摘要:
A structural packaging assembly (100) to support a multi-function optic chip or the like is mountable in a gyroscopic unit. An example assembly includes a housing (104) mounted to a mounting plate. The chip is located in the housing, which in turn is coupled to a mounting plate (102). The housing may have a prescribed section modulus capable of sufficiently withstanding applied vibrations within a predefined vibrational range, such as a vibrational range at or below about 3500 Hz. The structural packaging assembly utilizes a mounting system with mounting feet that clamp to dowels, which in turn have been press fit into the mounting plate. In one embodiment, the mounting feet take the form of "C" clamp mechanisms, which after being clamped to the dowels, allow for resonance dampening between the housing and the mounting plate.
摘要:
A hollow-core optical-fiber filter is provided. The hollow-core optical-fiber filter includes a hollow-core optical fiber having a first end-face and an opposing second end-face. The first end-face and the second end-face set a fiber length. The hollow-core optical-fiber filter also includes a first reflective end-cap positioned at the first end-face and a second reflective end-cap positioned at the second end-face. When an optical beam from a laser is coupled into one of the first end-face or the second end-face, an optical output from the opposing end-face has a narrow linewidth and low frequency noise fluctuations.
摘要:
A method of constructing a fiber-optic gyroscope includes optically coupling first and second optical fibers (210, 220) to an optical path of an interferometer (200) having an outer surface, coupling at least a portion of the first and second fibers (210, 220) to the outer surface, and optically coupling the first and second fibers (210, 220) to an optical path of an integrated optics chip (IOC).
摘要:
A method of constructing a fiber-optic gyroscope includes optically coupling first and second optical fibers (210, 220) to an optical path of an interferometer (200) having an outer surface, coupling at least a portion of the first and second fibers (210, 220) to the outer surface, and optically coupling the first and second fibers (210, 220) to an optical path of an integrated optics chip (IOC).