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    Wiring method and apparatus for electronic circuit boards or the like
    5.
    发明公开
    Wiring method and apparatus for electronic circuit boards or the like 失效
    电子电路板的布线方法和装置等

    公开(公告)号：EP0319827A3

    公开(公告)日：1990-01-17

    申请号：EP88119876.6

    申请日：1988-11-29

    申请人： HITACHI, LTD.

    发明人： Hasegawa, Hiroshi Ekureru Ninomiya 404 ,  Amimoto, Toshiyuki ,  Tani, Mitsukiyo

    IPC分类号： H05K7/06 ,  H05K13/06

    CPC分类号： H05K3/222 ,  H05K7/06 ,  H05K13/06 ,  Y10T29/49162 ,  Y10T29/49167 ,  Y10T29/49169 ,  Y10T156/1002 ,  Y10T156/1007

    摘要： A wiring method for an electronic device (32) including a plurality of electronic components (21) and a plurality of connector elements (23, 24) for inter­connecting the plurality of electronic components, the connector elements (23, 24) being arranged on the same plane in spaced relation to each other so as to define, between the connector elements, passages (25, 26) for permitting discrete lines (15, 15′) to pass. The wiring method comprises the steps of connecting a first discrete line (15) to a surface of a first connector element (23b) such that the first discrete line (15) extends on a first passage (25a) extending along the first connector element (23b), positioning at least two pins (52, 5b, 5c, 5d) along the first passage (25a) substantially vertically thereto, bending and deforming the first discrete line (15) along the at least two pins, and reducing a distance between the at least two pins, and removing the at least two pins away from the first passage (25a). The method further comprises the steps of connecting a second discrete line (15′) to a surface of a second connector element (23a) located along the first passage (25a), such that the second discrete line (15′) extends on the first passage, positioning the at least two pins (5a, 5b, 5c, 5d) along the first discrete line (15) substantially vertically to the first passage (25a), bending and deforming the second discrete line (15′) along the at least two pins positioned along the first discrete line (15), to superimpose the second discrete line (15′) upon the first discrete line (15), and reducing the distance between the at least two pins positioned along the first discrete line, and removing the at least two pins away from the first passage, thereby wiring the second discrete line to the second connector element.

    Wiring method and apparatus for electronic circuit boards or the like
    6.
    发明公开
    Wiring method and apparatus for electronic circuit boards or the like 失效
    Verdrahtungsverfahren undGerätfürelektronische Schaltungsplatten oder dergleichen。

    公开(公告)号：EP0319827A2

    公开(公告)日：1989-06-14

    申请号：EP88119876.6

    申请日：1988-11-29

    申请人： HITACHI, LTD.

    发明人： Hasegawa, Hiroshi Ekureru Ninomiya 404 ,  Amimoto, Toshiyuki ,  Tani, Mitsukiyo

    IPC分类号： H05K7/06 ,  H05K13/06

    CPC分类号： H05K3/222 ,  H05K7/06 ,  H05K13/06 ,  Y10T29/49162 ,  Y10T29/49167 ,  Y10T29/49169 ,  Y10T156/1002 ,  Y10T156/1007

    摘要： A wiring method for an electronic device (32) including a plurality of electronic components (21) and a plurality of connector elements (23, 24) for inter­connecting the plurality of electronic components, the connector elements (23, 24) being arranged on the same plane in spaced relation to each other so as to define, between the connector elements, passages (25, 26) for permitting discrete lines (15, 15′) to pass. The wiring method comprises the steps of connecting a first discrete line (15) to a surface of a first connector element (23b) such that the first discrete line (15) extends on a first passage (25a) extending along the first connector element (23b), positioning at least two pins (52, 5b, 5c, 5d) along the first passage (25a) substantially vertically thereto, bending and deforming the first discrete line (15) along the at least two pins, and reducing a distance between the at least two pins, and removing the at least two pins away from the first passage (25a). The method further comprises the steps of connecting a second discrete line (15′) to a surface of a second connector element (23a) located along the first passage (25a), such that the second discrete line (15′) extends on the first passage, positioning the at least two pins (5a, 5b, 5c, 5d) along the first discrete line (15) substantially vertically to the first passage (25a), bending and deforming the second discrete line (15′) along the at least two pins positioned along the first discrete line (15), to superimpose the second discrete line (15′) upon the first discrete line (15), and reducing the distance between the at least two pins positioned along the first discrete line, and removing the at least two pins away from the first passage, thereby wiring the second discrete line to the second connector element.

    摘要翻译： 一种电子设备（32）的布线方法，包括多个电子部件（21）和用于互连多个电子部件的多个连接器元件（23,24），连接器元件（23,24）布置在 相同的平面彼此间隔开，以便在连接器元件之间限定用于允许离散线路（15,15分钟）通过的通道（25,26）。 布线方法包括以下步骤：将第一离散线（15）连接到第一连接器元件（23b）的表面，使得第一离散线（15）在沿着第一连接器元件延伸的第一通道（25a）上延伸 23b），沿着第一通道（25a）大致垂直定位至少两个销（52,5b，5c，5d），沿着至少两个销弯曲和变形第一离散线（15），并且减小 所述至少两个销，并且将所述至少两个销移除离开所述第一通道（25a）。 该方法还包括以下步骤：将第二离散线（15分钟）连接到沿着第一通道（25a）定位的第二连接器元件（23a）的表面，使得第二离散线（15分钟）在第一离散线 沿着第一离散线（15）将至少两个销（5a，5b，5c，5d）定位成基本上垂直于第一通道（25a），使至少两个销（5a，5b，5c，5d）沿着至少第二离散线（15分钟） 沿着第一离散线（15）定位的两个销，以将第二离散线（15分钟）叠加在第一离散线（15）上，并且减小沿着第一离散线定位的至少两个销之间的距离，以及移除 所述至少两个销远离所述第一通道，从而将所述第二离散线布线到所述第二连接器元件。