公开(公告)号：EP3355349A1

公开(公告)日：2018-08-01

申请号：EP17153329.2

申请日：2017-01-26

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Morianz, Mike ,  Weis, Gerald ,  Stahr, Johannes

IPC: H01L23/495 ,  H01L23/498

CPC classification number: H01L23/3675 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/072 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/214 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82047 ,  H01L2924/12031 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H02M7/06 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/30 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10174

Abstract: A component carrier (100) which comprises an interconnected stack (102) comprising at least one electrically insulating layer structure (104) and/or at least one electrically conductive layer structure (106), a component (108) embedded in the stack (102) and comprising a diode (110), and at least one heat removal layer (112, 118) configured for removing heat from the diode (110) and substantially fully covering a whole main surface of the component carrier (100).

公开(公告)号：EP1395102B1

公开(公告)日：2016-11-23

申请号：EP03018683.7

申请日：2003-08-22

Applicant: KURARAY CO., LTD.

Inventor： Tsugaru, Toshinori, Kuraray Co., Ltd. ,  Sunamoto, Tatsuya, Kuraray Co., Ltd. ,  Yoshikawa, Tadao, Kuraray Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2203/1189 ,  Y10T428/24917

公开(公告)号：EP1789840B1

公开(公告)日：2015-05-13

申请号：EP05781615.9

申请日：2005-08-01

Applicant: Harris Corporation

Inventor： SMITH, C.W. Sinjin ,  NEWTON, Charles M. ,  JAYNES, Paul B.

IPC: H05K3/28 ,  B30B5/02 ,  B30B15/34 ,  B32B37/10 ,  B32B37/18 ,  H05K1/18

CPC classification number: H05K3/281 ,  B30B5/02 ,  B30B15/34 ,  B32B37/10 ,  B32B37/1009 ,  B32B37/185 ,  B32B2305/34 ,  B32B2305/55 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0141 ,  H05K2203/065 ,  H05K2203/068 ,  H05K2203/1311

公开(公告)号：EP2774945A1

公开(公告)日：2014-09-10

申请号：EP12846753.7

申请日：2012-10-09

Applicant: Kuraray Co., Ltd.

Inventor： ONODERA, Minoru ,  SUNAMOTO, Tatsuya ,  MATSUNAGA, Shuji ,  KONNO, Takafumi

IPC: C08J5/18 ,  H05K1/03 ,  H05K3/46 ,  B32B15/08 ,  B32B37/10

CPC classification number: H05K1/0313 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  B32B27/286 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/06 ,  B32B37/10 ,  B32B37/182 ,  B32B2250/42 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2457/00 ,  C08J5/18 ,  C08J2300/12 ,  C08J2367/03 ,  C09K19/3809 ,  H05K1/024 ,  H05K1/032 ,  H05K1/0326 ,  H05K3/022 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2203/068 ,  Y10T428/31678

Abstract: To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (ε r2 ) of the film after heating to a dielectric constant (ε r1 ) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30°C lower than a melting point of the film to a temperature being 10°C higher than the melting point,

where ε r1 denotes the relative dielectric constant before the heating, ε r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.

公开(公告)号：EP2682264A1

公开(公告)日：2014-01-08

申请号：EP12752249.8

申请日：2012-02-15

Applicant: JX Nippon Mining & Metals Corp.

Inventor： SAKAGUCHI Kazuhiko ,  INAZUMI Hajime ,  YACHI Hisakazu

IPC: B32B15/09 ,  C08J7/00

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B2307/202 ,  B32B2457/202 ,  C08J7/123 ,  C08J2367/03 ,  C09K19/38 ,  C09K2219/03 ,  H05K1/0346 ,  H05K3/022 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0141 ,  H05K2203/095 ,  Y10T428/12535 ,  Y10T428/31678

Abstract: Provided is a liquid crystal polymer film based copper-clad laminate characterized in that a surface of one side or each of both sides of a liquid crystal polymer film has a nitrogen atom content of 10 at% or more, and a metal conductor layer formed by dry plating and/or wet painting is provided on the surface of the liquid crystal polymer film having the nitrogen atom content of 10 at% or more. The liquid crystal polymer film based copper-clad laminate is characterized by having arithmetic average roughness Ra of 0.15 µm or less and a root-mean-square roughness Rq of 0.20 µm or less as surface roughness of the liquid crystal polymer film. Also provided is a method for producing a liquid crystal polymer film based copper-clad laminate characterized by performing plasma processing on the surface of the liquid crystal polymer film under a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa, followed by forming the metal conductor layer by dry plating and/or wet plating.

Abstract translation: 本发明提供一种液晶聚合物膜系覆铜层压板，其特征在于，液晶聚合物膜的一面或两面的表面的氮原子含量为10原子％以上，金属导体层由 在氮原子含量为10原子％以上的液晶聚合物膜的表面上设置干式电镀和/或湿式涂漆。 液晶聚合物膜基覆铜层压板的特征在于，具有0.15μm以下的算术平均粗糙度Ra和0.20μm以下的均方根粗糙度Rq作为液晶聚合物膜的表面粗糙度。 还提供了一种液晶聚合物膜基覆铜层压板的制造方法，其特征在于，在氮气气氛下，在气体压力为2.6〜15Pa下，在液晶聚合物膜的表面进行等离子体处理，接着形成金属 导体层通过干电镀和/或湿电镀。

公开(公告)号：EP2205053B1

公开(公告)日：2013-11-20

申请号：EP10150191.4

申请日：2010-01-06

Applicant: Thales

Inventor： Ledain, Bernard ,  Henriot, Dominique

IPC: H05K3/38 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/244 ,  H05K3/3484 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378

Abstract: The method involves superimposing two layers, and metallizing two faces of each layer. An interlayer made of metallized thermoplastic material e.g. liquid crystal polymer, is arranged between the two layers. Holes are pierced within the two layers before the two layers are placed in contact with each other, and within the interlayer. The holes are metallized. A metal is applied on openings of the holes of the two layers, and another metal is applied on openings of the holes of the interlayer. The two layers and the interlayer are pressed for diffusion bonding of zones covered with the metals. An independent claim is also included for a printed circuit board comprising two superimposed metallized layers.

公开(公告)号：EP2563101A1

公开(公告)日：2013-02-27

申请号：EP10850284.0

申请日：2010-12-24

Applicant: Nippon Mektron Ltd.

Inventor： KAJIYA Atsushi ,  YOSHIHARA Hidekazu

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0218 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/051 ,  H05K2203/1105 ,  Y10T29/49117

Abstract: The present invention has for its object to provide a flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts of a robot, etc., is required, the wiring can be made to expand and contract with a simple arrangement, and at the same time, the circuit board is excellent in weight reduction as well as size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The present invention resides in a flexible circuit board (1) which has an insulating film (2) made of a thermoplastic resin, a wiring layer (3A) formed on said insulating film, and an insulating layer (4) made of a thermoplastic resin and formed on said wiring layer (3A), and which is characterized in that a spiral part (5) shaped into a spiral shape is provided in at least a part of said flexible circuit board, and said flexible circuit board is constructed to be expandable and contractable, and/ or torsionally deformable in said spiral part (5).

Abstract translation: 本发明的目的是提供一种柔性电路板及其制造方法，其中在需要机器人等的可移动部件中的弹性布线的情况下，可以将布线扩大和收缩 简单的布置，并且同时电路板的重量减轻和尺寸减小都是优异的，并且即使在电路板变形的情况下，布线层的断裂或断开和剥离也不容易发生 反复的方式。 本发明涉及柔性电路板（1），其具有由热塑性树脂制成的绝缘膜（2），形成在所述绝缘膜上的布线层（3A）和由热塑性树脂制成的绝缘层（4） 并且形成在所述布线层（3A）上，其特征在于，在所述柔性电路板的至少一部分上设置形成螺旋状的螺旋部（5），所述柔性电路板构造成可扩展 并且在所述螺旋部分（5）中可收缩和/或扭转变形。

公开(公告)号：EP1734068A4

公开(公告)日：2011-01-19

申请号：EP05719312

申请日：2005-02-18

Applicant: POLYMATECH CO LTD

Inventor： TOBITA MASAYUKI ,  KIMURA TORU ,  AOKI HISASHI ,  SHIMOYAMA NAOYUKI ,  ISHIGAKI TSUKASA ,  OCHI MITSUKAZU ,  HARADA MIYUKI

IPC: C08J5/24 ,  B32B15/08 ,  B32B27/04 ,  C08G59/28 ,  C08G59/50 ,  C08K7/02 ,  C08L63/00 ,  H05K1/03 ,  H05K3/00

CPC classification number: C08G59/28 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08K7/02 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/249924 ,  C08L63/00

公开(公告)号：EP2081418A3

公开(公告)日：2010-03-10

申请号：EP09000584.4

申请日：2009-01-16

Applicant: Harris Corporation

Inventor： Rendek, Louis Joseph Jr. ,  Shacklette, Lawrence Wayne ,  Marvin, Philip Anthony

IPC: H05K1/00 ,  H01H13/06 ,  H01H13/704

CPC classification number: H05K3/0014 ,  H01H2219/01 ,  H05K1/0284 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/0141 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302

Abstract: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

公开(公告)号：EP1789840A4

公开(公告)日：2009-09-02

申请号：EP05781615

申请日：2005-08-01

Applicant: HARRIS CORP

Inventor： SMITH C W SINJIN ,  NEWTON CHARLES M ,  JAYNES PAUL B

IPC: G02F1/1339

CPC classification number: H05K3/281 ,  B30B5/02 ,  B30B15/34 ,  B32B37/10 ,  B32B37/1009 ,  B32B37/185 ,  B32B2305/34 ,  B32B2305/55 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0141 ,  H05K2203/065 ,  H05K2203/068 ,  H05K2203/1311

Abstract: A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.