公开(公告)号：EP2966190A1

公开(公告)日：2016-01-13

申请号：EP13876879.1

申请日：2013-03-07

申请人： Hitachi, Ltd.

发明人： NAKANO Hiroshi ,  NEGISHI Yoshinori ,  AKAHOSHI Haruo ,  IZUMI Takeshi ,  KOJIMA YOSHITAKA ,  ARIKAWA Hideyuki

IPC分类号： C23C10/28 ,  C23C10/04 ,  C25D3/66 ,  C25D21/11 ,  F01D5/28 ,  F01D25/00 ,  F02C7/00

CPC分类号： C23C10/04 ,  B32B15/012 ,  B32B15/017 ,  C21D6/00 ,  C22F1/10 ,  C22F1/18 ,  C23C10/28 ,  C25D3/44 ,  C25D3/665 ,  C25D5/02 ,  C25D5/022 ,  C25D5/34 ,  C25D5/50 ,  C25D7/00 ,  C25D17/02 ,  C25D21/11 ,  F01D5/288 ,  F05D2230/31 ,  F05D2300/173 ,  Y02T50/671

摘要： There is provided a method for forming an aluminide coating on a surface of a heat resistant superalloy substrate, comprising the steps of: exposing a base metal of the substrate in a selective area; forming a aluminum or an aluminum alloy film on the exposed base metal, by a non-aqueous electroplating; and conducting a heat treatment to the substrate on which the film is formed, in order to make a diffusion reaction between an aluminum component in the film and the base metal, and form the aluminide coating, wherein: there is used, as a plating liquid, a non-aqueous plating liquid containing a halide of the metal to be plated and an organic compound which forms an ion pair with the metal halide; and the electroplating is conducted by immersing the selective area into the plating liquid through the use of predetermined means for shielding the plating liquid from the atmosphere.

摘要翻译： 提供了一种在耐热超级合金基底的表面上形成铝化物涂层的方法，该方法包括以下步骤：将基底的基底金属暴露在选择性区域中; 通过非水电镀在暴露的基底金属上形成铝或铝合金膜; 以及对形成有所述膜的基板进行热处理，以使所述膜中的铝成分与所述基底金属发生扩散反应并形成所述铝化物涂层，其中：使用作为电镀液的所述电镀液 含有待镀金属的卤化物和与金属卤化物形成离子对的有机化合物的非水电镀液; 并且通过使用预定手段将选择性区域浸入电镀液中来进行电镀，以将电镀液与大气隔离。

公开(公告)号：EP2623643A1

公开(公告)日：2013-08-07

申请号：EP11828690.5

申请日：2011-09-01

申请人： Hitachi, Ltd.

发明人： NAKANO Hiroshi ,  NEGISHI Yoshinori ,  AKAHOSHI Haruo

IPC分类号： C25D3/44

CPC分类号： C25D3/44 ,  C25D3/665

摘要： The purpose of the present invention is to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has high solubility in a nonaqueous solvent. This aluminum electroplating solution is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume percentage of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane.

摘要翻译： 本发明的目的是提供一种铝电镀溶液，其允许有效且短时间内进行铝电镀，能够增加电镀电流的电量，并且在非水溶剂中具有高溶解度。 该铝电镀液的特征在于包含铝金属盐，由与铝金属盐形成离子对的有机化合物获得的离子液体和介电常数为8或更小的有机溶剂。 相对于离子液体和有机溶剂的总体积的有机溶剂的体积百分比优选为至少30％，并且作为具有电介质的有机溶剂包括以下至少一种 8或更小的常数：己烷，甲苯，乙醚，乙酸乙酯，环己烷，二甲苯，苯，萘，庚烷，环戊基甲基醚和二恶烷。