公开(公告)号：EP0631149A1

公开(公告)日：1994-12-28

申请号：EP94107216.7

申请日：1994-05-09

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Anschel, Morris ,  Ingraham, Anthony Paul ,  Lamb, Charles Robert ,  Lowell, Michael David ,  Markovich, Voya Rista ,  Mayr, Wolfgang ,  Murphy, Richard Gerald ,  Pierson, Mark Vincent ,  Powers, Tamar Alane ,  Reny, Timothy Shawn ,  Reynolds, Scott David

IPC分类号： G01R31/28

CPC分类号： G01R31/2863 ,  G01R31/2862 ,  G01R31/287 ,  G01R31/2877 ,  G01R31/2879 ,  G01R31/2886

摘要： A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.

摘要翻译： 公开了半导体芯片的测试方法。 单个半导体芯片具有I / O，电源和接地触点。 在本发明的方法中，提供了一种芯片测试夹具系统。 芯片测试夹具系统具有对应于半导体芯片上的触点的触点。 载体触点具有树枝状表面。 芯片触点与芯片测试夹具系统上的导体焊盘导电接触。 测试信号输入矢量被施加到半导体芯片的输入，并从半导体芯片恢复输出信号矢量。 测试后，将芯片从基板上取下。