摘要:
The present invention is related to a method for sharpening the tip of a microprobe, in particular a neural probe (2) or an array (1) of neuroprobes (2) having a common base portion (3). The probes have a constant thickness and a chisel-shaped tip portion (5). The probes are attached to the slanted side (12) of a wedge-shaped carrier (10), with the probe tips (5) placed in close proximity to the edge (13) of the carrier, preferably extending over said edge. The base (11) of the carrier is then subjected to a grinding step, possibly followed by a polishing step, so that the probe tips of the probes are ground to form a sharp pointed tip shape (101).
摘要:
The present invention is related to a method for masked anodization of an anodizable layer on a substrate, for example an aluminium layer present on a sacrificial layer, wherein the sacrificial layer needs to be removed from a cavity comprising a Micro or Nano Electromechanical System (MEMS or NEMS). Anodization of an Al layer leads to the formation of elongate pores, through which the sacrificial layer can be removed. According to the method of the invention, the anodization of the Al layer is done with the help of a first mask which defines the area to be anodized, and a second mask which defines a second area to be anodized, said second area surrounding the first area. Anodization of the areas defined by the first and second mask leads to the formation of an anodized structure in the form of a closed ring around the first area, which forms a barrier against unwanted lateral anodization in the first area.
摘要:
In the present invention a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Also connections to external circuitry can be realised. Also microfluidic channels (10) in the microstructures (20) can be connected to external equipment. Also a method to fabricate and assemble the device is provided.
摘要:
In the present invention a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Also connections to external circuitry can be realised. Also microfluidic channels (10) in the microstructures (20) can be connected to external equipment. Also a method to fabricate and assemble the device is provided.
摘要:
In the present invention a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Also connections to external circuitry can be realised. Also microfluidic channels (10) in the microstructures (20) can be connected to external equipment. Also a method to fabricate and assemble the device is provided.