Patent search ap:("IBM") AND inv:"NGUYEN SON VAN" Page 1

1.

发明公开
DIELECTRIC CAP HAVING MATERIAL WITH OPTICAL BAND GAP TO SUBSTANTIALLY BLOCK UV RADIATION DURING CURING TREATMENT, AND RELATED METHODS 审中-公开
Title translation: 与光学带隙的材料的介电CLOSURE基本上LOCKED对UV辐射硬化及相关过程期间

公开(公告)号：EP2111637A4

公开(公告)日：2012-08-08

申请号：EP08728172

申请日：2008-01-24

Applicant: IBM

Inventor： BELYANSKY MICHAEL P , BONILLA GRISELDA , LIU XIAO HU , NGUYEN SON VAN , SHAW THOMAS M , SHOBHA HOSADURGA K , YANG DAEWON

IPC: H01L23/12 , H01L21/3105 , H01L21/318 , H01L21/768

CPC classification number: H01L21/02123 , H01L21/02126 , H01L21/02167 , H01L21/0217 , H01L21/02274 , H01L21/02348 , H01L21/318 , H01L21/3185 , H01L21/76826 , H01L21/76828 , H01L21/76834

2.

发明公开
ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS 审中-公开
Title translation: LAYER超低介电常数和控制性双轴应力

公开(公告)号：EP1854131A4

公开(公告)日：2011-03-30

申请号：EP06849665

申请日：2006-01-12

Applicant: IBM

Inventor： DIMITRAKOPOULOS CHRISTOS D , GATES STEPHEN M , GRILL ALFRED , LANE MICHAEL W , LINIGER ERIC G , LIU XIAO HU , NGUYEN SON VAN , NEUMAYER DEBORAH A , SHAW THOMAS M

IPC: H01L21/20 , B05C11/00 , B32B3/26

CPC classification number: H01L21/76834 , C23C16/30 , C23C16/56 , H01L21/02126 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02348 , H01L21/3105 , H01L21/31058 , H01L21/31633 , H01L21/76801 , H01L21/76825 , H01L21/76828 , H01L21/76829 , H01L21/76832 , Y10T428/249953 , Y10T428/249969 , Y10T428/249979

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