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    Pressure-sensor apparatus
    2.
    发明公开
    Pressure-sensor apparatus 审中-公开
    压力传感器装置

    公开(公告)号：EP2128583A3

    公开(公告)日：2012-11-07

    申请号：EP09160879.4

    申请日：2009-05-21

    Applicant: Honeywell International Inc.

    Inventor： Brown, Gregory C. ,  Rahn, Curtis

    IPC: G01L9/06 ,  G01L9/00 ,  G01L19/00

    CPC classification number: G01L9/0055 ,  G01L19/0069 ,  G01L19/0092

    Abstract: A sensing apparatus for determining the pressure of a fluid includes first and second support members. The first and second support members are configured to define at least one sealed chamber. A flexible diaphragm is disposed between the first and second support members. The diaphragm includes first and second opposing surfaces. The first opposing surface is in fluid communication with a first fluid-flow circuit, and the second opposing surface is in fluid communication with a second fluid-flow circuit. A first electronic circuit is disposed within the at least one chamber and coupled to the diaphragm for sensing a first differential pressure associated with the first and second flow circuits. The first electronic circuit is configured to produce at least one electrical signal proportional to a magnitude of the first differential pressure.

    Abstract translation: 用于确定流体压力的传感装置包括第一和第二支撑构件。 第一和第二支撑构件构造成限定至少一个密封室。 柔性隔膜设置在第一支撑构件和第二支撑构件之间。 隔膜包括第一和第二相对表面。 第一相对表面与第一流体流动回路流体连通，并且第二相对表面与第二流体流动回路流体连通。 第一电子电路设置在至少一个腔室内并且耦合到隔膜，用于感测与第一和第二流动回路相关联的第一压差。 第一电子电路被配置为产生与第一压差的大小成比例的至少一个电信号。

    Modular pressure sensor
    3.
    发明公开
    Modular pressure sensor 有权
    调制器Drucksensor

    公开(公告)号：EP2388566A1

    公开(公告)日：2011-11-23

    申请号：EP11165154.3

    申请日：2011-05-06

    Applicant: Honeywell International, Inc.

    Inventor： Brown, Gregory C. ,  Larson, Thomas A. ,  Rahn, Curtis

    IPC: G01L9/00

    CPC classification number: G01L19/003

    Abstract: A pressure sensor device for a modular pressure sensor package is provided, comprising a substrate having a pressure port that extends through the substrate from a first side of the substrate to a second side of the substrate. A pressure sensor die is attached to the first side of the substrate, forming a seal over the pressure port on the first side of the substrate. A cover is attached to the first side of the substrate over the pressure sensor die, forming a sealed cavity wherein the pressure sensor die is located within the cavity. The device also comprises a plurality of electrical connectors mounted to the substrate external to the cavity, the plurality of electrical connectors electrically coupled to the pressure sensor die. Further, the substrate includes at least one mounting element configured to secure a pressure port interface to the second side of the substrate in a position around the pressure port.

    Abstract translation: 提供了一种用于模块化压力传感器封装的压力传感器装置，其包括具有从衬底的第一侧延伸穿过衬底到衬底的第二侧的压力端口的衬底。 压力传感器模具附接到基板的第一侧，在基板的第一侧上的压力端口上形成密封。 覆盖件通过压力传感器模具附接到基板的第一侧，形成密封腔，其中压力传感器模具位于空腔内。 该装置还包括多个电连接器，其安装到空腔外部的基板，多个电连接器电耦合到压力传感器芯片。 此外，衬底包括至少一个安装元件，其被配置为在围绕压力端口的位置中将压力端口接口固定到衬底的第二侧。

    Integrated soi pressure sensor having silicon stress isolation member
    4.
    发明公开
    Integrated soi pressure sensor having silicon stress isolation member 有权
    Integrierter SOI-Drucksensor mit Siliziumbelastungsisolierungselement

    公开(公告)号：EP2816335A1

    公开(公告)日：2014-12-24

    申请号：EP14171624.1

    申请日：2014-06-06

    Applicant: Honeywell International Inc.

    Inventor： Brown, Gregory C. ,  Rahn, Curtis

    IPC: G01L19/04 ,  G01L19/14 ,  G01L19/00

    CPC classification number: G01L1/18 ,  G01L19/146 ,  H01L41/04 ,  H01L41/22

    Abstract: In one embodiment a pressure sensor (100) is provided. The pressure sensor (100) includes a housing (104) having an input port (102) configured to allow a media to enter the housing. A support (122) is mounted within the housing, the support defining a first aperture (112) extending therethrough. A stress isolation member (110) is mounted within the first aperture of the support, the stress isolation member defining a second aperture (108) extending therethrough, wherein the stress isolation member is composed of silicon. A sensor die (106) is bonded to the stress isolation member. The sensor die includes a silicon substrate having an insulator layer on a first side (105) of the silicon substrate; and sensing circuitry disposed in the insulator layer on the first side, wherein a second side of the silicon substrate is exposed to the second aperture of the stress isolation member and the second side is reverse of the first side.

    Abstract translation: 在一个实施例中，提供压力传感器（100）。 压力传感器（100）包括具有被配置为允许介质进入壳体的输入端口（102）的壳体（104）。 支撑件（122）安装在壳体内，支撑件限定延伸穿过其中的第一孔（112）。 应力隔离构件（110）安装在支撑件的第一孔内，应力隔离构件限定延伸穿过其中的第二孔（108），其中应力隔离构件由硅组成。 传感器管芯（106）与应力隔离构件接合。 传感器管芯包括在硅衬底的第一侧（105）上具有绝缘体层的硅衬底; 以及设置在所述第一侧上的所述绝缘体层中的感测电路，其中所述硅衬底的第二侧暴露于所述应力隔离构件的所述第二孔，并且所述第二侧与所述第一侧相反。

    Pressure-sensor apparatus
    5.
    发明公开
    Pressure-sensor apparatus 审中-公开
    Drucksensorvorrichtung

    公开(公告)号：EP2128583A2

    公开(公告)日：2009-12-02

    申请号：EP09160879.4

    申请日：2009-05-21

    Applicant: Honeywell International Inc.

    Inventor： Brown, Gregory C. ,  Rahn, Curtis

    IPC: G01L9/06

    CPC classification number: G01L9/0055 ,  G01L19/0069 ,  G01L19/0092

    Abstract: A sensing apparatus for determining the pressure of a fluid includes first and second support members. The first and second support members are configured to define at least one sealed chamber. A flexible diaphragm is disposed between the first and second support members. The diaphragm includes first and second opposing surfaces. The first opposing surface is in fluid communication with a first fluid-flow circuit, and the second opposing surface is in fluid communication with a second fluid-flow circuit. A first electronic circuit is disposed within the at least one chamber and coupled to the diaphragm for sensing a first differential pressure associated with the first and second flow circuits. The first electronic circuit is configured to produce at least one electrical signal proportional to a magnitude of the first differential pressure.

    Abstract translation: 用于确定流体压力的感测装置包括第一和第二支撑构件。 第一和第二支撑构件被构造成限定至少一个密封室。 柔性隔膜设置在第一和第二支撑构件之间。 隔膜包括第一和第二相对表面。 第一相对表面与第一流体流动回路流体连通，并且第二相对表面与第二流体流动回路流体连通。 第一电子电路设置在所述至少一个室内并且耦合到所述隔膜以感测与所述第一和第二流动回路相关联的第一差压。 第一电子电路被配置为产生与第一差压的大小成比例的至少一个电信号。

    Modular pressure sensor
    8.
    发明授权
    Modular pressure sensor 有权

    公开(公告)号：EP2388566B1

    公开(公告)日：2018-07-25

    申请号：EP11165154.3

    申请日：2011-05-06

    Applicant: Honeywell International Inc.

    Inventor： Brown, Gregory C. ,  Larson, Thomas A. ,  Rahn, Curtis

    IPC: G01L9/00

    CPC classification number: G01L19/003

    Abstract: A pressure sensor device for a modular pressure sensor package is provided, comprising a substrate having a pressure port that extends through the substrate from a first side of the substrate to a second side of the substrate. A pressure sensor die is attached to the first side of the substrate, forming a seal over the pressure port on the first side of the substrate. A cover is attached to the first side of the substrate over the pressure sensor die, forming a sealed cavity wherein the pressure sensor die is located within the cavity. The device also comprises a plurality of electrical connectors mounted to the substrate external to the cavity, the plurality of electrical connectors electrically coupled to the pressure sensor die. Further, the substrate includes at least one mounting element configured to secure a pressure port interface to the second side of the substrate in a position around the pressure port.

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