公开(公告)号：EP4060733A3

公开(公告)日：2022-11-16

申请号：EP22171597.2

申请日：2019-05-03

申请人： INTEL Corporation

发明人： SANKMAN, Robert ,  AGRAGARAM, Sairam ,  OU, Shenquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang ,  WANG, Guotao

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L21/60 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP3803973A1

公开(公告)日：2021-04-14

申请号：EP19814378.6

申请日：2019-05-03

申请人： Intel Corporation

发明人： SANKMAN, Robert, L. ,  AGRAHARAM, Sairam ,  OU, Shengquan ,  DE BONIS, Thomas, J ,  SPENCER, Todd ,  SUN, Yang ,  WANG, Guotao

IPC分类号： H01L25/065 ,  H01L23/528 ,  H01L23/00

公开(公告)号：EP4325552A2

公开(公告)日：2024-02-21

申请号：EP23219820.0

申请日：2019-05-03

申请人： Intel Corporation

发明人： SANKMAN, Robert ,  AGRGHARAM, Sairam ,  WANG, Guotao ,  OU, Shengquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang

IPC分类号： H01L21/60

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP3982407A3

公开(公告)日：2022-07-20

申请号：EP21210501.9

申请日：2019-05-03

申请人： INTEL Corporation

发明人： SANKMAN, Robert ,  AGRAHARAM, Sairam ,  OU, Shengquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang ,  WANG, Guotao

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L21/60

摘要： An electronic device including a first die (110) that includes a first set of die contacts (230). The electronic device includes a second die (120) that includes a second set of die contacts (260). The electronic device includes a bridge interconnect (140) that includes a first set of bridge contacts (310) and a second set of bridge contacts (320). The first set of bridge contacts are directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts are directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect helps facilitate electrical communication between the first die and the second die.

公开(公告)号：EP4235755A2

公开(公告)日：2023-08-30

申请号：EP23176064.6

申请日：2019-05-03

申请人： INTEL Corporation

发明人： SANKMAN, Robert ,  AGRAHARAM, Sairam ,  WANG, Guotao ,  OU, Shengquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang

IPC分类号： H01L21/60

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts(e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP4060733A2

公开(公告)日：2022-09-21

申请号：EP22171597.2

申请日：2019-05-03

申请人： INTEL Corporation

发明人： SANKMAN, Robert ,  AGRAGARAM, Sairam ,  OU, Shenquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang ,  WANG, Guotao

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L21/60

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP4325552A3

公开(公告)日：2024-07-10

申请号：EP23219820.0

申请日：2019-05-03

申请人： Intel Corporation

发明人： SANKMAN, Robert ,  AGRGHARAM, Sairam ,  WANG, Guotao ,  OU, Shengquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang

IPC分类号： H01L21/60 ,  H01L25/065 ,  H01L21/98 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L21/56 ,  H01L21/568 ,  H01L23/5385 ,  H01L23/49816 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2224/132920130101 ,  H01L2224/13320130101 ,  H01L2224/0822520130101 ,  H01L2224/0410520130101 ,  H01L2224/920220130101 ,  H01L2224/1210520130101 ,  H01L2224/9720130101 ,  H01L2224/1622720130101 ,  H01L2224/8198620130101 ,  H01L24/95 ,  H01L24/81 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/8119220130101 ,  H01L2224/8119120130101 ,  H01L2224/170320130101 ,  H01L2224/8100520130101 ,  H01L2224/9500120130101 ,  H01L2224/3224520130101 ,  H01L2224/7325320130101 ,  H01L2224/7320920130101 ,  H01L2924/1816220130101 ,  H01L2924/1816120130101 ,  H01L24/96 ,  H01L2224/7320420130101 ,  H01L2224/3222520130101 ,  H01L25/0652 ,  H01L2224/0618120130101 ,  H01L2224/055720130101 ,  H01L2225/0651320130101 ,  H01L2225/0651720130101 ,  H01L2225/0654120130101 ,  H01L2225/0656220130101 ,  H01L2225/0658620130101 ,  H01L2224/0814520130101 ,  H01L2224/1614520130101 ,  H01L2924/1625120130101 ,  H01L2224/8203920130101 ,  H01L2223/5442620130101 ,  H01L2224/9222420130101 ,  H01L24/19 ,  H01L2924/1519220130101 ,  H01L25/50 ,  H01L2224/13120130101 ,  H01L2224/7325120130101 ,  H01L2224/040120130101 ,  H01L2224/1718120130101 ,  H01L24/73 ,  H01L24/08

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP4235755A3

公开(公告)日：2024-02-21

申请号：EP23176064.6

申请日：2019-05-03

申请人： INTEL Corporation

发明人： SANKMAN, Robert ,  AGRAHARAM, Sairam ,  WANG, Guotao ,  OU, Shengquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang

IPC分类号： H01L21/60 ,  H01L25/065 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts(e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP3982407A2

公开(公告)日：2022-04-13

申请号：EP21210501.9

申请日：2019-05-03

申请人： INTEL Corporation

发明人： SANKMAN, Robert ,  AGRAHARAM, Sairam ,  OU, Shengquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang ,  WANG, Guotao

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L21/60

摘要： An electronic device including a first die (110) that includes a first set of die contacts (230). The electronic device includes a second die (120) that includes a second set of die contacts (260). The electronic device includes a bridge interconnect (140) that includes a first set of bridge contacts (310) and a second set of bridge contacts (320). The first set of bridge contacts are directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts are directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect helps facilitate electrical communication between the first die and the second die.