公开(公告)号：EP4386791A3

公开(公告)日：2024-08-14

申请号：EP23208426.9

申请日：2023-11-08

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Hong, Hyuk Jin ,  Song, Young Hoon

IPC分类号： H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01G4/232 ,  H01G4/008

CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/0085 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/2325

摘要： A multilayer ceramic capacitor includes a body including a capacitance region in which a plurality of first internal electrodes and a plurality of second internal electrodes are alternately stacked in a first direction with a dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and spaced apart from each other to be connected to the plurality of first internal electrodes and the plurality of second internal electrodes, respectively, wherein the capacitance region includes one or more groups of first openings. The first openings in each group overlap in the first direction and are continuously open in two or more internal electrodes of the plurality of first and second internal electrodes, and a number of internal electrodes included in each group is less than a total number of the plurality of first internal electrodes and the plurality of second internal electrodes.

公开(公告)号：EP4345855A3

公开(公告)日：2024-08-14

申请号：EP23187247.4

申请日：2023-07-24

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Hong, Hyukjin ,  Hong, Kipyo ,  Song, Young-Hoon ,  Kim, Dongju

IPC分类号： H01G4/012 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H01G4/248

CPC分类号： H01G4/012 ,  H01G4/30 ,  H01G4/232 ,  H01G4/005 ,  H01G4/248 ,  H01G4/12

摘要： A multilayered capacitor includes a capacitor body including dielectric layers, a pair of first internal electrode layers with a first one of the dielectric layers interposed therebetween and a pair of second internal electrode layers stacked with a second one of the dielectric layers interposed therebetween, and a first external electrode and a second external electrode on both sides of the capacitor body in a longitudinal direction of the capacitor body. The pair of first internal electrode layers are respectively connected to the first external electrode and the second external electrode and the pair of second internal electrode layers are respectively connected to the first external electrode and the second external electrode. In a width direction of the capacitor body, an average length of the pair of first internal electrode layers and an average length of the pair of second internal electrode layers are different.

公开(公告)号：EP4386789A3

公开(公告)日：2024-08-07

申请号：EP23213312.4

申请日：2023-11-30

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Son, Won Su ,  Park, Myeong Hak ,  Hong, Ki Pyo

IPC分类号： H01G2/02 ,  H01G2/10 ,  H01G4/12 ,  H01G4/18 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/32 ,  H01G4/38 ,  H01G4/40 ,  H01G4/012 ,  H01G4/224 ,  H01G4/248

CPC分类号： H01G4/30 ,  H01G4/228 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/1227 ,  H01G4/40 ,  H01G2/02 ,  H01G2/106 ,  H01G4/32 ,  H01G4/38 ,  H01G4/18 ,  H01G4/248 ,  H01G4/1209 ,  H01G4/012 ,  H01G4/224

摘要： A multilayer ceramic capacitor (100a) includes a body (110) including a capacitance region (115) in which a first internal electrode (121) and a second internal electrode (122) are alternately stacked in a first direction (T) with a dielectric layer (111) interposed therebetween and first and second external electrodes (131, 132) spaced apart from each other with the capacitance region (115) interposed therebetween and connected to the first and second internal electrodes (121, 122) respectively. The body (110) further includes cover layers (112) disposed on the capacitance region (115) in the first direction (T), a plurality of depressions or groove (141a, 142a, 141b, 142b) are disposed in an cover surface (112, 113) of the body (110) in the first direction (T), the depressions (141a, 142a, 141b, 142b) are spaced apart from outer end surfaces of the body (110) in the second direction (L), and a bending length of each external electrode (131, 132) in the second direction (L) is greater than a longest distance from each of the outer end surfaces of the body in the second direction (L) to a closer one of the depressions (141a, 141b, 142a, 142b). Therefore, the multilayer ceramic capacitor (100a) have an improved reliability by stably blocking the penetration of external moisture or foreign contaminant.

公开(公告)号：EP4394827A2

公开(公告)日：2024-07-03

申请号：EP23217578.6

申请日：2023-12-18

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Han, Jihye ,  Choi, Hong Je ,  Kang, Byungwoo ,  Park, Hyejin ,  Yun, Suyun ,  Lee, Sangwook ,  Kim, Jungmin

IPC分类号： H01G4/12 ,  H01G4/232 ,  H01G4/30

CPC分类号： H01G4/30 ,  H01G4/2325 ,  H01G4/232 ,  H01G4/12

摘要： Disclosed is a multilayered capacitor (100) that includes a capacitor body (110) including a dielectric layer (111) and an internal electrode (121,122), and an external electrode (131, 132) outside the capacitor body (110), wherein the external electrode (131, 132) includes a first layer (1311, 1321) connected to the internal electrode (121, 122), a second layer 81312, 1322) covering a portion of the first layer (1311, 1321) and exposing another portion, a third layer (1313, 1323) covering the second layer (1312, 1322) and including a first resin and a first conductive metal, and a fourth layer (1314, 1324) covering the first (1311, 1321) and third (1313, 1323) layers, and an area ratio of the second resin and second conductive metal, included in the second layer (1312, 1322) is greater than an area ratio of the resin included in the third layer (1313, 1323).

公开(公告)号：EP4383293A2

公开(公告)日：2024-06-12

申请号：EP23196331.5

申请日：2023-09-08

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Lee, Kangha ,  Park, Jin Soo ,  Park, Yoona ,  Choi, So Eun ,  Choi, Eun Byeol ,  Lee, Chul Seung

IPC分类号： H01G4/232 ,  H01G4/12 ,  H01G4/30

CPC分类号： H01G4/30 ,  H01G4/2325 ,  H01G4/232 ,  H01G4/12

摘要： An external electrode of a multilayer electronic component includes a base electrode layer and a corner electrode layer disposed at a corner of a body and disposed on the base electrode layer, wherein an area ratio of metal of the corner electrode layer is 90% or more.

公开(公告)号：EP4369368A1

公开(公告)日：2024-05-15

申请号：EP22315286.9

申请日：2022-11-14

申请人： Murata Manufacturing Co., Ltd.

发明人： Buffle, Larry ,  Voiron, Frédéric

IPC分类号： H01G4/10 ,  H01L29/41 ,  H01L29/66 ,  H01L29/94 ,  H01G4/33 ,  H01G4/005 ,  H01G4/012 ,  H01L21/3213 ,  H01L21/302 ,  H01G4/08 ,  H01L27/02 ,  H01G4/38 ,  H01L21/768 ,  H10N97/00 ,  H01G4/12

CPC分类号： H01L21/302 ,  H01L21/3213 ,  H01L28/90 ,  H01G4/33 ,  H01G4/012 ,  H01G4/385 ,  H01G4/005 ,  H01G4/12 ,  H01G4/085 ,  H01G4/10 ,  H01L29/945 ,  H01L21/76877 ,  H01L21/76831

摘要： The present invention relates to an electrical device for high-voltage applications and a method for obtaining an electrical device. The proposed electrical device (100) comprises a capacitor including:
- a bottom electrode (110) comprising a conductive structure, the conductive structure comprising a base surface and facing protruding walls (111) extending upwards and having a highest surface;
- a top electrode (120) comprising at least one conductive region (121) arranged between the facing protruding walls (111) and having a top surface, wherein the top surface of said at least one conductive region (121) lies below or at the level of the highest surface of the protruding walls (111); and
- a dielectric region (130) extending conformally over the bottom electrode (110) and surrounding the top electrode (120), said capacitor being formed by the bottom (110) and top (120) electrodes separated by the dielectric region (130).

公开(公告)号：EP3409652A1

公开(公告)日：2018-12-05

申请号：EP17382320.4

申请日：2017-05-31

申请人： Consejo Superior de Investigaciones Científicas (CSIC)

发明人： ALGUERÓ GIMÉNEZ, Miguel ,  AMORÍN GONZÁLEZ, Harvey ,  CASTRO LOZANO, Alicia

IPC分类号： C04B35/462 ,  C04B35/472 ,  C04B35/626 ,  C04B35/64 ,  H01L41/43 ,  H01L41/187 ,  H01G4/12 ,  G01R33/09 ,  H01L43/08

CPC分类号： C04B35/462 ,  C04B35/472 ,  C04B35/6261 ,  C04B35/62675 ,  C04B35/64 ,  C04B2235/3262 ,  C04B2235/3296 ,  C04B2235/3298 ,  C04B2235/5436 ,  C04B2235/604 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/76 ,  C04B2235/765 ,  C04B2235/768 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/85 ,  G01R33/09 ,  H01G4/12 ,  H01G4/1218 ,  H01L41/187 ,  H01L41/43 ,  H01L43/08

摘要： The invention relates to a fully dense and ultrafine grained high temperature piezoelectric BiScO 3 -PbTiO 3 ceramic material of formula Bi 1-x+2y Pb x-3y Sc 1-x Ti x O 3 , wherein x ranges from 0.64 to 0.68 and y ranges from 0.01 to 0,025, which includes a point defect engineering for high voltage response and an optimized microstructure for enhanced fracture strength. Furthermore, the invention refers to a process for obtaining said piezoelectric ceramic material by hot pressing of nanocrystalline powders derived by mechanosynthesis from a stoichiometric mixture of precursors and to the use of said piezoelectric ceramic material as part of a sensing device. Moreover, the invention relates a magnetoelectric composite comprising said piezoelectric ceramic material and a magnetostrictive material, the process for obtaining said magnetoelectric composite and its use as part of a magnetic sensing device.

公开(公告)号：EP3343576A3

公开(公告)日：2018-12-05

申请号：EP17191967.3

申请日：2013-11-18

申请人： Kemet Electronics Corporation

发明人： MCCONNELL, John, E. ,  BULTITUDE, John ,  HILL, R., Allen ,  RENNER, Garry, L.

IPC分类号： H01G4/30 ,  H01G4/38 ,  H01G4/232 ,  H01G4/12

CPC分类号： H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38

摘要： A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

公开(公告)号：EP3392889A1

公开(公告)日：2018-10-24

申请号：EP17747450.9

申请日：2017-02-01

申请人： TDK Corporation

发明人： YAMAZAKI, Kumiko ,  CHIHARA, Hiroshi ,  NAGAMINE, Yuki ,  YAMAZAKI, Junichi

IPC分类号： H01G4/33 ,  C04B35/50 ,  H01B3/00 ,  H01G4/12

CPC分类号： C04B35/50 ,  H01B3/00 ,  H01G4/12 ,  H01G4/33

摘要： [Problem] To provide a polycrystalline dielectric thin film and capacitor element having a small dielectric loss tan δ.
[Solution] A polycrystalline dielectric thin film, in which the main composition is a perovskite oxynitride. The perovskite oxynitride is expressed by the compositional formula AaBbOoNn (a+b+o+n = 5), where a/b > 1 and n ≥ 0.7.

公开(公告)号：EP3366348A1

公开(公告)日：2018-08-29

申请号：EP18161296.1

申请日：2013-01-16

申请人： Greatbatch Ltd.

发明人： STEVENSON, Robert A. ,  MARZANO, Thomas ,  SEITZ, Keith W. ,  WINN, Steven W. ,  FRYSZ, Christine A. ,  BRENDEL, Richard L. ,  WOODS, Jason ,  FRUSTACI, Dominick J. ,  TANG, Xiaohong ,  THIEBOLT, William C.

IPC分类号： A61N1/375 ,  B22F3/00 ,  H01L21/77 ,  H05K3/40

CPC分类号： A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

摘要： A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.