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1.DIELECTRIC CAP HAVING MATERIAL WITH OPTICAL BAND GAP TO SUBSTANTIALLY BLOCK UV RADIATION DURING CURING TREATMENT, AND RELATED METHODS 审中-公开
Title translation: 与光学带隙的材料的介电CLOSURE基本上LOCKED对UV辐射硬化及相关过程期间公开(公告)号:EP2111637A4
公开(公告)日:2012-08-08
申请号:EP08728172
申请日:2008-01-24
Applicant: IBM
Inventor: BELYANSKY MICHAEL P , BONILLA GRISELDA , LIU XIAO HU , NGUYEN SON VAN , SHAW THOMAS M , SHOBHA HOSADURGA K , YANG DAEWON
IPC: H01L23/12 , H01L21/3105 , H01L21/318 , H01L21/768
CPC classification number: H01L21/02123 , H01L21/02126 , H01L21/02167 , H01L21/0217 , H01L21/02274 , H01L21/02348 , H01L21/318 , H01L21/3185 , H01L21/76826 , H01L21/76828 , H01L21/76834