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公开(公告)号：EP1920005B1
公开(公告)日：2011-11-23
申请号：EP06789966.6
申请日：2006-08-24
发明人： AGARWAL, Rajat , LAMMERSCHOP, Olaf , BURNS, Barry, N. , HOLLOWAY, Matthew, J. , WARD, Mary, B. , FITZPATRICK, Martin, J. , SCHOENFELD, Rainer , SCHENKEL, Hubert, K. , WIGHAM, Jonathan, P.
IPC分类号： C08L63/00 , C08L63/02 , C08L51/04 , C09J163/00 , C09J163/02
CPC分类号： C08L51/04 , C08L63/00 , C08L2666/02 , C08L2666/08 , C09J163/00 , C08L2666/04 , C08L2666/24
摘要： This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.
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2.发明公开PHOTOCURABLE ADHESIVE COMPOSITIONS, REACTION PRODUCTS OF WHICH HAVE LOW HALIDE ION CONTENT 审中-公开光固化型胶粘剂反应产品具有低HALIDEGEHALT
公开(公告)号：EP1516030A1
公开(公告)日：2005-03-23
申请号：EP03760851.0
申请日：2003-06-24
发明人： MURRAY, Helen, M. , WIGHAM, Jonathan, P. , CAHILL, John, E. , LAKES, Aisling , HOLLOWAY, Matthew, J. , LEDWIDGE, Eadaoin, D. , WARD, Mary, B.
IPC分类号： C09J163/00 , H01L23/29 , H01L21/56 , G06K19/077
CPC分类号： G06K19/07747 , C08G59/24 , C08G59/68 , G06K19/02 , G06K19/077 , G06K19/07745 , H01L21/563 , H01L23/293 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01037 , H01L2924/01057 , H01L2924/01068 , H01L2924/01079 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.
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公开(公告)号：EP1920005A1
公开(公告)日：2008-05-14
申请号：EP06789966.6
申请日：2006-08-24
发明人： AGARWAL, Rajat , LAMMERSCHOP, Olaf , BURNS, Barry, N. , HOLLOWAY, Matthew, J. , WARD, Mary, B. , FITZPATRICK, Martin, J. , SCHOENFELD, Rainer , SCHENKEL, Hubert, K. , WIGHAM, Jonathan, P.
CPC分类号： C08L51/04 , C08L63/00 , C08L2666/02 , C08L2666/08 , C09J163/00 , C08L2666/04 , C08L2666/24
摘要： This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.
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