公开(公告)号：EP3358615A1

公开(公告)日：2018-08-08

申请号：EP16850843.0

申请日：2016-07-27

申请人： Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

发明人： KATO, Hiromasa ,  KITAMORI, Noboru

IPC分类号： H01L23/13 ,  H01L23/12 ,  H01L23/36 ,  H05K1/02

CPC分类号： C04B35/584 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/88 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49861 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0011 ,  H05K3/0061 ,  H05K2201/09136

摘要： The present invention provides a silicon nitride circuit board in which metal plates are attached on front and rear sides of a silicon nitride substrate having a three-point bending strength of 500 MPa or higher, with attachment layers interposed therebetween, wherein assuming that a thickness of the metal plate on the front side is denoted by t1, and a thickness of the metal plate on the rear side is denoted by t2, at least one of the thicknesses t1 and t2 is 0.6 mm or larger, a numerical relation: 0.10 ≤ |t1 - t2| ≤ 0.30 mm is satisfied, and warp amounts of the silicon nitride substrate in a long-side direction and a short-side direction both fall within a range from 0.01 to 1.0 mm. Due to above configuration, TCT properties of the silicon nitride circuit board can be improved even if the thicknesses of the front and rear metal plates are large.

公开(公告)号：EP3353125A1

公开(公告)日：2018-08-01

申请号：EP16778953.6

申请日：2016-09-23

申请人： Materion Corporation

发明人： NEWELL, Michael P. ,  ASLETT, Zan ,  CUZZIERE, Robert ,  HOUDE, Andrew P. ,  BROWN, Derrick

IPC分类号： C03C14/00 ,  C04B37/02 ,  G03B21/20 ,  C09K11/02 ,  H01L33/50 ,  H01L33/64

CPC分类号： H01L31/02327 ,  C03C14/006 ,  C04B37/026 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/72 ,  C04B2237/84 ,  G03B21/16 ,  G03B21/204 ,  H01L31/024 ,  H01L31/18 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/644

摘要： A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

公开(公告)号：EP2480052B1

公开(公告)日：2017-08-09

申请号：EP10817188.5

申请日：2010-09-15

申请人： Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

发明人： KATO, Hiromasa

IPC分类号： H05K3/34 ,  H05K3/06 ,  H05K3/38 ,  H01L23/13 ,  H01L23/15 ,  H01L21/44 ,  B23K1/00 ,  C04B37/02 ,  H05K1/03 ,  H05K3/20 ,  H01L23/373 ,  B23K101/36

CPC分类号： H05K3/062 ,  B23K1/0016 ,  B23K2201/36 ,  C04B37/026 ,  C04B2235/658 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/706 ,  H01L21/44 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/067 ,  H05K3/202 ,  H05K3/3484 ,  H05K3/38 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0392 ,  H05K2203/0465 ,  H05K2203/0545 ,  H05K2203/125 ,  H05K2203/167 ,  Y10T29/49156 ,  H01L2924/00

公开(公告)号：EP3121157A1

公开(公告)日：2017-01-25

申请号：EP15765052.4

申请日：2015-01-30

申请人： Mitsubishi Materials Corporation

发明人： TERASAKI Nobuyuki ,  NAGATOMO Yoshiyuki

IPC分类号： C04B37/02 ,  H01L23/13 ,  H01L23/36 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L23/3735 ,  B23K1/0016 ,  B23K35/302 ,  C04B37/026 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/15 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/83101 ,  H05K1/181 ,  H05K2201/10378

摘要： There is provided a bonded body of the invention in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other, in which a bonding portion is formed between the ceramic member and the Cu member, an active metal compound region formed of a compound containing active metal is formed on the bonded portion on the ceramic member side, and an Al concentration of the bonding portion having a thickness range of 0.5 µm to 3 µm from one surface of the active metal compound region on the Cu member side towards the Cu member side is in a range of 0.5 at% to 15 at%.

摘要翻译： 提供了一种在其中的陶瓷构件形成包含Al和形成的Cu或Cu合金的铜构件的陶瓷的接合到彼此，其中一个接合部分在陶瓷部件和之间形成的本发明的接合体 形成包含活性金属的化合物的活性金属化合物区域的铜构件是形成在所述陶瓷构件侧的接合部，和在具有从一个表面至3微米的厚度范围为0.5微米的接合部分的Al浓度 上朝向的Cu构件侧的铜构件侧的活性金属化合物区域是在％的％的范围内为0.5至15。

公开(公告)号：EP2966679A4

公开(公告)日：2016-12-07

申请号：EP14760896

申请日：2014-02-28

申请人： MITSUBISHI MATERIALS CORP

发明人： OOHIRAKI TOMOYA ,  OI SOTARO ,  NISHIKAWA KIMIHITO ,  HAYASHI HIROMASA

IPC分类号： H01L23/12 ,  B23K1/00 ,  B23K31/02 ,  C04B35/645 ,  C04B37/02 ,  H01L21/48 ,  H01L23/373 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20

CPC分类号： B23K1/0016 ,  B23K31/02 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/86 ,  H01L21/4846 ,  H01L21/4882 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K3/202 ,  H05K3/207 ,  H05K2203/04 ,  H05K2203/06 ,  H01L2924/00

摘要： A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

公开(公告)号：EP2980048A4

公开(公告)日：2016-11-30

申请号：EP14774133

申请日：2014-03-18

申请人： MITSUBISHI MATERIALS CORP

发明人： OI SOTARO ,  KAWASAKI TAKAYUKI

IPC分类号： C04B37/02 ,  B23K1/20 ,  H01L23/12 ,  H05K3/34 ,  H05K3/38

CPC分类号： C04B37/026 ,  B23K1/0016 ,  B23K1/19 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H01L21/4882 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/677 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/022 ,  H05K2203/068 ,  H05K2203/163 ,  H01L2924/00

摘要： Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, both of which enable the production of the laminated assembly with high efficiency while preventing the occurrence of misalignment among a ceramic board, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer: and an apparatus and a method for producing a power-module substrate, in both of which the apparatus and the method are applied to the production of the power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device (3) which conveys the metal plate (30) onto the ceramic board (21) to laminate the ceramic board (21) and the metal plate (30) on each other; and a heating device (4) which is arranged in the middle of a passage of the conveyance of the metal plate (30) by the conveying device (3) and melts the temporary-bonding material on the metal plate (30).

摘要翻译： 本发明提供：一种装置以及一种用于制造（金属板）的方法， - （陶瓷基板）层叠组件，两者都使生产的层压组件的高效率，同时防止陶瓷板之间的未对准的发生，粘合材料 和金属板的通过粘接材料层粘接到陶瓷板中的金属板：和的装置和用于制造功率模块用基板，在这两者的方法，该装置和方法被施加到生产 的电源模块用基板。 用于生产（金属板）的装置 - 通过层压具有其上在其上形成有粘接材料层的陶瓷板所形成的临时接合材料的金属板（陶瓷板）层压组件，所述设备配备有：一个输送装置 （3）到陶瓷板输送金属板（30）（21）层叠陶瓷板（21）和在彼此在金属板（30）; 和其在金属板30通过输送装置（3）的输送的一个通路的中部布置并熔融的金属板（30）的临时接合材料的加热装置（4）所有。

公开(公告)号：EP2978019A4

公开(公告)日：2016-11-02

申请号：EP14769861

申请日：2014-03-17

申请人： MITSUBISHI MATERIALS CORP

发明人： TERASAKI NOBUYUKI ,  NAGATOMO YOSHIYUKI

IPC分类号： H01L23/12 ,  C04B37/02 ,  H01L23/14

CPC分类号： H01L21/4853 ,  C04B37/026 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/127 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/32225

摘要： A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member (11) and a copper member (12) through an active metal material and a filler metal having a melting point of 710°C or lower, and a heating treatment step of heating the ceramic member (11) and the copper member (12) laminated together.

公开(公告)号：EP1950189B1

公开(公告)日：2016-08-17

申请号：EP06746985.8

申请日：2006-05-30

申请人： Sumitomo Electric Hardmetal Corp.

发明人： KUKINO, Satoru ,  KURODA, Yoshihiro ,  FUKAYA, Tomohiro ,  OKAMURA, Katsumi

IPC分类号： C04B41/87 ,  B23B27/14 ,  B23B27/20 ,  C04B35/583

CPC分类号： C04B41/4531 ,  B22F2005/001 ,  B23B27/141 ,  B23B2224/04 ,  B23B2224/24 ,  B23B2224/32 ,  B23B2226/125 ,  B23B2228/10 ,  B23K31/025 ,  C04B35/10 ,  C04B35/56 ,  C04B35/5831 ,  C04B35/645 ,  C04B37/006 ,  C04B37/026 ,  C04B41/009 ,  C04B41/4529 ,  C04B41/87 ,  C04B2235/3847 ,  C04B2235/386 ,  C04B2235/3895 ,  C04B2235/402 ,  C04B2235/404 ,  C04B2235/5436 ,  C04B2235/72 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/36 ,  C04B2237/361 ,  C04B2237/401 ,  C04B2237/704 ,  C04B2237/708 ,  C22C26/00 ,  C22C2026/003 ,  C23C14/06 ,  C23C14/0664 ,  Y10T29/49995 ,  Y10T407/27 ,  Y10T428/25 ,  Y10T428/265 ,  C04B41/5063 ,  C04B41/5068 ,  C04B41/5061 ,  C04B41/5062 ,  C04B41/5031

公开(公告)号：EP3042729A1

公开(公告)日：2016-07-13

申请号：EP15150825.6

申请日：2015-01-12

申请人： Sandvik Intellectual Property AB

发明人： Sandaldjian, Camille ,  David, Emmanuel

IPC分类号： B23C5/10 ,  C04B37/02

CPC分类号： B23C5/10 ,  B23C5/006 ,  B23C5/18 ,  B23C2210/02 ,  B23C2210/03 ,  B23C2222/28 ,  B23C2226/18 ,  B23C2240/08 ,  B23C2240/32 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/368 ,  C04B2237/401 ,  C04B2237/76 ,  C04B2237/86

摘要： The invention relates to a milling device (1), rotatable in one direction around a longitudinal center axis (A) defining a forward direction and an opposite rearward direction, comprising a front part (3) and a rear part (2). The front part (3) comprising cutting edges (4, 4') each having a longitudinal extension, the front part (3) comprising chip flutes (5, 5') each having a longitudinal extension, the front part (3) is made of a monolithic piece of ceramic. The rear part (2) is configured to be fixed in a rotatable tool body or a rotatable chuck. The rear part (2) is made of a monolithic piece of cemented carbide. A front end surface of the rear part (2) having a smaller area than a rear end surface of the front part (3), the front end surface of the rear part (2) and a rear end surface of the front part (3) being permanently bonded or brazed to each other by a joint.

摘要翻译： 本发明涉及一种铣削装置（1），其可围绕限定前进方向和相反向后方向的纵向中心轴线（A）沿一个方向旋转，包括前部（3）和后部（2）。 所述前部（3）包括各自具有纵向延伸部的切割刃（4,4'），所述前部（3）包括各自具有纵向延伸部的切屑槽（5,5'），所述前部（3）被制成 的一块整体陶瓷。 后部（2）构造成固定在可旋转的工具主体或可旋转卡盘中。 后部（2）由一块硬质合金制成。 后部（2）的前端面具有比前部（3）的后端面小的面积，后部（2）的前端面和前部（3）的后端面 ）通过接头永久地粘合或钎焊。

公开(公告)号：EP2727898A4

公开(公告)日：2016-03-23

申请号：EP12803785

申请日：2012-07-02

申请人： HITACHI METALS LTD

发明人： IMAMURA HISAYUKI ,  FUJITA SUGURU ,  WATANABE JUNICHI

IPC分类号： B22F7/06 ,  B22F9/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K101/40 ,  C04B37/02 ,  C22C1/04 ,  C22C5/06 ,  C22C5/08 ,  H01L23/15 ,  H01L23/373 ,  H05K1/03 ,  H05K3/38

CPC分类号： H01L23/34 ,  B22F7/062 ,  B22F9/023 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K2201/40 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/6581 ,  C04B2235/96 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/597 ,  C04B2237/704 ,  C04B2237/706 ,  C22C1/0466 ,  C22C5/06 ,  C22C5/08 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  Y10T428/12014 ,  Y10T428/249969 ,  H01L2924/00