公开(公告)号：EP0644577B1

公开(公告)日：1997-09-10

申请号：EP94108878.3

申请日：1994-06-09

申请人： HITACHI, LTD.

发明人： Ito, Youichi ,  Edamura, Manabu ,  Tamura, Naoyuki ,  Shichida, Hiroyuki

IPC分类号： H01L21/00

CPC分类号： H01L21/6831

公开(公告)号：EP0644578A3

公开(公告)日：1995-04-19

申请号：EP94113803.4

申请日：1994-09-02

申请人： HITACHI, LTD.

发明人： Tamura, Naoyuki ,  Takahashi, Kazue ,  Ito, Youichi ,  Ogawa, Yoshifumi ,  Shichiba, Hiroyuki ,  Tsubone, Tsunehiko

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L2924/3025 ,  Y10T279/23

摘要： Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

摘要翻译： 本发明提供了一种保持衬底的方法和衬底保持系统，其中可以减少背面上的杂质量，并且少量的异物可以从安装台转移到衬底。 基板保持系统包括：在试样台上具有对应于基板周边的光滑表面的环形防漏表面;在试样台上与基板的对应位置之间的多个接触保持部分 衬底和对应于衬底中心的位置;以及静电吸引装置，用于通过使衬底的背面与环形防漏表面和接触保持部分接触来固定衬底。 衬底在环形防漏表面处与冷却表面接触并且接触保持部分位于环形防漏表面的内侧位置。 基板的背面和冷却面在剩余区域的大部分中不相互接触。

公开(公告)号：EP0644577A1

公开(公告)日：1995-03-22

申请号：EP94108878.3

申请日：1994-06-09

申请人： HITACHI, LTD.

发明人： Ito, Youichi ,  Edamura, Manabu ,  Tamura, Naoyuki ,  Shichida, Hiroyuki

IPC分类号： H01L21/00

CPC分类号： H01L21/6831

摘要： The object of the present invention is to provide a method of plasma treatment in which wafer temperature control is easily performed and the structure of electrode is simplified. On etching treatment of a wafer, firstly the pressure inside the etching treatment chamber is controlled to a certain pressure, for example above 10 Torr, by means of pumping while the process gas or thermal conductive gas is being introduced into the etching treatment chamber. In this environment, the wafer is mounted on an electrostatic adhering electrode and is electrostatically adhered. The process gas having pressure of approximately 10 Torr is enclosed in the space (reservoir) from the grooves on the electrostatic adhering electrode to the gaps between the wafer lift-up pin. Then, the pressure inside the etching treating chamber is controlled to the etching treating pressure, and etching treatment is performed. The process gas enclosed in the reservoir contributes to cooling of the wafer. After the completion of treatment, the process gas in the reservoir is exhausted with a vacuum pump, the wafer is removed from the electrostatic adhering electrode.

摘要翻译： 本发明的目的是提供一种在片温度控制的等离子体处理，其容易进行和电极的结构得到简化的方法。 上蚀刻处理的晶片的，而该工艺气体或导热气体被引入刻蚀处理室首先蚀刻处理腔室内部的压力被控制在一定的压力，例如高于10乇，通过泵送装置。 在这种环境下，晶片被安装在静电附着电极和静电附着。 将约10托的具有工艺气体压力被包围在从上的静电电极附着在晶片顶升销之间的间隙的槽的空间（储液）。 然后，在腔室内部的压力被控制蚀刻处理的蚀刻处理压力，并且进行蚀刻处理。 封闭在容器中的处理气体有助于晶片的冷却。 处理完成后，在容器中的处理气体进行排气用真空泵，将晶片从静电附着电极移除。

公开(公告)号：EP1119023A3

公开(公告)日：2006-06-07

申请号：EP01107801.1

申请日：1994-09-02

申请人： Hitachi, Ltd.

发明人： Tamura, Naoyuki ,  Takahashi, Kazue ,  Ito, Youichi ,  Ogawa, Yoshifumi ,  Shichida, Hiroyuki ,  Tsubone, Tsunehiko

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L2924/3025 ,  Y10T279/23

摘要： Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

公开(公告)号：EP0644578B1

公开(公告)日：2001-12-05

申请号：EP94113803.4

申请日：1994-09-02

申请人： Hitachi, Ltd.

发明人： Tamura, Naoyuki ,  Takahashi, Kazue ,  Ito, Youichi ,  Ogawa, Yoshifumi ,  Shichiba, Hiroyuki ,  Tsubone, Tsunehiko

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L2924/3025 ,  Y10T279/23

公开(公告)号：EP1119023A2

公开(公告)日：2001-07-25

申请号：EP01107801.1

申请日：1994-09-02

申请人： Hitachi, Ltd.

发明人： Tamura, Naoyuki ,  Takahashi, Kazue ,  Ito, Youichi ,  Ogawa, Yoshifumi ,  Shichida, Hiroyuki ,  Tsubone, Tsunehiko

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L2924/3025 ,  Y10T279/23

摘要： Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

公开(公告)号：EP0644578A2

公开(公告)日：1995-03-22

申请号：EP94113803.4

申请日：1994-09-02

申请人： HITACHI, LTD.

发明人： Tamura, Naoyuki ,  Takahashi, Kazue ,  Ito, Youichi ,  Ogawa, Yoshifumi ,  Shichiba, Hiroyuki ,  Tsubone, Tsunehiko

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L2924/3025 ,  Y10T279/23

摘要： Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

摘要翻译： 本发明提供了一种保持基板和基板保持系统的方法，其中背面上的异物的量可以减少，并且少量的异物可能从安装台传递到基板。 基板保持系统包括在对应于基板的周边的样品台上具有光滑表面的环形防漏表面，多个接触保持部分抵靠在样品台上的基板之间的相应位置 基板和与基板中心对应的位置，以及用于通过使基板的背面接触到环形防漏表面和接触保持部分来固定基板的静电折返装置。 基板在环状防漏面与冷却面接触，接触保持部位置于环状防漏面内。 基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。