公开(公告)号：EP1587764A4

公开(公告)日：2009-04-15

申请号：EP03790042

申请日：2003-11-25

Applicant: IBM

Inventor： GOVINDARAJAN NATARAJAN ,  AHMAD UMAR ,  BEZAMA RASHID J ,  HUMENIK JAMES N ,  KNICKERBOCKER JOHN U ,  VALLABHANENI RAO V

IPC: B01L3/00 ,  B29C65/00 ,  B32B18/00 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00

CPC classification number: B32B18/00 ,  B01J2219/00286 ,  B01J2219/00317 ,  B01L3/502707 ,  B01L3/5085 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2300/12 ,  B81B2203/0338 ,  B81B2203/0353 ,  B81C1/00119 ,  C04B35/645 ,  C04B2235/6567 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/704

Abstract: A plate (10) for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures (22) (24) in a set of greensheets are formed by a material removal process, at least some of the apertures (25) being filled with a fugitive material (222) that escapes during sintering.

公开(公告)号：EP3028294A4

公开(公告)日：2016-10-19

申请号：EP14832804

申请日：2014-07-29

Applicant: IBM

Inventor： DANG BING ,  KNICKERBOCKER JOHN U ,  TSANG CORNELIA KANG-I

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67132 ,  B23K26/36 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation

Abstract translation: 提供的结构和方法用于使用包括一个或多个可使用中波长红外辐射激光可消除的可释放层的结合结构将处理器晶片临时粘合到器件晶片