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公开(公告)号：EP3465750A1
公开(公告)日：2019-04-10
申请号：EP17728740.6
申请日：2017-05-26
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公开(公告)号：EP3357089A1
公开(公告)日：2018-08-08
申请号：EP16753519.4
申请日：2016-08-03
CPC分类号： H02M7/537 , H01L23/645 , H01L25/072 , H01L25/18 , H01L2224/4903 , H01L2224/49175 , H01L2924/19107 , H02G5/005 , H02M7/003 , H05K3/30 , H05K7/02
摘要： A method and system for a power module device is provided. The device includes a base, a circuit board including a plurality of gated switches formed of a semiconductor material, and an electrical bus member configured to connect to a voltage source having a first polarity. The bus member includes a length that is substantially greater than a width of the bus member and the width is substantially greater than a thickness of the bus member. The power module device also includes a second bus member configured to connect to a voltage source having a second polarity. The second bus member is positioned in a nested face-to-face configuration with respect to the first bus member. The power module device further includes a layer of electrical insulation positioned between the first bus member and the second bus member.
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公开(公告)号：EP3443588A1
公开(公告)日：2019-02-20
申请号：EP17719455.2
申请日：2017-04-12
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