公开(公告)号：EP0614089A3

公开(公告)日：1995-07-12

申请号：EP94102896.1

申请日：1994-02-25

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Bhatt, Anilkumar Ch. ,  Buda, Leo Raymond ,  Edwards, Robert Douglas ,  Hart, Paul Joseph ,  Ingraham, Anthony P. ,  Markovich, Voya Rista ,  Molla, Jaynal A. ,  Murphy, Richard Gerald ,  Saxenmeyer Jr. George J. ,  Walker, George F. ,  Whalen, Bette J. ,  Zarr, Richard S.

IPC分类号： G01R31/28 ,  H01L21/66 ,  G01R1/04

CPC分类号： H01L24/81 ,  G01R31/2886 ,  H01L22/20 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13111 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.

公开(公告)号：EP0614089A2

公开(公告)日：1994-09-07

申请号：EP94102896.1

申请日：1994-02-25

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Bhatt, Anilkumar Ch. ,  Buda, Leo Raymond ,  Edwards, Robert Douglas ,  Hart, Paul Joseph ,  Ingraham, Anthony P. ,  Markovich, Voya Rista ,  Molla, Jaynal A. ,  Murphy, Richard Gerald ,  Saxenmeyer Jr. George J. ,  Walker, George F. ,  Whalen, Bette J. ,  Zarr, Richard S.

IPC分类号： G01R31/28 ,  H01L21/66 ,  G01R1/04

CPC分类号： H01L24/81 ,  G01R31/2886 ,  H01L22/20 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13111 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.

摘要翻译： 公开了半导体芯片的测试方法。 单个半导体芯片具有I / O，电源和接地触点。 在本发明的方法中，提供了一种芯片载体。 芯片载体具有对应于半导体芯片上的触点的触点。 载体触点具有树枝状表面。 芯片触点与芯片载体上的导体焊盘导电接触。 测试信号输入矢量被施加到半导体芯片的输入，并从半导体芯片恢复输出信号矢量。 在测试之后，芯片可以从衬底去除。 或者，芯片可以在成功测试之后通过树枝状导体焊盘粘合到衬底上。