摘要:
The present invention provides a method for forming uniform CVD diamond coatings on a substrate wherein diamond is deposited on a plurality of substrates which are rotated in unison during the coating process to provide for more uniform radial growth. An advantageous substrate is a wire which can be coated with a layer of CVD diamond for making components in water-jet cutting apparatus, wire-drawing dies, or other tubular articles when the wire is separated from the resulting diamond tube. Identical tubes with higher uniformity in wall thickness are among the products which can be obtained. In addition, tubes having a uniform particle size distribution along their wall thickness which supports columnar diamond growth are also provided.
摘要:
The present invention is directed to the formation of a chip breaker in a polycrystalline diamond or cubic boron nitride compact. An oversized compact blank having a surface and edges that establish it as oversized is provided. A chip breaker pattern is formed on the compact blank surface. Preferred means for forming the chip breaker pattern include use of a laser, a plunge EDM apparatus, or by ultrasonic abrading. Thereafter, the edges of the patterned oversized compact blank are finished to reduce the size of the blank. When plunge EDM apparatus fitted with a patterned plunger is used, the compact blank must be electrically conductive.
摘要:
This invention relates to a novel domed polycrystalline diamond cutting element wherein a hemispherical diamond layer is bonded to a tungsten carbide substrate, commonly referred to as a tungsten carbide stud. Broadly, a pattern of ridges or bumps is integrally formed in the abrasive layer which ridges are designed to cause high localized stresses in the rock, thus starting a crack. By initiating cracks in localized areas, the crushing action could be performed with less force.
摘要:
The present invention is directed to the formation of a chip breaker in a polycrystalline diamond or cubic boron nitride compact. An oversized compact blank having a surface and edges that establish it as oversized is provided. A chip breaker pattern is formed on the compact blank surface. Preferred means for forming the chip breaker pattern include use of a laser, a plunge EDM apparatus, or by ultrasonic abrading. Thereafter, the edges of the patterned oversized compact blank are finished to reduce the size of the blank. When plunge EDM apparatus fitted with a patterned plunger is used, the compact blank must be electrically conductive.
摘要:
The present invention relates to a diamond window which is mounted to a flange of a vacuum or pressure system using a reactive braze alloy to form a continuous, leak tight attachment.
摘要:
The present invention relates to a diamond window which is mounted to a flange of a vacuum or pressure system using a reactive braze alloy to form a continuous, leak tight attachment.
摘要:
The present invention provides a method for forming uniform CVD diamond coatings on a substrate wherein diamond is deposited on a plurality of substrates which are rotated in unison during the coating process to provide for more uniform radial growth. An advantageous substrate is a wire which can be coated with a layer of CVD diamond for making components in water-jet cutting apparatus, wire-drawing dies, or other tubular articles when the wire is separated from the resulting diamond tube. Identical tubes with higher uniformity in wall thickness are among the products which can be obtained. In addition, tubes having a uniform particle size distribution along their wall thickness which supports columnar diamond growth are also provided.
摘要:
Disclosed is an improved implement comprising a cemented carbide supported composite abrasive compact which is brazed to a cemented carbide substrate with a brazing filler metal having a liquidus substantially above 700 °C. The composite compact preferably is a composite polycrystalline diamond compact. The brazing filler metal is a brazing alloy having a liquidus not substantially above 1,004 °C and which has the following composition, by weight:
Au 18-39.5% Ni 3.5-14.5% Pd 2.5-10.5% Mn 7.5-9.0% Cu Balance.
摘要:
This invention relates to a novel domed polycrystalline diamond cutting element wherein a hemispherical diamond layer is bonded to a tungsten carbide substrate, commonly referred to as a tungsten carbide stud. Broadly, a pattern of ridges or bumps is integrally formed in the abrasive layer which ridges are designed to cause high localized stresses in the rock, thus starting a crack. By initiating cracks in localized areas, the crushing action could be performed with less force.
摘要:
The present invention relates to a novel domed polycrystalline diamond cutting element (10) wherein a hemispherical diamond layer (14) is bonded to a tungsten carbide substrate (16), commonly referred to as a tungsten carbide stud. Broadly, the inventive cutting element includes a metal carbide stud having a proximal end adapted to be placed into a drill bit (12) and a distal end portion. A layer of cutting polycrystalline abrasive material disposed over said distal end portion such that an annulus (20) of metal carbide adjacent and above said drill bit is not covered by said abrasive material layer. The geometry of the diamond cutting element provides control of interfacial stresses and reduces fabrication costs. The diamond cutting element may contain a pattern of ridges or bumps integrally formed in the abrasive layer which ridges are designed to cause high localized stresses in the rock, thus starting a crack. By initiating cracks in localized areas, the crushing action could be performed with less force.