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公开(公告)号:EP4191655A3
公开(公告)日:2023-08-23
申请号:EP22204391.1
申请日:2022-10-28
申请人: INTEL Corporation
发明人: HUANG, Cheng-Ying , MORROW, Patrick , VENKATARAMAN, Arunshankar , MA, Sean T. , RACHMADY, Willy , THOMAS, Nicole K. , RADOSAVLJEVIC, Marko , KAVALIEROS, Jack T.
IPC分类号: H01L21/822 , H01L27/06 , H01L21/8234 , H01L21/8238 , H01L27/088 , H01L27/092 , H01L29/775
摘要: Techniques are provided herein to form semiconductor devices having a stacked transistor configuration. An n-channel device and a p-channel device may both be gate-all-around (GAA) transistors each having any number of nanoribbons extending in the same direction where one device is located vertically above the other device. According to some embodiments, the n-channel device and the p-channel device conductively share the same gate, and a width of the gate structure around one device is greater than the width of the gate structure around the other device. According to some other embodiments, the n-channel device and the p-channel device each have a separate gate structure that is isolated from the other using a dielectric layer between them. A gate contact is adjacent to the upper device and contacts the gate structure of the other lower device.
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公开(公告)号:EP4191655A2
公开(公告)日:2023-06-07
申请号:EP22204391.1
申请日:2022-10-28
申请人: INTEL Corporation
发明人: HUANG, Cheng-Ying , MORROW, Patrick , VENKATARAMAN, Arunshankar , MA, Sean T. , RACHMADY, Willy , THOMAS, Nicole K. , RADOSAVLJEVIC, Marko , KAVALIEROS, Jack T.
IPC分类号: H01L21/822 , H01L27/06 , H01L21/8234 , H01L21/8238 , H01L27/088 , H01L27/092 , H01L29/775
摘要: Techniques are provided herein to form semiconductor devices having a stacked transistor configuration. An n-channel device and a p-channel device may both be gate-all-around (GAA) transistors each having any number of nanoribbons extending in the same direction where one device is located vertically above the other device. According to some embodiments, the n-channel device and the p-channel device conductively share the same gate, and a width of the gate structure around one device is greater than the width of the gate structure around the other device. According to some other embodiments, the n-channel device and the p-channel device each have a separate gate structure that is isolated from the other using a dielectric layer between them. A gate contact is adjacent to the upper device and contacts the gate structure of the other lower device.
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