利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.016 秒)

    A resin flow and curing measuring device
    1.
    发明公开
    A resin flow and curing measuring device 失效
    树脂流动和固化测量装置以及基于流动和固化特性构建金属模具的方法

    公开(公告)号：EP0367218A3

    公开(公告)日：1990-09-26

    申请号：EP89120184.0

    申请日：1989-10-31

    申请人： HITACHI, LTD.

    发明人： Saeki, Junichi ,  Yoshida, Isamu ,  Kaneda, Aizo ,  Sugino, Kazuhiro ,  Nishi, Kunihiko

    IPC分类号： G01N33/44

    CPC分类号： G01N33/442 ,  G01N2203/0092

    摘要： A measuring device and method for enabling an evaluation of a moldability of a thermosetting resin by determination of parameters suitable for high accuracy forecasting of flow and curing behaviors of the thermosetting resin within a metal mold, as well as a metal mold for molding a thermosetting resin and method for constructing runners of the metal mold which is effective to minimize if not prevent the occurrence of false in moldings. By utilizing unique or peculiar parameters of the thermosetting resin which are not influenced by a molding condition and by conducting a flow simulation with a metal mold having a flow passage of arbitrary dimensions using the determined values for the parameters, a forecasting of a flow in an actual metal mold is enabled so as to preselect optimum molding conditions and flow passage dimensions for a metal mold. FIG. fA

    Power module and manufacturing method thereof
    3.
    发明公开
    Power module and manufacturing method thereof 审中-公开
    Leistungsmodul und Herstellungsverfahren davon

    公开(公告)号：EP2579309A1

    公开(公告)日：2013-04-10

    申请号：EP12004863.2

    申请日：2012-06-29

    申请人： Hitachi, Ltd.

    发明人： Yoshida, Isamu ,  Hiyoshi, Michiaki ,  Yokozuka, Takehide ,  Muramoto, Akihiro

    IPC分类号： H01L25/07 ,  H01L23/498

    CPC分类号： H01L23/49811 ,  H01L23/3735 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/01327 ,  H01L2924/00

    摘要： A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.

    摘要翻译： 功率模块包括具有其上形成有多个布线图案的表面的基板，安装在基板上并与多个布线图形的一部分电连接的半导体器件，以及端子部分，其引线电连接到 多个布线图形的其他部分，并且被构造成通过层叠多个金属构件形成端子部分的引线，多个金属构件包含与用于形成布线图案的另一部分的材料基本相同或者更软的材料， 并且与用于形成布线图案的其他部分的材料相同或更软的多个金属构件的材料通过超声波接合电连接到布线图案的另一部分。

    A resin flow and curing measuring device
    4.
    发明公开
    A resin flow and curing measuring device 失效
    装置，用于测量流和交联的树脂和方法的属性用于产生合理的流动和交联性能的模具。

    公开(公告)号：EP0367218A2

    公开(公告)日：1990-05-09

    申请号：EP89120184.0

    申请日：1989-10-31

    申请人： HITACHI, LTD.

    发明人： Saeki, Junichi ,  Yoshida, Isamu ,  Kaneda, Aizo ,  Sugino, Kazuhiro ,  Nishi, Kunihiko

    IPC分类号： G01N33/44

    CPC分类号： G01N33/442 ,  G01N2203/0092

    摘要： A measuring device and method for enabling an evaluation of a moldability of a thermosetting resin by determination of parameters suitable for high accuracy forecasting of flow and curing behaviors of the thermosetting resin within a metal mold, as well as a metal mold for molding a thermosetting resin and method for constructing runners of the metal mold which is effective to minimize if not prevent the occurrence of false in moldings. By utilizing unique or peculiar parameters of the thermosetting resin which are not influenced by a molding condition and by conducting a flow simulation with a metal mold having a flow passage of arbitrary dimensions using the determined values for the parameters, a forecasting of a flow in an actual metal mold is enabled so as to preselect optimum molding conditions and flow passage dimensions for a metal mold. FIG. fA

    摘要翻译： 的测量设备和方法，用于通过测定适合于流的高准确度预测参数使上的热固性树脂的成型性的评价，并在金属模具内固化所述热固性树脂的行为，以及一个金属模具用于模制的热固性树脂 并最小化用于构成金属模具的流道所有这些是有效的方法，如果不防止在模制品的虚假的发生。 通过利用不通过成型条件和通过进行流动模拟与具有使用所述确定性开采值的参数，流的到一个预测的任意尺寸的流路的金属模的影响的热固性树脂的独特或特有参数 实际金属模具被使能，以便预选最佳模制条件和流道尺寸的金属模具中。