公开(公告)号：EP2371003B1

公开(公告)日：2018-07-04

申请号：EP08875951.9

申请日：2008-11-27

申请人： NXP USA, Inc.

发明人： REYNES, Jean Michel ,  BERNOUX, Beatrice ,  ESCOFFIER, Rene ,  JALBAUD, Pierre ,  DERAM, Ivana

IPC分类号： H01L29/78 ,  H01L29/10 ,  H01L29/06 ,  H01L23/485

CPC分类号： H01L29/7808 ,  H01L24/02 ,  H01L24/05 ,  H01L29/0696 ,  H01L29/1095 ,  H01L29/7802 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/4813 ,  H01L2224/4847 ,  H01L2224/49171 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00015 ,  H01L2924/00

摘要： A transistor power switch device comprising a semiconductor body presenting opposite first and second faces, an array of vertical field-effect transistor elements for carrying current between the first and second faces is provided. The array of transistor elements comprises at the first face an array of source regions of a first semiconductor type, at least one body region of a second semiconductor type opposite to the first type interposed between the source regions and the second face, at least one control electrode for switchably controlling flow of the current through the second transistor region, and a conductive layer contacting the source regions and insulated from the control electrode by at least one insulating layer.

公开(公告)号：EP2847797B1

公开(公告)日：2018-04-04

申请号：EP13723039.7

申请日：2013-05-02

申请人： NXP B.V.

发明人： ZIVKOVIC, Zoran ,  PONOMAREV, Youri

IPC分类号： H01L31/02 ,  H01L31/0216 ,  H01L27/144 ,  G01S3/784

CPC分类号： H01L31/0232 ,  G01S3/784 ,  H01L27/1443 ,  H01L27/14623 ,  H01L31/02024 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H01L2224/05 ,  H01L2224/4847

摘要： Disclosed is an integrated circuit comprising a substrate having a major surface; a directional light sensor, the directional light sensor comprising a plurality of photodetectors on a region of said major surface, said plurality of photodetectors comprising a set of first photodetectors for detecting light from a first direction and a set of second photodetectors for detecting light from a second direction, wherein a first photodetector is located adjacent to a second photodetector; and a light blocking structure comprising a first portion extending from said major surface in between the first photodetector and the second photodetector; and a second portion extending from the first portion and at least partially overhanging at least one of the first photodetector and the second photodetector. A device including such an IC and a method of manufacturing such an IC are also disclosed.

公开(公告)号：EP2447988B1

公开(公告)日：2015-05-06

申请号：EP10014222.3

申请日：2010-11-02

申请人： GE Energy Power Conversion Technology Limited

发明人： Crane, Allan, David ,  Hinchley, David ,  Loddick, Sean Joseph

IPC分类号： H01L23/051 ,  H01L23/00 ,  H01L23/31 ,  H01L23/60 ,  H01L25/11 ,  H01L29/06 ,  H01L29/12 ,  H03K17/56

CPC分类号： H01L29/0607 ,  H01L23/051 ,  H01L23/3185 ,  H01L23/60 ,  H01L24/06 ,  H01L24/48 ,  H01L24/72 ,  H01L25/117 ,  H01L29/0619 ,  H01L29/0661 ,  H01L29/12 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H03K17/56 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2856589A1

公开(公告)日：2015-04-08

申请号：EP13720812.0

申请日：2013-04-11

申请人： Robert Bosch GmbH

发明人： ASTNER, Martin ,  SCHWARZ, Hans-Jochen ,  LETSCH, Andreas

IPC分类号： H01S5/42 ,  H01S5/40

CPC分类号： H01S5/026 ,  H01L2224/4847 ,  H01L2224/49175 ,  H01S5/0224 ,  H01S5/02276 ,  H01S5/4018 ,  H01S5/4031 ,  H01S5/423

摘要： The invention relates to a circuit assembly (100) having at least two optoelectronic semiconductor components (120, 130), characterized in that a first optoelectronic semiconductor component (120) is arranged with an n-conducting surface (122) opposite an electrically conductive carrier surface (110) and is electrically conductively connected to the carrier surface (110) and in that a second optoelectronic semiconductor component (130) is arranged with a p-conducting surface (134) opposite the carrier surface (110) and is electrically conductively connected to the carrier surface (110).

公开(公告)号：EP2662895B1

公开(公告)日：2014-06-25

申请号：EP12167644.9

申请日：2012-05-11

申请人： NXP B.V.

发明人： Daamen, Roel ,  Nenadovic, Nebojsa ,  Lous, Erik

IPC分类号： H01L31/02 ,  H01L31/0216 ,  H01L27/144 ,  G01S3/784

CPC分类号： H01L27/14643 ,  G01S3/781 ,  G01S3/784 ,  H01L27/1446 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/02024 ,  H01L31/02164 ,  H01L2224/4847

公开(公告)号：EP2351166B1

公开(公告)日：2014-04-16

申请号：EP09778881.4

申请日：2009-09-30

申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

发明人： LINZ, Torsten

IPC分类号： H01L23/00 ,  H01R4/02 ,  H01R43/02 ,  H01R12/59 ,  H01R12/62

CPC分类号： H01R43/0228 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4847 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/8585 ,  H01L2224/85862 ,  H01L2224/8588 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01R4/029 ,  H01R12/59 ,  H01R12/62 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

公开(公告)号：EP2702607A2

公开(公告)日：2014-03-05

申请号：EP12776905.7

申请日：2012-04-25

申请人： Air Products and Chemicals, Inc.

发明人： COLLIER, Terence Quintin ,  RENNIE, David Barry ,  RAMAMURTHI, Rajkumar ,  PARRIS, Gene Everad

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  C11D7/265 ,  C11D11/0047 ,  H01L21/4835 ,  H01L23/3107 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/0381 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/83011 ,  H01L2224/83022 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/8501 ,  H01L2224/85011 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/83 ,  H01L2224/85

摘要： A method of processing a semiconductor substrate to remove undesired material therefrom or to prepare a surface of the semiconductor substrate for subsequent bonding wherein the substrate comprises a leadframe comprising dies, bond pads, contacts, and wires, the method comprises the step of contacting the substrate with a liquid cleaning composition and compositions useful in the method.

公开(公告)号：EP2662889A1

公开(公告)日：2013-11-13

申请号：EP12003603.3

申请日：2012-05-07

申请人： Heraeus Materials Technology GmbH & Co. KG

发明人： Milke, Eugen ,  Prenosil, Peter ,  Thomas, Sven

IPC分类号： H01L21/60 ,  H01L23/49 ,  H01B1/02

CPC分类号： H01L24/48 ,  B21C1/003 ,  B21C9/00 ,  B32B15/01 ,  H01B1/023 ,  H01B1/026 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/16151 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/207 ,  H01L2924/2075 ,  Y10T29/49117 ,  Y10T428/1275 ,  H01L2924/01028 ,  H01L2924/01014 ,  H01L2924/01012 ,  H01L2924/01008 ,  H01L2924/01205 ,  H01L2924/01204 ,  H01L2924/01203 ,  H01L2924/01201 ,  H01L2924/01206 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2224/05599 ,  H01L2924/00013 ,  H01L2924/01049

摘要： The invention relates to a ribbon, preferably a bonding ribbon for bonding in microelectronics, comprising a first layer comprising copper with a surface and at least a coating layer superimposed over the surface of the first layer, wherein the coating layer comprises aluminium, and an intermediate layer, wherein in a cross-sectional view of the ribbon the area share of the first layer is in the range of from 50 to 96 %, based on the total area of the cross-section of the ribbon, wherein the aspect ratio between the width and the height of the ribbon in a cross-sectional view is in the range of from 0.03 to less than 0.8, wherein the ribbon has a cross-sectional area in the range of from 25'000 µm 2 to 800'000 µm 2 , wherein the intermediate layer is arranged between the first layer and the coating layer, wherein the intermediate layer comprises at least one intermetallic phase comprising material of the first layer and material of the coating layer. The invention further relates to a process for making a wire, to a wire obtainable by said process, to an electric device comprising at least two elements and at least aforementioned wire, to a propelled device comprising said electric device and to a process of connecting two elements through aforementioned wire by wedge-bonding.

摘要翻译： 本发明涉及一种带状物，优选用于在微电子学中粘合的结合带，包括第一层，其包含具有表面的铜和至少叠加在第一层的表面上的涂层，其中该涂层包含铝，以及中间体 层，其中在所述带的横截面视图中，基于所述带的横截面的总面积，所述第一层的面积份额在50至96％的范围内，其中， 宽度和带状物的横截面视图中的高度在0.03至小于0.8的范围内，其中该带的横截面积在25'000μm2至800'000μm2的范围内 其中所述中间层布置在所述第一层和所述涂层之间，其中所述中间层包含至少一个包含所述第一层材料和所述涂层材料的金属间相。 本发明还涉及一种用于将线材制成的方法，可由所述方法可获得的线材组装到包括至少两个元件和至少前述的线材的电气设备到包括所述电气设备的推进设备以及连接两个 元件通过上述丝线通过楔形键合。

公开(公告)号：EP2624297A1

公开(公告)日：2013-08-07

申请号：EP11828710.1

申请日：2011-09-05

申请人： Hitachi Automotive Systems, Ltd.

发明人： IDE, Eiichi ,  HIRAMITSU, Shinji ,  HOZOJI, Hiroshi ,  TSUYUNO, Nobutake ,  NAKATSU, Kinya ,  TOKUYAMA, Takeshi ,  MATSUSHITA, Akira ,  TAKAGI, Yusuke

IPC分类号： H01L25/07 ,  H01L23/40 ,  H01L25/18

CPC分类号： H01L23/34 ,  H01L21/4825 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/3521 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1306 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/01047 ,  H01L2924/01029

摘要： A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface.

摘要翻译： 功率半导体模块包括在一个主表面上形成有多个控制电极的功率半导体元件，通过第一焊料材料连接到功率半导体元件的主表面之一的第一导体板，以及第二导体板 通过第二焊料材料在功率半导体元件的另一个主表面上接合。 在第一导体板上形成有从可应用的第一导体板的基部突出并且包括形成在上侧的第一突起表面的第一突出部。 第二突起部分，包括与功率半导体元件的主表面相对的一个形成的第二突起表面。 第一焊料材料插入在功率半导体元件和第一导体板之间，同时避免多个控制电极。 如果通过功率半导体元件的一个主表面从垂直方向突出，则第二突起部形成为使得第二突起表面的特定侧上的突出部分与形成的台阶部的突出部分重叠 在第一导体板的基部与第一突起部之间。 功率半导体元件上的多个控制电极沿着第二突起表面的特定侧形成。

公开(公告)号：EP2016607B1

公开(公告)日：2013-03-13

申请号：EP07749404.5

申请日：2007-01-29

申请人： Micron Technology, Inc.

发明人： HEMBREE, David, R. ,  WOOD, Alan, G.

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H01L21/48 ,  H01L21/768 ,  H01L25/065

CPC分类号： H01L24/16 ,  G01R1/06716 ,  G01R1/07307 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02125 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/0333 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/1134 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45116 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45684 ,  H01L2224/45698 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10155 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45164 ,  H01L2924/013 ,  H01L2924/00013