公开(公告)号：EP1848578B1

公开(公告)日：2011-09-07

申请号：EP06719889.5

申请日：2006-01-31

申请人： HARRIS CORPORATION

发明人： SMITH, C. W. ,  NEWTON, Charles, M. ,  JAYNES, Paul, B.

IPC分类号： B29C65/00 ,  H05K3/28 ,  B30B5/02

CPC分类号： B32B37/06 ,  B32B37/04 ,  B32B37/08 ,  B32B37/10 ,  B32B37/1009 ,  B32B37/185 ,  B32B2305/55 ,  B32B2309/02 ,  B32B2457/08 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/064 ,  H05K2203/068 ,  H05K2203/1121 ,  H05K2203/1311 ,  H05K2203/304

摘要： A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.

公开(公告)号：EP1848578A2

公开(公告)日：2007-10-31

申请号：EP06719889.5

申请日：2006-01-31

申请人： HARRIS CORPORATION

发明人： SMITH, C. W. ,  NEWTON, Charles, M. ,  JAYNES, Paul, B.

IPC分类号： B29C65/00

CPC分类号： B32B37/06 ,  B32B37/04 ,  B32B37/08 ,  B32B37/10 ,  B32B37/1009 ,  B32B37/185 ,  B32B2305/55 ,  B32B2309/02 ,  B32B2457/08 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/064 ,  H05K2203/068 ,  H05K2203/1121 ,  H05K2203/1311 ,  H05K2203/304

摘要： A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.

公开(公告)号：EP1812955A2

公开(公告)日：2007-08-01

申请号：EP05816032.6

申请日：2005-10-20

申请人： Harris Corporation

发明人： SMITH, C. W. Sinjin ,  JAYNES, Paul, B. ,  NEWTON, Charles, M.

IPC分类号： H01K3/22

CPC分类号： H05K3/0014 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S156/924 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T156/1189 ,  Y10T428/10 ,  Y10T428/1005

摘要： A method and apparatus relating to a multi­functional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).