公开(公告)号：EP3180796B1

公开(公告)日：2018-10-10

申请号：EP15750046.3

申请日：2015-08-11

Applicant: Marquardt GmbH

Inventor： ROTTLER, Frank ,  BERCHTOLD, Rainer

IPC: H01H1/40 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01H9/02 ,  H01H1/021 ,  H01H1/12 ,  H01H1/403 ,  H05K1/117 ,  H05K1/18 ,  H05K2201/10053 ,  H05K2201/10446

公开(公告)号：EP3275293A1

公开(公告)日：2018-01-31

申请号：EP16709255.0

申请日：2016-03-03

Applicant: TE Connectivity Corporation

Inventor： GINGRICH, III, Charles Raymond ,  MOSTOLLER, Matthew Edward ,  WEBER, Ronald Martin

IPC: H05K1/18 ,  H01H1/58 ,  H01H13/70

CPC classification number: H01H9/02 ,  H01H1/5805 ,  H01H13/70 ,  H01H2207/02 ,  H01H2223/054 ,  H01H2223/058 ,  H05K1/184 ,  H05K2201/10053 ,  H05K2201/10446

Abstract: An electronic device includes a substrate having a top surface, a bottom surface and at least one opening therethrough. The substrate has a circuit. A switch mechanism is mounted to the substrate and is electrically connected to the circuit. The switch mechanism has an actuator configured to activate the switch mechanism. The switch mechanism has a housing holding the actuator and leads extending from the housing. The leads are electrically connected to the circuit. The switch mechanism is mounted to the substrate in the opening such that at least a portion of the housing is positioned below the top surface.

公开(公告)号：EP3183947A1

公开(公告)日：2017-06-28

申请号：EP16732762.6

申请日：2016-06-16

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： SIMPSON, Reginald ,  NEHRING, Ronald ,  ROUABHI, Mokhtar

IPC: H05K3/32 ,  H01L23/66 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0203 ,  H01L23/66 ,  H01L2223/6644 ,  H03F1/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H05K1/0243 ,  H05K3/325 ,  H05K3/3405 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10969

Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

Abstract translation: 公开了功率放大器组件和部件。 根据一些实施例，提供了一种功率放大器组件（10），其包括功率放大器（12），该功率放大器具有带有栅极接触表面的栅极引线（14），具有漏极接触表面的漏极引线（13） 表面（15）具有长度和宽度。 延伸的散热块（11）抵靠源接触表面安装以将热量从表面传导（18）并且延伸源的电路径。 延长的散热块的长度至少大于源接触表面的长度。

公开(公告)号：EP1875504B1

公开(公告)日：2017-03-08

申请号：EP06758855.8

申请日：2006-05-01

Applicant: Finisar Corporation

Inventor： ICE, Donald, A. ,  DOUMA, Darin, J. ,  KIELY, Phillip, Anthony

IPC: H01L23/495

CPC classification number: H01R13/6608 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4279 ,  G02B6/428 ,  H01L23/495 ,  H01L2924/0002 ,  H01R12/7082 ,  H01R13/405 ,  H05K1/023 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2203/302 ,  H01L2924/00

公开(公告)号：EP2088842B1

公开(公告)日：2017-03-01

申请号：EP09150832.5

申请日：2009-01-19

Applicant: Weidmüller Interface GmbH & Co. KG

Inventor： Heggemann, Christian ,  Oesterhaus, Jens ,  Bönsch, Matthias ,  Niggemann, Matthias ,  Lenschen, Michael ,  Fehling, Stephan ,  Diekmann, Torsten

IPC: H05K7/14 ,  H01R9/26 ,  H05K3/00

CPC classification number: H05K7/1428 ,  H01R9/2625 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/3405 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10T29/49149

公开(公告)号：EP2401178B1

公开(公告)日：2016-11-16

申请号：EP10746893.6

申请日：2010-02-26

Applicant: Delphi Technologies, Inc.

Inventor： SNIDER, Chris, R. ,  HASSLER, Edgar, Glenn

IPC: H04B1/08

CPC classification number: H04B1/082 ,  H05K1/0215 ,  H05K1/141 ,  H05K7/20436 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446

公开(公告)号：EP2945146A1

公开(公告)日：2015-11-18

申请号：EP14738176.8

申请日：2014-01-08

Applicant: GWS Technology Co., Ltd.

Inventor： LIN, Yi

IPC: G09F9/33

CPC classification number: F21K9/20 ,  F21K9/90 ,  F21V23/005 ,  F21Y2115/10 ,  G09F9/33 ,  H05K1/18 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/10446 ,  Y10T29/4913

Abstract: An LED screen display unit and production method therefor. The LED screen display unit comprises a circuit board (1), a driving IC (2) and LEDs (3); a first face of said circuit board (1) is provided with a contact pad matrix (41); the driving IC (2) is arranged on the circuit board (1) and is in electrical connection with contact pads (4) of said contact pad matrix (41); the pins (31) of the LEDs (3) are soldered to contact pads (4) of the contact pad matrix (41). The present display unit can ensure a higher permeability rate for LED display screens produced having high pixel density.

Abstract translation: 一种LED显示屏及其制作方法。 LED屏显示单元包括电路板（1），驱动IC（2）和LED（3）; 所述电路板（1）的第一面设置有接触垫矩阵（41）; 驱动IC（2）布置在电路板（1）上并与所述接触垫矩阵（41）的接触焊盘（4）电连接; LED（3）的引脚（31）焊接到接触垫矩阵（41）的接触焊盘（4）。 本显示单元可以确保具有高像素密度的LED显示屏的更高的透射率。

公开(公告)号：EP2448379B1

公开(公告)日：2015-06-17

申请号：EP11185985.6

申请日：2011-10-20

Applicant: Beta LAYOUT GmbH

Inventor： Hofmann, Arne

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/0266 ,  H05K1/183 ,  H05K2201/09163 ,  H05K2201/10098 ,  H05K2201/10446

公开(公告)号：EP2054191B1

公开(公告)日：2015-06-03

申请号：EP07836850.3

申请日：2007-08-16

Applicant: Delphi Technologies, Inc.

Inventor： SNIDER, Chris R. ,  GUPTA, Vineet ,  HUNTZINGER, Joseph K. ,  COADY, Michael G. ,  STAPERT, Curtis A. ,  MEYER, Kevin E. ,  GARNER, Timothy D. ,  STAHL, Gary L. ,  HASSLER, Edgar G. ,  UGLUM, Paul A. ,  FYE, Michael, E.

IPC: G04G5/00

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

公开(公告)号：EP2785165A4

公开(公告)日：2015-05-06

申请号：EP12850806

申请日：2012-03-23

Applicant: ZTE CORP

Inventor： DAI ZAIXING ,  YANG TAO ,  YANG SHILIN ,  WANG WEIZHOU

IPC: H05K7/14 ,  G02B6/38 ,  G02B6/42 ,  H04Q1/02

CPC classification number: H05K3/301 ,  G02B6/3897 ,  G02B6/4261 ,  G02B6/4277 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10484