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1.LEAD FREE ALLOYS FOR COLUMN/BALL GRID ARRAYS, ORGANIC INTERPOSERS AND PASSIVE COMPONENT ASSEMBLY 审中-公开
Title translation: 无铅合金列/球栅阵列,ORGANIC之间的部件和无源部件组装公开(公告)号:EP1618605A4
公开(公告)日:2010-09-08
申请号:EP03790123
申请日:2003-11-25
Applicant: IBM
Inventor: FAROOQ MUKTA G , INTERRANTE MARIO J
IPC: H01L23/48 , B23K35/26 , H01L23/485 , H01L23/498 , H01L23/52 , H01L29/40 , H05K3/34
CPC classification number: H01L24/10 , B23K35/262 , B23K2201/36 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/73253 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3436 , H05K3/3463 , H05K2201/10378 , H05K2201/10636 , H05K2201/10674 , H05K2203/041 , H05K2203/0415 , H05K2203/047 , Y02P70/611 , Y02P70/613 , H01L2224/29099 , H01L2924/01083 , H01L2924/01049 , H01L2924/00 , H01L2224/0401