公开(公告)号：EP4060733A2

公开(公告)日：2022-09-21

申请号：EP22171597.2

申请日：2019-05-03

申请人： INTEL Corporation

发明人： SANKMAN, Robert ,  AGRAGARAM, Sairam ,  OU, Shenquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang ,  WANG, Guotao

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L21/60

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP4060733A3

公开(公告)日：2022-11-16

申请号：EP22171597.2

申请日：2019-05-03

申请人： INTEL Corporation

发明人： SANKMAN, Robert ,  AGRAGARAM, Sairam ,  OU, Shenquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang ,  WANG, Guotao

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L21/60 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.