公开(公告)号：EP3221882A4

公开(公告)日：2018-05-02

申请号：EP15897979

申请日：2015-07-14

申请人： GOERTEK INC

发明人： ZOU QUANBO ,  WANG ZHE

IPC分类号： H01L21/60 ,  H01L21/66 ,  H01L21/683

CPC分类号： H01L24/97 ,  H01L21/50 ,  H01L21/6835 ,  H01L22/14 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/81907 ,  H01L2224/83005 ,  H01L2224/83101 ,  H01L2224/83143 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2221/68304 ,  H01L21/78 ,  H01L22/10 ,  H01L2224/83104 ,  H01L2924/014

摘要： The present invention discloses a assembling method, a manufacturing method, an device and an electronic apparatus of flip-die. The method for assembling a flip-die, comprises: temporarily bonding the flip-die onto a laser-transparent first substrate, wherein bumps of the flip-die are located on the side of the flip-die opposite to the first substrate; aligning the bumps with pads on a receiving substrate; irradiating the original substrate with laser from the first substrate side to lift-off the flip-die from the first substrate; and attaching the flip-die on the receiving substrate. A faster assembly rate can be achieved by using the present invention. A smaller chip size can be achieved by using the present invention. A lower profile can be achieved by using the present invention.

公开(公告)号：EP3138120B1

公开(公告)日：2018-04-18

申请号：EP15722629.1

申请日：2015-04-29

申请人： Corning Incorporated

发明人： TSAI, Chih-Wei ,  WANG, Bor Kai

IPC分类号： H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L21/683

CPC分类号： H01L23/49827 ,  C03C15/00 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for manufacturing vias in a glass substrate includes bonding, through a bonding layer, a first face of the glass substrate including a plurality of holes to a first face of a glass carrier. The bonding layer has a thickness t between the first face of the glass substrate and the first face of the glass carrier and extends into at least some of the plurality of holes to a depth h from the first face of the glass substrate. The method includes etching back the bonding layer to a depth d through the plurality of holes in the glass substrate. The depth d is less than the sum of the thickness t and the depth h. The method can include filling the plurality of holes with an electrically conductive material, and de-bonding the glass substrate from the bonding layer and the glass carrier.

公开(公告)号：EP3195337A4

公开(公告)日：2018-04-11

申请号：EP15827678

申请日：2015-07-31

申请人： WESTERN MICHIGAN UNIV RESEARCH FOUNDATION

发明人： JOYCE MARGARET K ,  JOYCE MICHAEL JAMES ,  ESHKEITI ALI ,  ATASHBAR MASSOOD ZANDI ,  FLEMING PAUL D III

IPC分类号： H05K3/00 ,  B41M1/22 ,  B41M5/00 ,  G01L1/14 ,  G01L1/22 ,  H01F5/00 ,  H01G4/30 ,  H01G4/33 ,  H01L21/64 ,  H01Q9/00 ,  H05K1/16 ,  H05K3/20

CPC分类号： H01G4/30 ,  B41M1/22 ,  B41M5/0023 ,  G01L1/142 ,  G01L1/2287 ,  H01F27/2804 ,  H01F41/042 ,  H01G4/32 ,  H01G4/33 ,  H01G11/22 ,  H01G11/86 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01Q1/2225 ,  H01Q1/273 ,  H01Q1/38 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/007 ,  H05K3/20 ,  H05K3/207 ,  H05K2201/09263 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/1461 ,  H05K2203/308

摘要： A method of forming a self-supported electronic device, including depositing a sacrificial layer on a first surface substrate, wherein the sacrificial layer is substantially soluble in a first solvent. At least one device layer is deposited in a desired pattern on top of the sacrificial layer. The at least one device layer is substantially insoluble in the at least one device layer. The sacrificial layer is at least partially dissolved in the first solvent to release at least a portion of the first device layer from the substrate. The at least one device layer removed from the substrate forms a self-supported electronic device, which is a thin film electronic device having at least a portion thereof that is not supported by a material carrier.

公开(公告)号：EP2575163A3

公开(公告)日：2017-12-27

申请号：EP12191692.8

申请日：2011-04-15

申请人： Suss MicroTec Lithography GmbH

发明人： George, Gregory

IPC分类号： H01L21/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/68 ,  B32B43/00 ,  B32B38/18

CPC分类号： B32B43/006 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67103 ,  H01L21/67132 ,  H01L21/68 ,  H01L21/6835 ,  H01L21/6838 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381

摘要： A debonder apparatus 600) for debonding a temporary bonded wafer pair (10) includes a chuck assembly, a flex plate assembly, a contact roller (260) and a resistance roller (610). The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair (10) in contact with a top surface of the chuck. The flex plate assembly includes a flex plate (253) and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair (10) in contact with a first surface of the flex plate. The flex plate (253) is configured to be placed above the top surface of the chuck. The contact roller (260) is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller (610) includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate. The contact roller (260) pushes and lifts up the first edge of the flex plate while the resistance roller (610) simultaneously applies the downward force upon the flex plate (253) and traverses horizontally away from the first edge of the flex plate and thereby the temporary bonded wafer pair (10) delaminates along a release layer and the first and second wafers are separated from each other.

摘要翻译： 用于松开临时结合晶片对（10）的松解装置600包括卡盘组件，柔性板组件，接触辊（260）和阻力辊（610）。 卡盘组件包括卡盘和第一晶片保持器，该第一晶片保持器构造成保持临时接合晶片对（10）的第一晶片与卡盘的顶表面接触。 挠性板组件包括挠性板（253）和第二晶圆保持器，该第二晶圆保持器被构造成保持临时接合晶圆对（10）的第二晶圆与挠性板的第一表面接触。 挠性板（253）构造成放置在卡盘的顶表面上方。 接触辊（260）布置在卡盘的第一边缘附近并且包括用于推动和提升柔性板的第一边缘的装置。 阻力辊（610）包括用于在挠性板上水平横移的装置和用于在挠性板上施加向下的力的装置。 当阻力辊（610）同时向挠性板（253）施加向下的力并且从挠性板的第一边缘水平地横向穿过并由此抵接辊（260）推动并提升挠性板的第一边缘 临时接合晶片对（10）沿着释放层分层并且第一和第二晶片彼此分离。

公开(公告)号：EP3112434B1

公开(公告)日：2017-12-13

申请号：EP16173969.3

申请日：2016-06-10

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： TANABE, Masahito ,  SUGO, Michihiro ,  YASUDA, Hiroyuki

IPC分类号： C09J183/04 ,  H01L21/302 ,  H01L21/683 ,  B32B7/12

CPC分类号： H01L21/6835 ,  B32B7/12 ,  B32B9/04 ,  B32B9/043 ,  B32B9/045 ,  B32B25/08 ,  B32B25/20 ,  B32B27/08 ,  B32B27/325 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2264/105 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/302 ,  B32B2307/50 ,  B32B2457/08 ,  B32B2457/14 ,  C08G77/12 ,  C08G77/20 ,  C08L83/00 ,  C09J109/06 ,  C09J183/04 ,  H01L21/02013 ,  H01L21/302 ,  H01L21/304 ,  H01L21/31133 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

摘要： A temporary bonding arrangement for wafer processing is provided comprising a first temporary bond layer (A) of thermoplastic resin, a second temporary bond layer (B) of thermosetting siloxane polymer, and a third temporary bond layer (C) of thermosetting polymer. Layer (B) is cured with a curing catalyst contained in layer (A) which is laid contiguous to layer (B). An adhesive layer of uniform thickness is formed without insufficient step coverage and other failures.

公开(公告)号：EP3236493A1

公开(公告)日：2017-10-25

申请号：EP15869152.7

申请日：2015-11-17

申请人： BOE Technology Group Co., Ltd.

发明人： SUN, Li

IPC分类号： H01L21/683 ,  H01L51/56

CPC分类号： H01L51/003 ,  H01L21/683 ,  H01L21/6835 ,  H01L27/3244 ,  H01L27/3281 ,  H01L51/0097 ,  H01L51/56 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338

摘要： Embodiments of the present invention disclose a method of manufacturing a flexible display substrate. The method includes steps of: forming, on a support substrate, a separation pattern layer comprising a plurality of separation units arranged at intervals; forming an adhesion layer on the support substrate formed with the separation pattern layer; forming a flexible base substrate on the adhesion layer and forming a display element on a side of the flexible base substrate opposite to the adhesion layer; performing a peeling preprocessing on the support substrate, and peeling the flexible base substrate from the support substrate to form the flexible display substrate. Embodiments of the present invention also disclose a mother substrate for a flexible display substrate. In the embodiments of the present invention, with a gap which is uniformly generated between the flexible display substrate and the support substrate by heating or by pressing, the flexible display substrate is more easily peeled, alleviating and even eliminating deformation of the flexible display substrate, and thus improving a yield of the flexible display substrate and decreasing a manufacturing cost of the flexible display substrate. In addition, the technical solutions of the present invention further have the advantages that they are simple, easy to be implemented, and the like.

摘要翻译： 本发明的实施例公开了一种制造柔性显示器基板的方法。 该方法包括以下步骤：在支撑基板上形成包括间隔布置的多个分离单元的分离图案层; 在形成有分离图案层的支撑基板上形成粘合层; 在所述粘合层上形成柔性基底基板并在所述柔性基底基板的与所述粘合层相反的一侧上形成显示元件; 对支撑基板进行剥离预处理，将柔性基板从支撑基板剥离，形成柔性显示基板。 本发明的实施例还公开了用于柔性显示器基板的母基板。 在本发明实施例中，通过加热或按压在柔性显示基板和支撑基板之间均匀产生间隙，柔性显示基板更容易剥落，减轻甚至消除柔性显示基板的变形， 从而提高了柔性显示基板的成品率，降低了柔性显示基板的制造成本。 另外，本发明的技术方案还具有简单，易于实施等优点。

公开(公告)号：EP3221882A1

公开(公告)日：2017-09-27

申请号：EP15897979.9

申请日：2015-07-14

申请人： Goertek Inc.

发明人： ZOU, Quanbo ,  WANG, Zhe

IPC分类号： H01L21/50

CPC分类号： H01L24/97 ,  H01L21/50 ,  H01L21/6835 ,  H01L22/14 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81011 ,  H01L2224/81121 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/81907 ,  H01L2224/83005 ,  H01L2224/83101 ,  H01L2224/83143 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2221/68304 ,  H01L21/78 ,  H01L22/10 ,  H01L2224/83104 ,  H01L2924/014

摘要： The present invention discloses a assembling method, a manufacturing method, an device and an electronic apparatus of flip-die. The method for assembling a flip-die, comprises: temporarily bonding the flip-die onto a laser-transparent first substrate, wherein bumps of the flip-die are located on the side of the flip-die opposite to the first substrate; aligning the bumps with pads on a receiving substrate; irradiating the original substrate with laser from the first substrate side to lift-off the flip-die from the first substrate; and attaching the flip-die on the receiving substrate. A faster assembly rate can be achieved by using the present invention. A smaller chip size can be achieved by using the present invention. A lower profile can be achieved by using the present invention.

摘要翻译： 公开了一种倒装芯片的组装方法，制造方法，装置和电子装置。 用于组装翻转模的方法包括：将翻转模（205）暂时接合到激光透明的第一基板（204）上，其中翻转模（205）的凸块（202）位于激光透过的第一基板 与所述第一基板（204）相对的所述翻转模（205）; 将凸块（202）与衬垫（206）对准在接收衬底（207）上; 用激光（208）从所述第一衬底侧照射所述原始衬底以从所述第一衬底（204）剥离所述倒装管芯（205）; 并将翻转模（205）附着在接收基板（207）上。 可以实现更快的组装速度，更小的芯片尺寸和更低的外形。

公开(公告)号：EP3171390A1

公开(公告)日：2017-05-24

申请号：EP15821437.9

申请日：2015-07-16

申请人： Lan Technical Service Co., Ltd. ,  Suga, Tadatomo

发明人： SUGA Tadatomo ,  MATSUMOTO Yoshiie

IPC分类号： H01L21/02 ,  B65G49/06 ,  H01L21/683 ,  H01L51/50 ,  H05B33/02 ,  H05B33/04 ,  H05B33/10

CPC分类号： H01L51/003 ,  B32B7/06 ,  B32B17/064 ,  B32B2379/08 ,  B65G49/061 ,  C03C17/002 ,  C03C19/00 ,  C03C27/10 ,  C03C2218/31 ,  H01L21/185 ,  H01L21/6835 ,  H01L51/0096 ,  H01L51/524 ,  H01L51/56 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2227/326

摘要： [Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate.
[Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.

摘要翻译： 提供一种技术，其允许膜或玻璃粘合到传送基板并且在制造基板期间容易分离。 解决方案提供一种用于制造表面上形成有电子器件的基板的方法，所述方法包括形成步骤，用于在形成电子器件的基板的至少一个接合表面上形成无机材料层 表面将被结合到运输基板以及用于运输基板的运输基板上的结合表面; 粘合步骤，用于将所述基板和所述传送基板相互挤压并通过所述无机材料层粘合所述基板和所述传送基板; 以及用于分离衬底和传输衬底的分离步骤。

公开(公告)号：EP2706561B1

公开(公告)日：2017-04-05

申请号：EP13195920.7

申请日：2009-09-01

申请人： EV Group GmbH

发明人： Lindner, Friedrich Paul ,  Burggraf, Jürgen

IPC分类号： H01L21/67 ,  H01L21/683

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B43/003 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10S156/941 ,  Y10S156/942 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/1184 ,  Y10T156/19 ,  Y10T156/1922 ,  Y10T156/1961 ,  Y10T156/1967

公开(公告)号：EP3143641A1

公开(公告)日：2017-03-22

申请号：EP15793023.1

申请日：2015-05-08

申请人： Arizona Board of Regents, a Body Corporate of the State of Arizona acting for and on behalf of Arizona State University

发明人： HOWARD, Emmett ,  MUNIZZA, Nicholas ,  YEE, Paul ,  MARRS, Michael

IPC分类号： H01L21/60

CPC分类号： H01L24/83 ,  H01L21/6835 ,  H01L24/29 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2224/8309 ,  H01L2224/83359

摘要： Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

摘要翻译： 一些实施例包括一种方法。 该方法可以包括：提供载体基底; 在载体基板粘附改性层的提供; 提供的器件衬底; 和器件基板和载体衬底连接在一起，粘合改性层位于所述器件衬底和载体基片。当器件衬底和载体衬底连接在一起之间。 在本文实施例中，密合性改性层可以通过用第一粘合力的粘合改性层的方式进行配置，以便没有所述装置的基板与所述载体基片间接地耦合并大于第二粘接力大，通过该设备的基板连接至该 载体衬底不存在的粘接改性层。 因此相关的方法和设备的其他实施例是游离缺失盘。