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公开(公告)号:EP2101552A2
公开(公告)日:2009-09-16
申请号:EP08017982.3
申请日:2008-10-14
申请人: Hitachi Ltd.
IPC分类号: H05K3/30
CPC分类号: H05K1/119 , H05K1/0366 , H05K1/056 , H05K1/141 , H05K3/308 , H05K3/42 , H05K2201/09827 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/1059 , H05K2201/10803 , Y10S439/941
摘要: In a module, press-fit connection using a pin terminal (1) including a connection part (2) separated into two parts and a flat plane (2a) parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal (1) is performed. A through-hole of a board is structured so that (1) an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board (4) and (2) the length of the middle part of the through-hole connected to the pin terminal (1) is shorter than the length of the flat plane (2a) of the pin terminal (1).
摘要翻译: 在模块中,使用包括分成两部分的连接部分(2)和在分离部分中与长度方向平行的垂直于分离方向的平面(2a)的销端子(1)的压配合连接 引脚端子(1)。 板的通孔构造成使得(1)在板的厚度方向上的中间部分处的通孔的内径小于板(4)和(4)的正面和反面的内径, 2)连接到销端子(1)的通孔的中间部分的长度短于销端子(1)的平面(2a)的长度。
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公开(公告)号:EP2101552B1
公开(公告)日:2014-05-07
申请号:EP08017982.3
申请日:2008-10-14
申请人: Hitachi Ltd.
IPC分类号: H05K3/30
CPC分类号: H05K1/119 , H05K1/0366 , H05K1/056 , H05K1/141 , H05K3/308 , H05K3/42 , H05K2201/09827 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/1059 , H05K2201/10803 , Y10S439/941
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公开(公告)号:EP2101552B8
公开(公告)日:2014-10-08
申请号:EP08017982.3
申请日:2008-10-14
申请人: Hitachi, Ltd.
IPC分类号: H05K3/30
CPC分类号: H05K1/119 , H05K1/0366 , H05K1/056 , H05K1/141 , H05K3/308 , H05K3/42 , H05K2201/09827 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/1059 , H05K2201/10803 , Y10S439/941
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公开(公告)号:EP2101552A3
公开(公告)日:2012-10-17
申请号:EP08017982.3
申请日:2008-10-14
申请人: Hitachi Ltd.
IPC分类号: H05K3/30
CPC分类号: H05K1/119 , H05K1/0366 , H05K1/056 , H05K1/141 , H05K3/308 , H05K3/42 , H05K2201/09827 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/1059 , H05K2201/10803 , Y10S439/941
摘要: In a module, press-fit connection using a pin terminal (1) including a connection part (2) separated into two parts and a flat plane (2a) parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal (1) is performed. A through-hole of a board is structured so that (1) an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board (4) and (2) the length of the middle part of the through-hole connected to the pin terminal (1) is shorter than the length of the flat plane (2a) of the pin terminal (1).
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