公开(公告)号：EP2392198B1

公开(公告)日：2018-08-22

申请号：EP10704915.7

申请日：2010-01-29

申请人： IMEC VZW ,  Universiteit Gent

发明人： VANFLETEREN, Jan ,  BOSSUYT, Frederick ,  AXISA, Fabrice

IPC分类号： H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00

CPC分类号： H01L21/565 ,  H01L21/6835 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/16225 ,  H05K1/0283 ,  H05K1/186 ,  H05K1/189 ,  H05K3/007 ,  H05K3/06 ,  H05K3/20 ,  H05K3/284 ,  H05K3/4664 ,  H05K3/4685 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/09118 ,  H05K2201/09263 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/1316

公开(公告)号：EP3355666A1

公开(公告)日：2018-08-01

申请号：EP17153335.9

申请日：2017-01-26

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Gavagnin, Marco ,  Krivec, Thomas

IPC分类号： H05K1/18 ,  H01L23/538

CPC分类号： H05K1/183 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/25 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2924/18162 ,  H05K1/185 ,  H05K3/30 ,  H05K2201/10446 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/1469

摘要： An auxiliary structure (100) for embedding a component (102) in a component carrier (104), the auxiliary structure (100) comprising a solid state transition piece (106) for at least partially, in particular substantially fully circumferentially, enclosing the component (102), wherein the solid-state transition piece (106) comprises or consists of a material being or becoming adhesive in a liquid state and being liquefiable by heat and/or pressure so as to fill a gap between the component (102) and surrounding component carrier material (108) by applying heat and/or pressure.

公开(公告)号：EP3111734B1

公开(公告)日：2018-01-24

申请号：EP15716392.4

申请日：2015-02-26

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： WEIDINGER, Gerald ,  ZLUC, Andreas ,  Stahr, Johannes

IPC分类号： H05K1/18 ,  H05K3/10 ,  H01L23/538

CPC分类号： H05K1/188 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H05K3/064 ,  H05K3/108 ,  H05K3/30 ,  H05K2201/10674

公开(公告)号：EP1761118B1

公开(公告)日：2017-11-08

申请号：EP06018351.4

申请日：2006-09-01

申请人： NGK Spark Plug Co., Ltd.

发明人： Urashima, Kazuhiro ,  Yuri, Shinji ,  Sato, Manabu ,  Ogawa, Kohki

IPC分类号： H05K1/18 ,  H01L23/12

CPC分类号： H05K1/185 ,  H01G2/06 ,  H01G4/40 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K1/0233 ,  H05K1/0234 ,  H05K3/4602 ,  H05K2201/10045 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2924/00 ,  H01L2224/05599

公开(公告)号：EP2274962A4

公开(公告)日：2017-06-28

申请号：EP09732413

申请日：2009-04-06

申请人： GE EMBEDDED ELECTRONICS OY

发明人： PALM PETTERI ,  KUJALA ARNI

IPC分类号： H05K3/00 ,  H01L23/31

CPC分类号： H05K1/185 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/90 ,  H01L25/0652 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/2919 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K1/188 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/10674 ,  H05K2203/1469 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.

摘要翻译： 一种用于制造接线板的方法，包括以下步骤：在平面临时接合装置的每一侧上安装至少一个结构辅助件，在平面临时接合装置的每一侧上布置来自至少一个结构辅助件的狭槽，将嵌入 电部件插入槽中，使得电部件的端子远离平面临时接合装置，将至少一个电部件安装在部件箔上，使得电部件的端子面对部件箔，将部件 至少部分地在所述至少一个结构辅助件上在所述平面临时接合装置的每一侧上贴箔。

公开(公告)号：EP2684434B1

公开(公告)日：2016-12-28

申请号：EP12708973.8

申请日：2012-03-06

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives ,  3D Plus

发明人： LIMOUSIN, Olivier ,  SOUFFLET, Fabrice

IPC分类号： H05K3/32 ,  H05K3/40 ,  H01L21/60 ,  H01L23/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/12

CPC分类号： H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81191 ,  H01L2224/8185 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/12042 ,  H05K3/027 ,  H05K3/06 ,  H05K3/12 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2203/107 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

公开(公告)号：EP3042394A1

公开(公告)日：2016-07-13

申请号：EP14767221.6

申请日：2014-09-03

申请人： Qualcomm Incorporated

发明人： YUN, Changhan Hobie ,  ZUO, Chengjie ,  KIM, Jonghae ,  KIM, Daeik Daniel ,  VELEZ, Mario Francisco

IPC分类号： H01L23/498

CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/115 ,  H05K1/181 ,  H05K3/46 ,  H05K2201/10378 ,  H05K2201/10674 ,  Y10T29/49165

摘要： An interposer for a chipset includes multilayer thin film capacitors incorporated therein to reduce parasitic inductance in the chipset. Power and ground terminals are laid out in a staggered pattern to cancel magnetic fields between conductive vias to reduce equivalent series inductance (ESL).

公开(公告)号：EP2482311A3

公开(公告)日：2016-06-08

申请号：EP12150102.7

申请日：2012-01-03

申请人： Fujitsu Limited

发明人： Akamatsu, Toshiya

IPC分类号： H01L23/498 ,  H01L21/98 ,  H01L25/065 ,  H01L23/14 ,  H01L23/48 ,  H01L21/60

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11002 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13027 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16141 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/1624 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/83102 ,  H01L2224/9201 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15159 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2224/13099 ,  H01L2224/11 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/48624 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor element (2) and an electronic element (3). The semiconductor element has a first protruding electrode (2a), and the electronic element has a second protruding electrode (3a). A substrate (4) is disposed between the semiconductor element (2) and the electronic element (3). The substrate has a through-hole (4a) in which the first and second protruding electrodes (2a, 3a) are fitted. The first and second protruding electrodes are connected together inside the through-hole (4a) of the substrate.

公开(公告)号：EP3005847A1

公开(公告)日：2016-04-13

申请号：EP14801666.0

申请日：2014-04-11

申请人： Nokia Technologies OY

发明人： ALLEN, Mark Lee ,  BOWER, Chris ,  COTTON, Darryl

IPC分类号： H05K3/10

CPC分类号： H05K1/0272 ,  H01L23/52 ,  H01L24/00 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24101 ,  H01L2224/24226 ,  H01L2224/24997 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/2919 ,  H01L2224/82101 ,  H01L2224/82138 ,  H01L2224/8284 ,  H01L2224/82862 ,  H01L2224/82874 ,  H01L2224/82877 ,  H01L2224/82986 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K1/092 ,  H05K1/097 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0257 ,  H05K2201/0302 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate (101) comprising a fluid reservoir (102) and a connected fluid channel (103), the fluid reservoir (102) positioned away from a component region (104) of the substrate (101), the fluid channel (103) configured to extend from the fluid reservoir (102) to guide an electrically conductive fluid from the fluid reservoir (102) at a reservoir end (105) of the fluid channel (103) through the fluid channel (103) to a component end (106) of the fluid channel (103), the component end (106) extending to the component region (104) of the substrate (101) to enable the formation of an electrical connection to a connector of an electronic component appropriately positioned in the component region (104), formation of the electrical connection allowing the electronic component to be interconnected to other electronic components using one or more of the fluid reservoir (102) and fluid channel (103).

摘要翻译： 包括流体储存器和连接的流体通道的基底，所述流体储存器远离所述基底的部件区域定位，所述流体通道被配置为从所述流体储存器延伸以在所述流体储存器的储存器端部处引导来自所述流体储存器的导电流体 通过流体通道的流体通道流到流体通道的部件端，部件端延伸到基板的部件区域，以使得能够形成与适当地定位在部件区域中的电子部件的连接器的电连接，形成 的电连接，允许使用一个或多个流体储存器和流体通道将电子部件互连到其他电子部件。

公开(公告)号：EP1770776B1

公开(公告)日：2015-08-12

申请号：EP06254920.9

申请日：2006-09-22

申请人： TDK Corporation

发明人： Kawabata, Kenichi ,  Morita, Takaaki

IPC分类号： H01L23/538 ,  H01L23/544 ,  H01L21/683 ,  H05K1/18 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/544 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2221/68368 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13171 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/83136 ,  H01L2224/92244 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/4652 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/1469 ,  H05K2203/166 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00