公开(公告)号：EP4443454A2

公开(公告)日：2024-10-09

申请号：EP24195877.6

申请日：2022-03-30

Applicant: Elna Co., Ltd.

Inventor： NAKAMURA, Tadahiro ,  MATSUMURA, Kaori ,  KIMURA, Naozumi

IPC: H01G4/228

CPC classification number: H01G2/06 ,  H01G2/103 ,  H01G2/106 ,  H05K1/184 ,  H01G9/28 ,  H01G9/0029 ,  H01G9/008 ,  H01G9/10 ,  H05K3/3447 ,  H05K3/3426 ,  H05K3/306 ,  H05K3/301

Abstract: [Problem to be Solved]
To suppress the generation of voids or cracks due to flux gas generated at the time of soldering, in a chip type capacitor formed by attaching a seat plate to a capacitor.
[Solution]
When providing auxiliary terminals 20 for increasing the soldering strength on a seat plate 10 for chipping, which enables a lead same direction type capacitor to be surface mounted, a gas release groove 24, preferably formed as a slit to release flux gas generated at the time of soldering, is formed on each of the auxiliary terminals 20.

公开(公告)号：EP2174327B1

公开(公告)日：2018-01-03

申请号：EP08760034.2

申请日：2008-05-27

Applicant: Siemens Aktiengesellschaft

Inventor： BØ, Ove

IPC: H01G2/10 ,  H01G4/224 ,  H01G9/08 ,  H01G2/12

CPC classification number: H01G2/103 ,  H01G2/12 ,  H01G9/08 ,  Y10T29/417

Abstract: The invention refers to an electronic component (2) for application in high pressure environments comprising a casing (4) entirely filled with an electrically insulating first fluid (F1), whereby the casing (4) exhibits or connects to a volume compensation unit for compensating a volume change of the first fluid (F1). Furthermore the invention refers to an electric device (1) comprising at least one such electronic component (2) in a device housing (10), whereby the device housing (10) is filled with a second fluid (F2).

公开(公告)号：EP3109874B1

公开(公告)日：2017-12-20

申请号：EP16176278.6

申请日：2016-06-24

Applicant: Kemet Electronics Corporation

Inventor： Wright Mark ,  Candy Gavin

IPC: H01G2/06 ,  H01G9/025 ,  H01G9/035

CPC classification number: H01G9/08 ,  H01G2/103 ,  H01G9/012 ,  H01G9/028 ,  H01G9/032 ,  H01G9/035 ,  H01G9/06 ,  H01G9/151

公开(公告)号：EP2816624A1

公开(公告)日：2014-12-24

申请号：EP14172883.2

申请日：2014-06-18

Applicant: STMicroelectronics (Crolles 2) SAS ,  COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Joblot, Sylvain ,  Colonna, Jean-Philippe ,  Guiller, Olivier ,  Mourier, Thierry

IPC: H01L49/02 ,  H01L21/768 ,  H01L23/48 ,  H01L23/64

CPC classification number: H01L28/40 ,  H01G2/103 ,  H01G4/236 ,  H01G4/35 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/642 ,  H01L28/90 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Dispositif comprenant un substrat (SB), une partie d'interconnexion de circuit intégré (12) disposée au dessus d'une première face (F1) du substrat, au moins un condensateur (CD) traversant ledit substrat possédant une première électrode ayant une première face de contact (F41) électriquement couplée à une première zone électriquement conductrice disposée au dessus d'une deuxième face (F3) du substrat et une deuxième électrode électriquement couplée à ladite partie d'interconnexion, au moins une liaison électriquement conductrice (LT) traversant le substrat ayant d'une part une première face de contact (F42) électriquement couplée à une deuxième zone électriquement conductrice disposée au dessus de ladite deuxième face du substrat et d'autre part une partie électriquement couplée à ladite partie d'interconnexion, lesdites deux premières faces de contact (F41, F42) étant situées dans un même plan.

公开(公告)号：EP2812935A1

公开(公告)日：2014-12-17

申请号：EP13702816.3

申请日：2013-02-07

Applicant: Blue Solutions

Inventor： VIGNERAS, Erwan

IPC: H01M2/02 ,  H01G2/10 ,  H01G9/10 ,  H01G9/08 ,  H01G9/00 ,  H01G11/78 ,  H01G11/80 ,  H01G11/84

CPC classification number: H01G9/10 ,  H01G2/10 ,  H01G2/103 ,  H01G2/106 ,  H01G9/0029 ,  H01G9/08 ,  H01G9/145 ,  H01G11/78 ,  H01G11/80 ,  H01G11/84 ,  H01G13/003 ,  H01M2/04 ,  H01M2/0434 ,  Y02E60/13 ,  Y10T29/417

Abstract: The invention relates to a method for manufacturing a unit for storing electrical energy, comprising a cover and an outer casing, the method including a closing step (400) consisting of contactlessly applying a compressive force to one of the parts forming the storage unit, such that the cover and the outer casing are mechanically fitted into one another so as to close the outer casing using the cover by means of the engagement of the shapes thereof.

Abstract translation: 本发明涉及一种用于制造用于存储电能的单元的方法，包括盖和外壳，该方法包括一个闭合步骤（400），该闭合步骤（400）包括非接触地向构成存储单元的部件之一施加压缩力， 盖和外壳被机械地标记成彼此，以便通过其形状的接合来使用盖封闭外壳。

公开(公告)号：EP2234131B1

公开(公告)日：2013-01-23

申请号：EP08851546.5

申请日：2008-11-13

Applicant: Meidensha Corporation

Inventor： ASAI, Takahiro

IPC: H01M2/10 ,  H01G9/08

CPC classification number: H01G2/103 ,  H01G9/08 ,  H01G9/155 ,  H01M2/1016 ,  H01M2/1061 ,  H01M2/1072 ,  Y02E60/13 ,  Y10T428/24479 ,  Y10T428/24504

公开(公告)号：EP1191556B1

公开(公告)日：2011-11-02

申请号：EP01118707.7

申请日：2001-08-03

Applicant: Greatbatch Ltd.

Inventor： Brendel, Richard L. ,  Stevenson, Robert A.

IPC: H01G4/35 ,  A61N1/375

CPC classification number: A61N1/3754 ,  H01G2/103 ,  H01G4/35

公开(公告)号：EP1690269B1

公开(公告)日：2009-01-14

申请号：EP03773405.0

申请日：2003-11-28

Applicant: Maxwell Technologies, Inc.

Inventor： SAVARY, Etienne ,  SCHEIDEGGER, Cédric ,  GALLEY, Albert

IPC: H01G2/10 ,  H05K5/06

CPC classification number: H01G2/103 ,  H05K5/061 ,  H05K5/062

Abstract: The invention relates to a method for applying a double sealing system to an electro-technical device and an electro-technical device with a double seal. Said Electro-technical device comprises ; a container (5) housing a functional unit (2) and including one aperture (52) provided with a cover (6), wherein said cover has a first face (61) abutting an annular surface (520) which borders said aperture (52) ; a first sealing joint (7) accommodated in a first groove (64) provided in the first face (61) of the annular surface (520), a second groove (65) provided on said first face (61) of the annular surface (520), and surrounding the first groove (64), said second groove (65) having a closed concavity not directly accessible from the exterior of the electro-technical device (1) when the cover is applied to the annular surface (520). Said device futher comprises a first channel (651) for connecting the second groove (65) to a first external point of injection (9) and a second sealing joint (8), made by injection moulding of a sealing substance (81) after the cover has been applied to said annular surface, provided in the second groove (65).

公开(公告)号：EP1690269A1

公开(公告)日：2006-08-16

申请号：EP03773405.0

申请日：2003-11-28

Applicant: Maxwell Technologies SA

Inventor： SAVARY, Etienne ,  SCHEIDEGGER, Cédric ,  GALLEY, Albert

IPC: H01G2/10 ,  H05K5/06

CPC classification number: H01G2/103 ,  H05K5/061 ,  H05K5/062

Abstract: The invention relates to a method for applying a double sealing system to an electro-technical device and an electro-technical device with a double seal. Said Electro-technical device comprises ; a container (5) housing a functional unit (2) and including one aperture (52) provided with a cover (6), wherein said cover has a first face (61) abutting an annular surface (520) which borders said aperture (52) ; a first sealing joint (7) accommodated in a first groove (64) provided in the first face (61) of the annular surface (520), a second groove (65) provided on said first face (61) of the annular surface (520), and surrounding the first groove (64), said second groove (65) having a closed concavity not directly accessible from the exterior of the electro-technical device (1) when the cover is applied to the annular surface (520). Said device futher comprises a first channel (651) for connecting the second groove (65) to a first external point of injection (9) and a second sealing joint (8), made by injection moulding of a sealing substance (81) after the cover has been applied to said annular surface, provided in the second groove (65).

公开(公告)号：EP1278218B1

公开(公告)日：2004-11-03

申请号：EP02014530.6

申请日：2002-07-01

Applicant: DUCATI ENERGIA S.p.A.

Inventor： Battistoni, Claudio ,  Capponcelli, Moreno ,  Gurrieri, Claudio

IPC: H01G9/08 ,  H01G9/10 ,  H01G2/02 ,  H01G2/10

CPC classification number: H01G2/103