摘要:
The present invention relates to a diode (300) comprising a p-doped region (312), an n-doped region (314), and a light-sensitive intrinsic region (310) sandwiched laterally between the p-doped region (312) and the n-doped region (314) in a direction transverse to a direction of light propagation in the diode (300). The p-doped region (312) is made of a first material doped with a first type of dopant and the n-doped region (314) is made of a third material doped with a second type of dopant. The first material includes Si or SiGe. The third material includes Si or SiGe. The intrinsic region (310) is made of a second material different to at least one of the first material and the second material. The second material includes Ge, GeSn, or SiGe. The intrinsic region (310) has a maximal lateral extension between two lateral ends (318, 320) of the intrinsic region (310) of equal to or below 400 nm. The intrinsic region (310) is produced such that it (310) is not doped when the diode (300) is produced.
摘要:
Es wird eine Diode beschrieben, mit einem lichtempfindlichen Germanium-Gebiet (5), das sich auf einem Wellenleiter (2) aus Silizium oder Silizium-Germanium befindet und das im Vergleich mit dem Wellenleiter identische oder um maximal 20 nm pro Seite kürzere laterale Abmessungen in einer Richtung quer zu einer Lichtausbreitungsrichtung im Wellenleiter hat. Die Diode im Germaniumgebiet enthält eine laterale Anordnung eines N-dotierten (5b), eines intrisischen (5) und eines P-dotierten (5a) Germanium-Gebiets. Ausserdem schliessen sich seitlich an die P- und N-dotierten Gebiete (5a, 5b) im Germanium-Gebiet weitere homogen dotierte Ausläufer (6a, 6b) aus Silizium oder Silizium-Germanium an, die sich in vertikaler Richtung mindestens bis zu einem Niveau erstrecken, welches auf gleicher Höhe ist wie ein in der vertikalen Richtung höchster Punkt des Germanium-Gebiets (5).
摘要:
A diode comprising a light-sensitive germanium region, which is totally embedded in silicon and forms with the silicon a lower interface and lateral interfaces, wherein the lateral interfaces do not run perpendicularly, but rather obliquely with respect to the lower interface and therefore produce a facet form.
摘要:
The present invention relates to a diode (300) comprising a p-doped region (312), an n-doped region (314), and a light-sensitive intrinsic region (310) sandwiched laterally between the p-doped region (312) and the n-doped region (314) in a direction transverse to a direction of light propagation in the diode (300). The p-doped region (312) is made of a first material doped with a first type of dopant and the n-doped region (314) is made of a third material doped with a second type of dopant. The first material includes Si or SiGe. The third material includes Si or SiGe. The intrinsic region (310) is made of a second material different to at least one of the first material and the second material. The second material includes Ge, GeSn, or SiGe. The intrinsic region (310) has a maximal lateral extension between two lateral ends (318, 320) of the intrinsic region (310) of equal to or below 400 nm. The intrinsic region (310) is produced such that it (310) is not doped when the diode (300) is produced.