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    SELECTIVELY CONDUCTIVE TOY BUILDING ELEMENTS
    4.
    发明公开
    SELECTIVELY CONDUCTIVE TOY BUILDING ELEMENTS 审中-公开
    SELEKTIVLEITFÄHIGESPIELBAUTEILE

    公开(公告)号：EP3041592A4

    公开(公告)日：2017-06-07

    申请号：EP14841564

    申请日：2014-09-03

    申请人： BRIXO SMART TOYS LTD

    发明人： ALMOG BOAZ ,  SARAF AMIR

    IPC分类号： A63H33/04 ,  A63H33/08 ,  H05K3/00

    CPC分类号： A63H33/042 ,  A63H33/086 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0999 ,  H05K2201/209

    摘要： The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.

    摘要翻译： 本发明涉及一种选择性导电玩具搭建元件，包括：主体，其适于可释放地接合到至少一个其他玩具搭建元件主体或相应的基板，主体包括至少一个导电部分，该至少一个导电部分具有至少一个接触区域， 以在相邻的玩具构建元件本体的导电部分或接触区域上产生压力，从而确保所述玩具构建元件之间在期望的位置和方向上的导电。

    WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR
    5.
    发明公开
    WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR 有权
    布线基板及其制造方法

    公开(公告)号：EP2894951A4

    公开(公告)日：2016-08-10

    申请号：EP13834871

    申请日：2013-07-29

    申请人： NGK SPARK PLUG CO

    发明人： HAYASHI TAKAHIRO ,  MORI SEIJI ,  ITO TATSUYA

    IPC分类号： H05K1/09 ,  H05K3/24 ,  H05K3/34

    CPC分类号： H05K1/119 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/20 ,  H05K3/3452 ,  H05K3/3473 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/04

    摘要： A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.

    FABRICATION OF THREE-DIMENSIONAL PRINTED CIRCUIT BOARD STRUCTURES
    6.
    发明公开
    FABRICATION OF THREE-DIMENSIONAL PRINTED CIRCUIT BOARD STRUCTURES 有权
    生产三维电路板结构的

    公开(公告)号：EP2781144A1

    公开(公告)日：2014-09-24

    申请号：EP11875716.0

    申请日：2011-11-18

    申请人： Honeywell International Inc.

    发明人： WANG, Nan ,  NYHUS, Orville

    IPC分类号： H05K3/36 ,  H05K1/14 ,  H04L29/00

    CPC分类号： H05K1/0284 ,  H05K1/119 ,  H05K3/0044 ,  H05K3/36 ,  H05K2201/09163 ,  H05K2201/2072 ,  Y10T29/49124 ,  Y10T29/49126

    摘要： A method of fabricating components for a three-dimensional circuit structure includes providing a printed circuit board (PCB) having a top surface, an opposing bottom surface, and an end section. A first angled channel is formed in the top surface at the end section, with the first angled channel extending to an edge of the end section and dividing the end section into a first end portion and a second end portion. The PCB material is removed from the top surface at the first end portion to form a first support member having an upper surface at a preselected distance below the top surface. A second angled channel is formed in the bottom surface at the end section of the first PCB, with the second angled channel extending to the edge of the end section and being adjacent to the first support member. The PCB material is removed from the bottom surface at the second end portion to form a second support member having an upper surface that is contiguous with the top surface of the PCB. A ramp portion extends between the first support member and the second support member.

    Rear board of blade server, blade server and subrack
    9.
    发明公开
    Rear board of blade server, blade server and subrack 审中-公开
    Rückplatteeines Bladeserver，Bladeserver undBaugruppenträger

    公开(公告)号：EP2402952A1

    公开(公告)日：2012-01-04

    申请号：EP11179609.0

    申请日：2008-09-24

    申请人： Huawei Technologies Co., Ltd.

    发明人： Tang, Yinzhong ,  Zhuang Zhenyu ,  He, Jie ,  Zhou, Jianjun

    IPC分类号： G11B33/12 ,  G11B33/02 ,  H04L12/02

    CPC分类号： H05K1/119 ,  G11B33/128 ,  H04L12/66 ,  Y10T29/49904

    摘要： A rear board of a blade server, a blade server and a subrack are provided in the present invention. The blade server includes a front board and a back board, the rear board includes a standard ATCA interface, and the rear board is connected to the front board by the standard ATCA interface, a connector configured to connect hard disks is set on the rear board, and a portion of the rear board on which the connector is set is extended outward so as to accommodate at least two hard disks, and the at least two hard disks are connected to the connector. The blade server increase the ability of the heat dissipation ability of the front board, and the rear board supports data backup between the two hard disks and hot plug. This may improve the reliability and easy maintenance about the blade server.

    摘要翻译： 在本发明中提供了刀片服务器，刀片服务器和子架的后板。 刀片服务器包括前板和后板，后板包括标准ATCA接口，后板通过标准ATCA接口连接到前面板，后板上设置连接硬盘的连接器 并且设置有连接器的后板的一部分向外延伸以容纳至少两个硬盘，并且至少两个硬盘连接到连接器。 刀片服务器增加前板散热能力，后板支持两个硬盘和热插拔之间的数据备份。 这可以提高刀片服务器的可靠性和易于维护。