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    ORGANIC COMPOSITIONS
    1.
    发明公开
    ORGANIC COMPOSITIONS 审中-公开
    有机组合物

    公开(公告)号：EP1466356A2

    公开(公告)日：2004-10-13

    申请号：EP03729654.8

    申请日：2003-01-14

    申请人： Honeywell International Inc.

    发明人： LI, Chan-En ,  ZHEREBIN, Ruslan ,  Sleiman Nassrin ,  GEBREBRHAN, Amauel ,  NAMAN, Annath ,  SIKONIA, John, G. ,  LAU, Kreisler ,  APEN, Paul, G. ,  KOROLEV, Boris ,  IWAMOTO, Nancy

    IPC分类号： H01L21/316 ,  H01L21/312 ,  C08J9/26

    CPC分类号： H01L21/02126 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02118 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/31695

    摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula 11 as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly (2-vinyl naphthalene), vinyl anthracene, 1s polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

    摘要翻译： 本发明提供了一种组合物，其包含：（a）介电材料; 和（b）包含至少两个稠合芳环的致孔剂，其中每个稠合芳环在其上具有至少一个烷基取代基并且在相邻芳环上的至少两个烷基取代基之间存在键。 优选地，介电材料为包含（a）热固性组分和（2）至少一种如下所示的式11的低聚物或聚合物的组合物，所述组分包含（1）任选的如下所示的式I的单体，其中Q，G，h ，I，I和W如下所述和（b）致孔剂。 优选地，成孔剂选自未官能化的聚ace烯均聚物，官能化的聚ace烯均聚物，聚ace烯共聚物，聚降冰片烯，聚己内酯，聚（2-乙烯基萘），乙烯基蒽，1s聚苯乙烯，聚苯乙烯衍生物，聚硅氧烷，聚酯，聚醚， ，脂族聚碳酸酯，聚砜，聚丙交酯及其共混物。 本发明组合物特别适用于微芯片，多芯片模块，叠层电路板和印刷线路板中的介电基片材料。