公开(公告)号：EP1972010A2

公开(公告)日：2008-09-24

申请号：EP07717691.5

申请日：2007-01-05

Applicant: INTERNATIONAL RECTIFIER CORPORATION

Inventor： HAUENSTEIN, Henning

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/39 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/32057 ,  H01L2224/32503 ,  H01L2224/73153 ,  H01L2224/83101 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/18301 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/29099

Abstract: A substrate on which a silicon device is mounted includes a plurality of protrusions extending upward from a top surface of the substrate and a solder layer formed on the top of the substrate such that the plurality of protrusions extends through the solder layer and a top portion of each protrusion of the plurality of protrusions is stamped down to be level with a top surface of the solder layer such that the silicon device is supported on the plurality of protrusions when placed on the substrate. The protrusions are preferably gouged up from the surface of the substrate with a needle like tool. A stamper tool is used to stamp the protrusions down to their desired height such that they are properly positioned to support the silicon device. The solder layer may be a solder pre-form or may be a layer of solder paste.