专利检索 cpc:"H01L2224/05553" 第 1 页

1.

发明授权
IC package with insulating structure and a method of making it 审中-公开

公开(公告)号：EP2775522B1

公开(公告)日：2018-12-26

申请号：EP14156529.1

申请日：2014-02-25

申请人： Analog Devices Global Unlimited Company

发明人： O'Sullivan, Laurence Brendan

IPC分类号： H01L23/495 , H01L23/31 , H01L23/50

CPC分类号： H01L21/762 , H01L23/3114 , H01L23/49575 , H01L23/50 , H01L29/0649 , H01L2224/05553 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/49171 , H01L2224/49175 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

摘要： A method of forming an insulating structure, comprising forming an insulating region comprising at least one electrical or electronic component or part thereof embedded within the insulating region, and forming a surface structure in a surface of the insulating region.

2.

发明授权
Method of manufacturing a semiconductor apparatus 有权

公开(公告)号：EP2477223B1

公开(公告)日：2018-12-12

申请号：EP11195847.6

申请日：2011-12-28

申请人： Fuji Electric Co., Ltd.

发明人： Katsuki, Takashi

IPC分类号： H01L23/495 , H01L23/31 , F02P3/045

CPC分类号： H01L24/92 , F02P3/0453 , H01L23/3107 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L23/49589 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/29101 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48755 , H01L2224/4903 , H01L2224/73265 , H01L2224/838 , H01L2224/85455 , H01L2224/92 , H01L2224/922 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19106 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/00012 , H01L2224/83 , H01L2224/85

摘要： A method of manufacturing a semiconductor apparatus according to the invention includes the steps of: coating solder 31 on an predetermined area in the upper surface of lead frame 30; mounting chip 32 on solder 31; melting solder 31 with hot plate 33 for bonding chip 32 to lead frame 30; wiring with bonding wires 34; turning lead frame 30 upside down; placing lead frame 30 turned upside down on heating cradle 35; coating solder 36, the melting point of which is lower than the solder 31 melting point; mounting electronic part 37 on solder 36; and melting solder 36 with heating cradle 35 for bonding electronic part 37 to lead frame 30. The bonding with solder 36 is conducted at a high ambient temperature. The semiconductor apparatus and the manufacturing method thereof facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps.

3.

发明授权
Method of producing a semiconductor device with protruding contacts 有权
标题翻译：制造具有突出触点的半导体器件的方法

公开(公告)号：EP2905611B1

公开(公告)日：2018-01-17

申请号：EP14154132.6

申请日：2014-02-06

申请人： ams AG

发明人： Kraft, Jochen , Rohracher, Karl , Schrems, Martin

IPC分类号： G01N27/12

CPC分类号： H01L24/02 , G01N27/12 , G01N27/128 , H01L21/76898 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L2224/02315 , H01L2224/02331 , H01L2224/02372 , H01L2224/02373 , H01L2224/0401 , H01L2224/05024 , H01L2224/05026 , H01L2224/05548 , H01L2224/05553 , H01L2224/05554 , H01L2224/05567 , H01L2224/0603 , H01L2224/06051 , H01L2224/114 , H01L2224/1148 , H01L2224/1161 , H01L2224/11616 , H01L2224/13013 , H01L2224/13022 , H01L2224/13026 , H01L2924/00012 , H01L2924/00014

摘要： The semiconductor device comprises a semiconductor substrate (1), a dielectric layer (2) on or above the substrate (1), a wiring (3) comprising electrical conductors (4, 5, 6, 7) arranged in the dielectric layer (2), and a contact pad (8) formed by one of the conductors (4). A further conductor (9) of electrically conductive material is arranged in the dielectric layer (2) in contact with a further one of the conductors (5), separate from the contact pad (8). The further conductor (9) protrudes from the dielectric layer (2) on a side opposite to the substrate.

4.

发明公开
SENSING CHIP ENCAPSULATION COMPONENT AND ELECTRONIC DEVICE WITH SAME 审中-公开
标题翻译：感测芯片封装组件及其电子装置

公开(公告)号：EP3214648A1

公开(公告)日：2017-09-06

申请号：EP16843627.7

申请日：2016-09-06

申请人： Shenzhen Goodix Technology Co., Ltd.

发明人： LIU, Yuping , LONG, Wei

IPC分类号： H01L23/495 , H01L23/488 , G01D5/12

CPC分类号： H01L23/562 , H01L21/4825 , H01L21/4828 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/488 , H01L23/49503 , H01L23/4952 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/16245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48479 , H01L2224/48499 , H01L2224/49433 , H01L2924/10161 , H01L2924/15747 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2924/00014 , H01L2924/20751

摘要： A sensor chip package assembly and an electronic device having the sensor chip package assembly are disclosed, where the sensor chip package assembly includes: a metal substrate (100) which has a bonding pad region (11) and a placement region (12), the bonding pad region having a plurality of metal bonding pads (13); a sensor chip (200) which is located on an upper surface of the metal substrate, and the sensor chip having a plurality of sensor chip bonding pads (21); an electrical connection assembly (300) which electrically connects a metal bonding pad and a sensor chip bonding pad; and a packaging material cover (400) which covers the metal substrate, the sensor chip and the electrical connection assembly, where any two adjacent metal bonding pads are spaced in an insulated manner by the packaging material cover. The sensor chip package assembly has advantages of a short development period and small warpage, thus improving efficiency of subsequent assembly while saving cost. In addition, since a plurality of metal bonding pads are independent from each other on a metal substrate, independent transmission of a plurality of signals between a sensor chip and the metal substrate may be realized, thus dramatically reducing risk of interference among the plurality of signals.

摘要翻译： 本发明公开了一种传感器芯片封装组件以及具有该传感器芯片封装组件的电子装置，其中传感器芯片封装组件包括：具有接合焊盘区域（11）和放置区域（12）的金属基板（100），该接合焊盘区域，其具有多个金属接合焊盘（13）; 位于所述金属基板的上表面的传感器芯片（200），所述传感器芯片具有多个传感器芯片接合用焊盘（21）。电连接组件（300），其电连接金属键合焊盘和传感器芯片键合焊盘; 以及覆盖所述金属基板，所述传感器芯片和所述电连接组件的封装材料盖（400），其中任意两个相邻的金属焊垫通过所述封装材料盖绝缘隔开。传感器芯片封装组件具有开发周期短，翘曲小的优点，从而提高后续组装的效率，同时节约成本。另外，由于多个金属接合焊盘在金属基板上彼此独立，因此可以实现传感器芯片与金属基板之间的多个信号的独立传输，从而显着降低了多个信号之间的干扰风险。