公开(公告)号：EP2583318B1

公开(公告)日：2017-11-01

申请号：EP11723032.6

申请日：2011-05-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ZITZLSPERGER, Michael ,  JÄGER, Harald

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

公开(公告)号：EP3018720B1

公开(公告)日：2017-07-26

申请号：EP15193708.3

申请日：2015-11-09

Applicant: LG Innotek Co., Ltd.

Inventor： LEE, Eun Dk ,  OH, Jung Hun

IPC: H01L33/56 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00012

公开(公告)号：EP2573810B1

公开(公告)日：2016-08-17

申请号：EP10851766.5

申请日：2010-05-21

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： OHNO Hirotaka

IPC: C23C24/04 ,  C23C28/00 ,  H01L23/12 ,  H01L23/28 ,  H01L23/48 ,  H01L23/051 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/00

CPC classification number: C23C24/04 ,  C23C28/00 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP3018712A1

公开(公告)日：2016-05-11

申请号：EP13888740.1

申请日：2013-07-05

Applicant: Renesas Electronics Corporation

Inventor： YATO, Yuichi ,  OKA, Hiroi ,  OKUNISHI, Noriko ,  TAKADA, Keita

IPC: H01L23/50

CPC classification number: H01L23/49513 ,  H01L21/565 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49805 ,  H01L23/49844 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/77 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/84205 ,  H01L2224/84439 ,  H01L2224/8501 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/92157 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device according to an embodiment is a semiconductor device in which a semiconductor chip mounted on a chip mounting part is sealed by resin and a first member is fixed to a chip mounting surface side between a peripheral portion of the semiconductor chip and a peripheral portion of the chip mounting part. Also, the first member is sealed by the resin. Also, a length of the first part of the chip mounting part in the first direction is larger than a length of the semiconductor chip in the first direction, in a plan view.

Abstract translation: 根据实施例的半导体器件是半导体器件，其中安装在芯片安装部分上的半导体芯片被树脂密封，并且第一部件被固定到半导体芯片的外围部分与外围部分之间的芯片安装表面侧 的芯片安装部分。 而且，第一部件由树脂密封。 而且，在平面图中，芯片安装部分的第一部分在第一方向上的长度大于半导体芯片在第一方向上的长度。

公开(公告)号：EP2816590A3

公开(公告)日：2015-04-08

申请号：EP14169979.3

申请日：2014-05-27

Applicant: Renesas Electronics Corporation

Inventor： Oyachi, Kenji ,  Wada, Tamaki ,  Morinaga, Yuichi

IPC: H01L23/31 ,  H01L21/48 ,  H01L23/49 ,  H01L23/498 ,  G06K19/077

CPC classification number: H01L24/48 ,  G06K19/07718 ,  G06K19/0772 ,  G06K19/07722 ,  G06K19/07743 ,  G06K19/07745 ,  H01L23/053 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1401 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/83862 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2224/4554

Abstract: A semiconductor device has a base material (BS) comprised of insulating material having a through hole (SH), a terminal (TE) formed on a lower surface of the base material (BS), and a semiconductor chip mounted on an upper surface of the base material in a face-up manner. Further, the semiconductor device has a conductive member (BW) such as a wire, which electrically connects a pad of the semiconductor chip with an exposed surface of the terminal which is exposed from the through hole (SH) of the base material (BS), and has a sealing body (MR) for sealing the conductive member (BW), inside of the through hole (SH) of the base material (BS), and the semiconductor chip. An anchor (SB) means is provided in a region of the exposed surface (EX(TEa)) of the terminal (TE) which is exposed from the through hole (SH) of the base material (BS) except for a joint portion (BL) joined with the conductive member (BW) such as the wire. In this way the adhesiveness between the exposed surface (EX(TEa) of the terminal (TE) is increased so that the reliability of the semiconductor device may be improved.

Abstract translation: 半导体器件具有由绝缘材料构成的基体材料（BS），该绝缘材料具有通孔（SH），形成在基材（BS）的下表面上的端子（TE），以及安装在基材 基材正面朝上。 此外，半导体器件具有诸如导线的导电构件（BW），其将半导体芯片的焊盘与从基底材料（BS）的通孔（SH）暴露的端子的暴露表面电连接， 并且具有用于密封导电部件（BW）的密封体（MR），基体材料（BS）的通孔（SH）内部和半导体芯片。 在从基材（BS）的通孔（SH）露出的端子（TE）的暴露表面（EX（TEa））的区域中设置锚（SB）装置，除了接合部分 BL）与诸如导线的导电构件（BW）连接。 以这种方式，暴露表面（端子（TE）的EX（TE））之间的粘合性增加，从而可以提高半导体器件的可靠性。

公开(公告)号：EP2573810A4

公开(公告)日：2014-04-30

申请号：EP10851766

申请日：2010-05-21

Applicant: TOYOTA MOTOR CO LTD

Inventor： OHNO HIROTAKA

IPC: C23C24/04 ,  C23C28/00 ,  H01L23/00 ,  H01L23/051 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495

CPC classification number: C23C24/04 ,  C23C28/00 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2718875A1

公开(公告)日：2014-04-16

申请号：EP11767755.9

申请日：2011-06-08

Applicant: Linxens Holding

Inventor： LECHLEITER, François

IPC: G06K19/077 ,  H01L21/56

CPC classification number: G06K19/07743 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention relates to a method for manufacturing a card connector or a card comprising the step of depositing layers (31,32,33,34,35) of connector materials onto a substrate (10) so as to form a pattern of contacts (30) for a connector. It also comprises the step of removing the substrate (10) from the pattern of contacts (30) so as to expose the contacts (30). The substrate to be removed (10) is made of conductive material. The method comprises the step of depositing at least one layer (31,32,33,34,35) of the pattern of contacts (30) by electro-deposition by making use of the substrate to be removed (10) as a conductor for electric current used in the electro-deposition. The invention may also comprise the step of overmolding the card body compound, after having mounted and connected a chip to the connector, and before peeling off the substrate.

公开(公告)号：EP2645415A2

公开(公告)日：2013-10-02

申请号：EP13160808.5

申请日：2013-03-25

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Kobayashi, Toshio ,  Shimizu, Hiroshi ,  Kimura, Yasuyuki ,  Kobayashi, Kazutaka ,  Okabe, Toshiyuki

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/49586 ,  H01L21/4828 ,  H01L23/36 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48248 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/207

Abstract: A lead frame includes a plurality of leads (10) defined by an opening (11) extending in a thickness direction. An insulating resin layer (20) fills the opening to entirely cover side surfaces (10C) of each lead and to support the leads. A first surface (10A) of each lead is exposed from a first surface (20A) of the insulating resin layer (20).

Abstract translation: 引线框架包括由沿厚度方向延伸的开口（11）限定的多个引线（10）。 绝缘树脂层（20）填充开口以完全覆盖每个引线的侧表面（10C）并支撑引线。 每个引线的第一表面（10A）从绝缘树脂层（20）的第一表面（20A）露出。

公开(公告)号：EP1905077B1

公开(公告)日：2012-05-23

申请号：EP06766009.2

申请日：2006-07-05

Applicant: NXP B.V.

Inventor： DIMASACAT, Jose, J. ,  TAN, Jerry ,  VANDRIEL, Willem, D.

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49503 ,  H01L23/3107 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27013 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85051 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29075 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semi-conductor device (100) comprises an exposed leadframe (10) with a die pad (11) and a plurality of leads (12). The die pad (11) has a substantially flat bottom surface (14) and a top surface (15). A semi-conductor die (2) is attached to a die attachment portion (31) of the top surface (15). Downbonds (5) connect the die (2) to a downbond attachment portion (32). Standard bonds (4) connect the die (2) to the leads (12). A plastic package (6) encapsulates the die (2), the standard bonds (4) and the downbonds (5). The top surface of the die pad has portions located at different levels, and step-shaped transitions between two adjacent ones of such portions. At least one of such step-shaped transition (36) is located between the die (2) and the downbonds (5). It has been found that such step-shaped transition provides good protection against downbond failure.

Abstract translation: 半导体器件（100）包括具有管芯焊盘（11）和多个引线（12）的暴露的引线框架（10）。 芯片垫（11）具有大致平坦的底面（14）和顶面（15）。 半导体管芯（2）连接到顶面（15）的管芯连接部分（31）。 下键（5）将管芯（2）连接到下键连接部分（32）。 标准键（4）将管芯（2）连接到引线（12）。 塑料包装（6）包封模具（2），标准粘合剂（4）和下粘合剂（5）。 管芯焊盘的顶表面具有位于不同高度的部分，并且在这两个相邻的这些部分之间具有台阶状的过渡。 至少一个这种台阶形过渡部分（36）位于模具（2）和下键（5）之间。 已经发现，这种阶梯状过渡提供了良好的防止下键失效的保护。

公开(公告)号：EP2444999A1

公开(公告)日：2012-04-25

申请号：EP10789561.7

申请日：2010-06-17

Applicant: Rohm Co., Ltd.

Inventor： HAGA, Motoharu ,  YOSHIDA, Shingo ,  KASUYA, Yasumasa ,  NAGAHARA, Toichi ,  KIMURA, Akihiro ,  FUJII, Kenji

IPC: H01L21/60 ,  H01L21/3205 ,  H01L23/29 ,  H01L23/31 ,  H01L23/52

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  B23K20/24 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78307 ,  H01L2224/78309 ,  H01L2224/83 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20757 ,  H01L2924/3512 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/207 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/00015

Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

Abstract translation: 根据本发明的半导体器件包括半导体芯片，由包含铝的金属材料制成并形成在半导体芯片的顶表面上的电极焊盘，设置在半导体芯片的外围的电极引线，具有 线性延伸的主体部分，并且具有焊盘接合部分和引线接合部分，所述引线接合部分形成在所述主体部分的各个端部处并且分别接合到所述电极焊盘和所述电极引线;以及树脂封装，密封所述半导体芯片，所述电极 引线和接合线，接合线由铜制成，并且整个电极焊盘和整个焊盘接合部分由不透水膜一体地覆盖。