公开(公告)号：EP2006248A3

公开(公告)日：2012-06-06

申请号：EP08158292.6

申请日：2008-06-13

申请人： Honeywell International Inc.

发明人： Eskridge, Mark H. c/o Honeywell Int. Inc.

IPC分类号： B81B7/00

CPC分类号： B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05001 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One method of the present invention includes preparing a die (24) with traces and pads as desired for the intended use of the die (24). A MEMS device (22) is mounted to the die (24). The die is then mounted to a substrate of the same material as the die (24). The substrate is then mounted to a package (28). The die (24) and/or the substrate may be flip-chip mounted.

公开(公告)号：EP2006248B1

公开(公告)日：2013-09-04

申请号：EP08158292.6

申请日：2008-06-13

申请人： Honeywell International Inc.

发明人： Eskridge, Mark H. c/o Honeywell Int. Inc.

IPC分类号： B81B7/00

CPC分类号： B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05001 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One method of the present invention includes preparing a die (24) with traces and pads as desired for the intended use of the die (24). A MEMS device (22) is mounted to the die (24). The die is then mounted to a substrate of the same material as the die (24). The substrate is then mounted to a package (28). The die (24) and/or the substrate may be flip-chip mounted.

公开(公告)号：EP2006248A2

公开(公告)日：2008-12-24

申请号：EP08158292.6

申请日：2008-06-13

申请人： Honeywell International Inc.

发明人： Eskridge, Mark H. c/o Honeywell Int. Inc.

IPC分类号： B81B7/00

CPC分类号： B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05001 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One method of the present invention includes preparing a die (24) with traces and pads as desired for the intended use of the die (24). A MEMS device (22) is mounted to the die (24). The die is then mounted to a substrate of the same material as the die (24). The substrate is then mounted to a package (28). The die (24) and/or the substrate may be flip-chip mounted.

摘要翻译： 本发明的一种方法包括根据模具（24）的预期用途制备具有迹线和垫的模具（24）。 MEMS器件（22）安装到管芯（24）上。 然后将模具安装到与模具（24）相同材料的基底上。 然后将衬底安装到包装（28）上。 管芯（24）和/或衬底可以倒装芯片安装。