, Paul ,  SHARPE, Andrew ,  CARLSON, Gregory A. ,  MATSON, Alex ,  VILANDER, Scott ,  ZAHUTA, Bob ,  GOEDEN, Richard M.

IPC分类号： H01L21/50 ,  H01L21/67 ,  H01L23/00 ,  B81C1/00 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L31/0203 ,  H01L31/09

CPC分类号： H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67757 ,  H01L21/681 ,  H01L21/6831 ,  H01L24/94 ,  H01L31/0203 ,  H01L31/09 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/41 ,  H01L2924/00

摘要： An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

公开(公告)号：EP2939265A1

公开(公告)日：2015-11-04

申请号：EP13822065.2

申请日：2013-12-26

申请人： Flir Systems, Inc.

发明人： SCHWEIKERT, Paul ,  SHARPE, Andrew ,  CARLSON, Gregory A. ,  MATSON, Alex ,  VILANDER, Scott ,  ZAHUTA, Bob ,  GOEDEN, Richard M.

IPC分类号： H01L21/50 ,  H01L21/67 ,  H01L23/00

CPC分类号： H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67757 ,  H01L21/681 ,  H01L21/6831 ,  H01L24/94 ,  H01L31/0203 ,  H01L31/09 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/41 ,  H01L2924/00

摘要： An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

摘要翻译： 在一个实施例中，用于微测辐射热量计真空封装组件（VPA）的晶片级封装（WLP）的装置包括晶片对准和结合室，测辐射热计薄片卡盘和设置在腔室内的垂直面对面的盖晶片卡盘 彼此之间，用于在室内产生第一超高真空（UHV）环境的装置，用于彼此独立地加热和冷却测辐射热计晶片卡盘和盖晶片卡盘的装置，用于将盖晶片卡盘在垂直方向上移动的装置 方向并且相对于测辐射热量计薄片卡盘，用于在水平面中在两个正交方向上平移移动测辐射热计晶片夹盘并且绕垂直于水平面的垂直轴线旋转移动的装置，以及用于使由基准点 在盖晶片卡盘保持的盖子晶片上具有基准的测辐射热计晶片卡盘。