公开(公告)号：EP3107362A4

公开(公告)日：2016-12-28

申请号：EP14886101

申请日：2014-03-21

申请人： HUAWEI DEVICE CO LTD

发明人： YANG XIANGYANG ,  JIN LINFANG ,  LI HUALIN ,  TANG WENBING ,  ZOU JIE

IPC分类号： H05K7/20 ,  G06F1/16 ,  G06F1/20 ,  H04M1/02

CPC分类号： G06F1/203 ,  G06F1/1626 ,  H05K1/0203

摘要： A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder , the heat insulation area is adjacent to the heat conduction area , and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder , and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area , so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area , thereby reducing heat at the edge of the holder.

公开(公告)号：EP2943049A4

公开(公告)日：2016-03-16

申请号：EP14868704

申请日：2014-03-13

申请人： HUAWEI DEVICE CO LTD

发明人： JIN LINFANG ,  ZOU JIE ,  SUN HAO ,  YANG MINGXING

IPC分类号： H05K9/00

CPC分类号： H05K9/0049 ,  B29C45/14639 ,  B29K2995/0005 ,  B29L2031/3481 ,  G06F1/1656 ,  G06F1/182 ,  H05K9/0022 ,  H05K9/0081

摘要： Embodiments of the present invention disclose an electronic device and a shielding member production method. The electronic device includes: a metal member, a circuit board, and a shielding member, a through hole or slot is disposed on the metal member, and the metal member is a stamped metal member or a forged metal member; the circuit board is disposed opposite to the metal member, and an electronic component is disposed on the circuit board; the shielding member is fastened on the metal member, the shielding member includes a blocking portion and an enclosing portion, the blocking portion is made of an electrically conductive plastic material, the enclosing portion is made of a metal material or an electrically conductive plastic material, the blocking portion is configured to block the through hole or slot, the enclosing portion is disposed around the electronic component, one end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board; and the metal member, the blocking portion, the enclosing portion, and the circuit board form shielding space, and the electronic component is located in the shielding space.

公开(公告)号：EP3107361A4

公开(公告)日：2017-03-29

申请号：EP14886096

申请日：2014-03-18

申请人： HUAWEI DEVICE CO LTD

发明人： JIN LINFANG ,  XIAO YONGWANG ,  WANG GUOPING ,  ZOU JIE ,  LI HUALIN

IPC分类号： H05K7/20 ,  H01L23/427 ,  H01L23/552 ,  H05K9/00

CPC分类号： H01L23/427 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element. In the foregoing technical solution, a thermal interface material that is fitted on a heat-generating electronic element is fitted to a heat pipe by using a via hole disposed on a shielding element, so that heat of the heat-generating electronic element may be transferred to the heat pipe through the thermal interface material, which reduces thermal resistance of a heat dissipation assembly and shortens a heat transfer path between the heat-generating electronic element and the heat pipe.

摘要翻译： 本发明提供了一种散热组件和电子设备，其中散热组件包括：屏蔽元件，其中通孔设置在屏蔽元件上，屏蔽元件电连接到PCB板的接地铜，以及 发热电子元件设置在PCB板上; 位于通孔上的热管，其中热管与屏蔽元件电连接，并且热管，PCB板和屏蔽元件形成用于容纳发热电子器件的电磁屏蔽壳 元件; 以及弹性热界面材料，其设置在所述热管和所述发热电子元件之间并且相互配合到所述热管和所述发热电子元件。 在上述技术方案中，通过使用设置在屏蔽元件上的通孔将装配在发热电子元件上的热界面材料装配到热管上，从而可以传递发热电子元件的热量 通过热界面材料到热管，这降低了散热组件的热阻，并缩短了发热电子元件和热管之间的传热路径。

公开(公告)号：EP2568791A4

公开(公告)日：2014-05-07

申请号：EP11791929

申请日：2011-06-08

申请人： HUAWEI DEVICE CO LTD

发明人： JIN LINFANG ,  JIANG YAMING

IPC分类号： H05K5/02

CPC分类号： H01R31/00 ,  H01R24/62 ,  H01R35/04 ,  H05K5/0278

公开(公告)号：EP2372859A4

公开(公告)日：2012-03-14

申请号：EP09832890

申请日：2009-10-29

申请人： HUAWEI DEVICE CO LTD

发明人： JIN LINFANG ,  WU GUZHENG ,  ZHOU TAOTAO ,  FENG LAILI

IPC分类号： H02H5/04 ,  H02H7/20 ,  H02M1/32

CPC分类号： H02H5/04

公开(公告)号：EP2773013A4

公开(公告)日：2015-07-15

申请号：EP13738047

申请日：2013-01-06

申请人： HUAWEI DEVICE CO LTD

发明人： LI HUALIN ,  JIN LINFANG ,  ZHOU LIECHUN

IPC分类号： H02J7/00 ,  H01M10/44 ,  H02J7/04

CPC分类号： H02J7/0029 ,  H01M10/443 ,  H01M10/486 ,  H02J7/0052 ,  H02J7/007 ,  H02J7/0091 ,  H02J7/047

摘要： The present invention is applicable to the field of charging circuits and provides a charging circuit and a charger, where the charging circuit includes a temperature detection unit, a charging unit, and a control unit. In the present invention, the charging circuit adjusts magnitude of a charging current according to a temperature of a product being charged or the charger and then controls the temperature of the product being charged or the charger, thereby greatly improving user experience, and enhancing safety performance of the product with a heat protection function.